Procedure – CVC Sputter Tool
DC Sputter of AL
Preparation
Verify cryopump is at temperature. Temperature should be below 18K on CTI temperature
indicator.
Loading
1. Verify pressure control valve is in open position.
2. Close hi-vac valve V3. Switch is located on automatic valve control panel.
3. Vent chamber with switch V4. Switch is located on automatic valve control panel.
4. Raise chamber lid. Toggle switch is located on left of tool, just below chamber.
5. Load substrates. Use adapters if necessary.
Pump Down
1. Close chamber lid.
2. Verify hi-vac valve V3 is CLOSED. Switch is located on automatic valve control panel.
3. Open roughing valve V1. Switch is located on automatic valve control panel.
4. Allow chamber to pump down to .050 torr as shown on the gauge on automatic valve control
panel.
5. Close roughing valve V1.
6. Open hi-vac valve V3.
7. Push on ion gauge. Ion gauge is located at the top of the control rack.
8. Allow chamber to reach 2 x 10-6 torr as shown on ion gauge. Record pressure in log book.
Sputtering
1. Close pressure control valve.
2. Turn on Argon gas at Gas Flow Control box (Channel 1)
3. Open gas inlet toggle valve located just below chamber.
4. Read and record Argon gas flow in log book. Typical is 30 sccm.
5. Turn on pirani gauge to “leak rate” position, read and record pressure. Typical is 3-4 millitorr.
6. Turn on motor speed control (substrate rotation).
7. Turn on DC power supply.
8. Adjust power to required levels. Typical is 3.2-34.0 KV, 0.5-1.0A
9. Record required information in log book.
10. When time is complete, turn ofgf DC power supply.
11. Turn off Argon at Gas Flow Control box.
12. Close gas inlet toggle valve.
13. Open pressure control valve.
14. Turn on ion gauge and allow chamber to pump to 4x10-6 torr as shown on ion gauge.
Unloading
1. Close hi-vac valve V3. Allow hi-vac valve V3 to close completely before going to the next step.
2. Turn on vent valve V4.
3. Allow chamber to reach atmosphere as shown on the vacuum gauge on the automatic valve
control panel.
4. Flip toggle to “raise chamber lid”. Chamber lid will open once pressure is equalized.
5. Unload substrates.
6. Go to pump down section to pump down chamber. Chamber should always be under vacuum
when not in use.
07/02/16 Rev NC by John Hudak
Procedure – CVC Sputter Tool
DC Sputter of AL
07/02/16 Rev NC by John Hudak
Procedure – CVC Sputter Tool
DC Sputter of AL
07/02/16 Rev NC by John Hudak
Procedure – CVC Sputter Tool
DC Sputter of AL
07/02/16 Rev NC by John Hudak