HIGH-SPEED VLSI TESTING WITH SLOW TEST EQUIPMENT Available automatic test equipment (ATE) speed is 100200MHz; VLSI chip speed is 0.5-1GHz. Expensive to replace the existing ATE. Besides, chip speed remains an advancing target. Existing delay test solutions insert hardware into chip • Scan method has limited path activation capability • Built-in self-test (BIST) uses random vectors that often activate non-functional paths Problem: Develop a delay test method for slow ATEs that will give similar path coverage as obtained with an atspeed ATE • Add no test hardware to chip • Test only functional paths June 10, 2001 High-speed test 1 A NEW METHOD Given a vector-set with specific at-speed PDF coverage, the ATE repeats the slow-speed test N times, where N is the ratio of chip-speed to the ATE-speed. In each slow-speed vector application • Flip-flops are clocked at the rated high-speed • Output monitoring instant is advanced by an additional interval that equals rated high-speed clock period Test application time = N Slow vector application, N=4 Vector i i+1 x (test time of at-speed ATE) Slow output monitoring repeated N times PI CK Rated-clock generated by pin-multiplexing June 10, 2001 2 Sequential circuit under test (gates and flip-flops) PO Appln. 1 Appln. 2 Appln. 3 Appln. 4 High-speed test 2 SOME RESULTS OF NEW METHOD 1. Simulated Benchmark circuits (ISCAS’89) Path delay fault Coverage (%) 50 40 At-speed ATE S510 : 5,000 random vectors S5378 : 5,000 random vectors Slow ATE Slow ATE (N=2, 3, 4) gives the same path coverage as at-speed ATE (N=1). 30 20 10 1 2 3 4 ATE slowdown factor (N) 2. A 4MHz off-the-shelf chip tested on Agilent 82000 ATE N=1 (at-speed) N=2 (Half-speed) N=4 (1/4 speed) 4.367 MHz 3.937 3.922 MHz* than those tested MHz*by at-speed test. * Some tested paths are longer June 10, 2001 High-sped test 3