Micro-EDM of sintered diamond 班級:碩研機械一甲 姓名:田正雨 M9810213

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Micro-EDM of sintered diamond

班級:碩研機械一甲

姓名:田正雨

學號: M9810213

Introduction(1/2)

• excellent hardness and very low frictional wear

• machine SD(Sintered diamond) with high precision by conventional methods such as cutting and grinding

Introduction(2/2)

• Since SD contains metal as binder , it is electrically conductive

• Micro-EDM, its ability to machine regardless of the hardness of the workpiece

• four types of SD, composed of 1, 3, 10 and 20 μm diamond particles

Experiments(1/3)

• Panasonic MG-ED72 micro-EDM machine, WEDG,

50μm-diameter cylindrical electrodes( tungsten )

• Binder (cobalt) , approximately 5%

• Tungsten carbide alloy was also tested for comparison

Experiments(2/3)

• Hole machining :

• Discharge capacitance was 100 pF , and the opencircuit voltages were 100, 80, and 60 V

• measured the machining time , the electrode wear , and the side gap

Experiments(3/3)

• Trench machining :

• The size of the trenches : 50 μ m (width) × 4 mm

(length) × 30 μm (depth)

• 100v, 3300 pF( rough ), 100 pF( medium ) and stray capacitance(10pF, finish machining )

• surface roughness at the bottom of the trenches

Results and discussion _

Hole machining(1)

• Shape of machined holes :

• There is no significant difference of size and roundness among all holes

• This fact suggests that precision and micro EDM of

SD is practical

Ø 50μ m, 100 V and 100 pF

Results and discussion _

Hole machining(2)

• Machining speed :

• 20 μ m at 60 V and 80 V could not be machined : electrode wear was so large

• Machining speed, SD and tungsten carbide alloy : No significant difference Volmetric machining speed

Results and discussion _

Hole machining(3)

• Machining speed :

• 100V 、 80V, machining speed apparently decreases : debris

• The same phenomenon : 3 μ m ,

BUT, 10 μ m and 20 μ m appears to be constant diamond particle :

Debris influence :

Results and discussion _

Hole machining(4)

• Electrode wear

• The wear ratio : tungsten carbide < SD

• Machining speed :

Electrode wear :

Results and discussion _

Hole machining(5)

• Side gap

• There is no apparent correlation between diamond particle size and side gap

Results and discussion _

Trench machining(1)

• Surface roughness : discharge capacitance : the surface roughness :

Results and discussion _

Trench machining(2)

• Observation of machined surface(By SEM) diamond particles are small : can be removed diamond particles are large a part of particles craters

Same craters

Conclusions(1/2)

• Round Ø 50 μ m micro holes were proved, 1–20 μ m

• Electrode wear ratio appeared to have a strong correlation with machining speed

• Side gap not have apparent correlation with diamond particle size .

Conclusions(2/2)

• There is no significant difference in machining speed between SD and tungsten carbide

• A surface roughness of approximately 0.13 μ m

Ra was achieved for trench machining.

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