Control of Contamination in The Cryostat Rafe Schindler SLAC

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Control of Contamination in The Cryostat

Rafe Schindler

SLAC

Internal Camera Review

October 14, 2008

Philosophy To Control Contamination Starts With

Understanding Each Individual Material Allowed In Cryostat

• Establish A Database of Permissible Materials and How They Must

Be Processed & Stored in Advance of Integration into Cryostat

– Materials Test Facility Provides The Input Data

• Provides outgassing species, outgassing rates (incl. temperature dependence), condensability, evaporability and impact on optical transmission

– Program:

• Study all Potential Materials (eg: NASA Database) & Their Preparation

• Study Coatings for Non-vacuum Friendly Materials

(eg: use of Parylene-C and HT on epoxy and electronics)

• Develop cleaning and handling procedures

• Create Database For Tracking All Components In Cryostat

– Individual materials tests and verification

– Sub-assembly tests and verification

– Tests and verification after shipping but before I&T at SLAC

– Tests during the buildup of the cryostat  no suprises since disassembly and cleaning would be a long process

LSST Internal Review

October 14, 2008

2

Where Are We?

• Material Test Facility Started Commissioning In July

Developing procedure for operating the chambers and protocol for measurements.

– Started making preliminary ROR measurements on some of the critical components:

• circuit board materials,

• epoxies in feedthroughs and connectors,

• effect of Parylene-C coating on adsorption

– Still assembling the cryogenic parts, so we have no data from the

QCM or optical transmission chamber yet.

• Started to Assemble the Database For Measuring Materials and

Tracking All Components In Cryostat

– Ultimately tells you what to expect from each subcomponent in cryostat --- and in particular, during the sub-integrations

3

LSST Internal Review

October 14, 2008

Material Contamination Test Facility Schematic

LSST Internal Review

October 14, 2008

4

Cryostat Material Preparation & Test Facility

Transport arm

“A1”

Heater

Power supplies

Ion pump

RGA-1

“C1”

“C2”

“LL”

RGA-2

Transport arm

Samples Exposed to

50%rh 24 hrs. (

D mass)

Samples Enter in A1

“A3”

Baked & Pumped in C1

Sample moved to C2

Outgasses in C2

Measure Species and

Rate of Rise with RGA vrs temperature

“C3”

Condensable Products

Deposited on cold Quartz

Microbalance

TC and

Instruments Condensible Products deposited on cold optical glass disk

Sample exits thru LL

Wobble stick

Scroll pump

Turbo pump

LSST Internal Review

October 14, 2008

Inert Gas

Delivery Glass disk moves to C3

Light Transmittance versus wavelength thru disk measured in C3

Re-evaporated condensables measured with RGA in C3

Glass disks enter and exit thru A3

5

Rear view

CC Vac gauges

“LL”

RGA units

Quartz

Crystal micro balance unit

LSST Internal Review

October 14, 2008

Turbopump manifold

6

Snapshot: RGA during Outgassing of Polyimide/E-Glass sample at 84 ° C

Rate Of Rise (H

2

O)

& Bkd Curve at 79 0 C water

4x10 -8

9 cm 2 Polyimide E-

Glass Sample

Sample In: H

2

O

1.4x10

-9 Torr/sec

3x10 -8

H

2

2x10 -8

1x10 -8

Empty Chamber: H

2

O

8x10 -12 Torr/sec

N

2

CO

2

2x10 -9

LSST Internal Review

October 14, 2008

400 Seconds

7

Example: Preliminary Test of Epoxy In

Custom Made Douglas Signal Feedthrough*

Outgas rate 55 °C

(torr-liters/sec/cm 2 )

Outgas rate 90 °C

(torr-liters/sec/cm 2 )

H

2

H

2

O

N

2

CO

2

6.2x10

-8

1.6x10

-8

1.7x10

-8

5.6x10

-9

3.7x10

-7

1.4x10

-7

1.5x10

-7

6.7x10

-8

*These Feedthroughs Are on the Back Flange and Operate

Close to Ambient Temperature

Surface area of epoxy Sample : 4.2 cm 2

LSST Internal Review

October 14, 2008

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Example of Sensitivity: Airborn Connector Body

• First Look At Our

Baseline Connector

Body Used Everywhere

--- Between Sensors,

FEE and RCC.

H

2

O

• Shows The Usual H

2

,

H

2

O and N

2 and CO

2

• But Also a set of spikes

– Possibly Sulphur

Dioxide (64+66)

H

2

N

2

CO

2

LSST Internal Review

October 14, 2008

9

Materials Spreadsheet – Started To Build This

LSST Internal Review

October 14, 2008

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Current Vacuum Design of Cryostat

All seals in the cryostat are double

O-ringed with pumpouts

• Divide cryostat into two vacuum regions (i) focal plane &

(ii) everything else

Connect them thru the lowest conductivity seals we can obtain

The GRID, GRID Shrouds, Cryoplate and FEE run at coldest temperatures.

The sensor surface is 10

20 0 C warmer than almost everything around it

– except L3. Its temp. is controlled by the raft-tower makeup heaters.

• Focal plane region sees L3, colder

GRID walls, GRID Shroud and the pumping chimneys. A 400l/sec TMP at rear gives ~130 l/sec at CCD’s

Everything else (BEE, Cables, MLI) is pumped by 2 nd TMP at ~400 l/sec

LSST Internal Review

October 14, 2008

11

Cryostat Vacuum System Design

Pump path

Conductance: 195 l/sec

Eff. Pump speed: 130 l/sec

F.P. chimney connects front end vacuum region to pumping plenum — this is attached to the Cryo Plate

400 l/sec turbo pump

Sheet metal F.P. pumping plenum drops into Feedthrough Plate

LSST Internal Review

October 14, 2008

12

Cooldown/Warmup

The CCD surface should never be the coldest surface in the cryostat

During operation The CCD sensors will always be warmer (~10 0 C) than the surrounding materials that are most likely to outgas (FEE electronics, connectors, and cables)

• Before cooldown we envisage a long period of N

2 flushing the cryostat and pumping (at somewhat elevated temperatures) to reduce H

2

0 in the cryostat.

Additional pumping capacity during the initial pumpdown might be used.

Cooldown requires the Cryo plate be cooled with the FEE off but the makeup heaters on -- to keep the CCDs warmer than the FEE and GRID. We cool only within the allowed “survival range” of the FEE, before turning them on…and completing the cooldown.

If FEE electronics in a tower fails, the CCD & Raft Plate temperature drifts down in the tower. The makeup heaters should be adequate (and redundant) to avoid the CCD being over-cooled

LSST Internal Review

October 14, 2008

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What Else ?

• All material will be vacuum baked and stored in inert atmosphere prior to I&T. During I&T we will work in as dry/inert an atmosphere as is safe.

• We are selecting, processing and coating materials in the cryostat to reduce the uptake of H

2

0, CO/CO

2 during assembly and the subsequent desorption during operation

• Assuming we can reduce or eliminate all materials that produce other heavier condensables or contaminants that react chemically with the optical coatings, we will still be left with some residual slow - desorption of the usual condensibles molecules onto the focal plane. (Water etc…..)

• We are looking into the use of more passive pumping in the focal plane region to provide backup to the TMP’s, and/or mitigate the need to run them during observing.

LSST Internal Review

October 14, 2008

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Options

• Two Options Exist:

– “cold” evaporable getters that trap gases (zeolytes and charcoals)

Need to be tied to the GRID or Cryo-Plate

– Problem of containment and dusting in FP region

(eg: people have used 0.2 m m PTFE mesh)

Desorption during warmup

– need temp. control, isolatation or pumped

– “warm” non-evaporable getters that chemically break down gases

(NEG Pumps)

– commonplace in accelerators and electronics packaging

– Need to be kept “warmer” for better performance:

…. Eg: tied to the cryostat wall

• Both Options have (not insurmountable) problems

– Space in cryostat Focal Plane region

– Access to insert and replace materials near focal plane

• We want to understand from our materials testing, what we really will need, but are looking into these other options in parallel

LSST Internal Review

October 14, 2008

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Example: Small SAES NEG Pump

LSST Internal Review

October 14, 2008

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A VERY OLD ESTIMATE OF OUTGASSING RATES

BASED ON EARLIER DESIGN AND MATERIALS

ZONE MATERIALS

Metals/Glass/ Ceramic

Focal

Plane Coated PCB's/ Plastics

Metals/Glass/ Ceramic

GRID and

FEE Super Insulation

Cu Thermal Straps

Coated PCB's/ Plastics

BEE Metals/Glass/ Ceramic

Super Insulation

Coated PCB's/ Plastics

EXPOSED

AREA

OUT GASSING m 2

4.7

0.89

18

10 -6 Torr-L/sec

907

3

10602

263

11280

7.9

12

178

7.3

LSST Internal Review

October 14, 2008

293

122

5761

0.28

220

2468

PRESSURE

(10 Hrs @500 L/s)

Torr

1.8E-06

3.4E-05

5.4E-06

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PICTURES

C1 inside view

Samples come in from A1 on mag.

transport arm

Heaters (2)

Samples proceed to C2

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LSST Internal Review Thermocouples (2)

C2 inside view

RGA

Samples enter from C1

Cold strap

Glass disk stage

Quartz balance

(crystal is under stage)

Heaters (2)

Sample boxes enter and exit thru A2

“Wobble stick”

Sample box

LSST Internal Review

Thermocouples (3) refrigerant loop

Glass disks come in from C3 clean and go back dirty

20 platform

C3 inside view

To C2

Refrigerant loop

Cold strap

Cold strap bent down in “U” to allow motion

Actuator piston moves basket back and forth

Thermocouple (1)

Glass disks come in and go out thru A3

Light beam comes up thru bottom, passes thru disks and is detected above

LSST Internal Review

October 14, 2008

“wobble stick” double glass disk stage

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Glass Disk Holder and Sample Box

Glass Disk Holder

(clamps glass and sits snuggly in baskets)

LSST Internal Review

October 14, 2008

Sample box

(sliding lid and

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2 holes for outgassing)

Optical setup overview

Beam goes through glass disks in C3

Repeated with each of 6 band passes:

- 400 nm

- 500 nm

- 600 nm

- 750 nm

- 850 nm

- 1000 nm LSST Internal Review

October 14, 2008 detector diode mounted here

Light source

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Optical setup box

TO C3 aperture

Beam splitter

Reference diode

LSST Internal Review

October 14, 2008

Filter wheel

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Final picture: some peripherals

Vacuum oven 50% RH environment microbalance

LSST Internal Review

October 14, 2008

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INSTRUMENTATION FOR 3 rd OPTICAL TRANSMISSION CHAMBER

Contaminated & Reference Samples Moved (Cold) From 2 nd Chamber

White Light  Monitor Diode & Window  Filter Wheel (LSST)  Cold Sample

Slide or Uncontaminated Slide  Window  Precision Photodiode/PM. Diode

Temporal Stability of Light Source Calibrated Out Using Monitor Diode

Piston Moves Samples Back & Forth In Vacuum Thru Same Optical Path to

Interleave Measurements (Avg. Out Instabilities in Light Output & Light Path)

Observe <0.1% sensitivity: comparable to photometric target

LSST Internal Review

October 14, 2008

Measurements

Sequenced By

Computer (~0.1 Hz) and Recorded and

Analyzed

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RESULTS FROM TESTS OF OPTICAL TRANSMISSION

CHAMBER

400nm 500nm 600nm

750nm 850nm 1000nm

0.02%

DISTRIBUTION OF MEANS OF 120 EXPERIMENTS

(@1000 samples) TAKEN OVER ~20 MINUTES

ERROR AS A PERCENT OF MEAN (DURING 20min)

LSST Internal Review

October 14, 2008

TARGET < 0.1%

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