48.8mW Multi-cell InP HBT Amplifier with on-wafer power combining at 220GHz Thomas Reed, Mark Rodwell University of California, Santa Barbara Zach Griffith, Petra Rowell, Miguel Urteaga, Mark Field, Jon Hacker Teledyne Scientific & Imaging, LLC treed@ece.ucsb.edu 220 GHz InP HBT Power Amplifier mm-Wave Power in Communications and Imaging 250nm Indium Phosphide HBT Technology MMIC Power Amplifier Cells & Combiners Multi-cell Power Amplifier Results 2 Thomas Reed UCSB CSICS M.4 10/19/2011 mm-Wave Power in Communications and Imaging 3 Thomas Reed UCSB CSICS M.4 10/19/2011 Systems at High Frequency High Bandwidth Communications 2 PRec decreases as R2 Wiltse, 1997 IEEE APSSymposium, High Resolution Imaging Systems 4 PRec decreases as R4 220 GHz Tx/Rx Challenges: Atmospheric Attenuation ~2.5 dB/km @ 220 GHz +3-30dB/km w/ Fog/Rain High Noise Figure ~10 dB(InP) 4 sea level 4 km 9 km Thomas Reed UCSB CSICS M.4 10/19/2011 mm-Wave Comm. requires large power Minimum Received Power Prec, min kTFBQ 2 Prec, min 173.8dBm/H z 10dB(NF) 90dB(1Gbps ) 3dB(Q 2 ) 70.8dBm Transmission Losses 300m 2 Prec λ e-αR G t G r 1dB 20dBi 20dBi 139dB 100dB Pt 4R Minimum Transmitted Power 29.2 dBm = 0.83 W Pt 29.2dBm 0.83W ... 5 PA LNA ... Thomas Reed UCSB CSICS M.4 10/19/2011 mm-Wave PA Results 35 Reed, et al. InP HBT InP HEMT Other InP HBT GaN 30 20 15 P out (dBm) 25 10 5 0 80 90 100 200 300 Frequency (GHz) 6 Thomas Reed UCSB CSICS M.4 10/19/2011 250nm InP HBT Process 7 Thomas Reed UCSB CSICS M.4 10/19/2011 Device High Performance Operating Area 2 70 10.0 I b,step = 0.30mA 60 50 8.0 c = 24m I (mA) Jmax = Vbe,on = 0.85V VBcbo = 4.5V Pmax = 15mW/um2 Vce,hf = 3V high bandwidth 250nm, 4-finger HBT, L e,tot Je (mA/m2) 12.0 12mA/um2 2 10mW/m 15mW/m 40 6.0 30 4.0 20 2.0 10 0.0 0 0 1 2 3 4 5 V (V) ce Data courtesy Zach Griffith Quiescient Bias Point/ Class A load line 8 Thomas Reed UCSB CSICS M.4 10/19/2011 ƒt,ƒmax varies with DC Bias ft/fmax peak = 400/700 GHz 12 384,435 f ,f max Highly degraded bandwidth above Vce=3V e ft/fmax = 350/590 GHz 431,730 f ,f max 2 J (mA/m ) 10 8 398,716 f ,f max 345,650 f ,f max 6 275,550 f ,f max 4 217,452 f ,f max 175,384 f ,f max 2 124,290 f ,f max 0 0 1 2 3 V (V) 4 Reference units, GHz ce 9 Thomas Reed UCSB CSICS M.4 5 10/19/2011 Multi-finger HBT Modeling Device Modeling Emitter Hole in Ground Plane Base Multi-finger HBT performance verified 4-finger HBT Aemitter= 4x 0.25x6μm2 Collector ft/fmax = 333/530GHz Ground Plane 1-finger HBT ft/fmax = 350/590GHz Another 4-finger cell 10 Thomas Reed UCSB CSICS M.4 10/19/2011 Non-Inverted Microstrip Wiring Local GND Wider 50Ω than inv. microstrip Must Model Holes in GND plane MIM Capacitors, Thin-Film Resistors 50 Ω Metal 4 1µm 15µm BCB 1µm 5µm Metal 3 (εr = 2.7) BCB Metal 2 BCB MIM CAP GND 11 Thomas Reed UCSB Metal 1 CSICS M.4 10/19/2011 MMIC Power Amplifier Cells & Combiners 12 Thomas Reed UCSB CSICS M.4 10/19/2011 MMIC Power Amplifier Cell Design Cascode Amplifier Topology Gain, Input/Output Isolation, Interconnects: ADS Momentum 2 2 10mW/m 15mW/m 12.0 ΔV 250nm, 4-finger HBT, L 10.0 I b,step 70 = 0.30mA 60 50 8.0 c ΔI 6.0 40 30 4.0 20 2.0 10 0.0 0 0 1 2 3 4 5 V (V) ce ΔV 2V 111/finger ΔI 18mA High Zo MIM 13 Thomas Reed UCSB CSICS M.4 10/19/2011 I (mA) Je (mA/m2) = 24m e,tot A 4-finger Amplifier Cell 14 Thomas Reed UCSB CSICS M.4 10/19/2011 A 4-finger Amplifier Cell DC Supplies CE 15 CB λ/4 Chokes Thomas Reed UCSB CSICS M.4 10/19/2011 A 4-finger Amplifier Cell Input Matching Output Tuning DC Block Bypass Cap 16 Thomas Reed UCSB CSICS M.4 10/19/2011 Combining for High MMIC Power Combine 4:1 and 2:1 for larger total power Limits to combiners 17 Large IL at L ≥ λg/4 Thomas Reed UCSB CSICS M.4 10/19/2011 2:1 Power Combiner √2 * Zo L = λ/4 Zo √2 * Zo Cell Measured 1.25dB insertion loss for Back-to-back Combiners S-Parameters (dB) 0 Combiner -5 -10 -15 -20 -25 S11 Measured -30 S21 Measured -35 -40 200 220 240 260 280 300 320 340 Frequency (GHz) 18 Thomas Reed UCSB 2-Cell Power Amplifier with 2:1 power combining. The die is 0.7x0.58 mm2. CSICS M.4 10/19/2011 4:1 Power Combiner Cell Reduced to Lumped L/C for design Combiner Measured 1.3 dB Insertion Loss for Back-to-back 4:1 power Combiners. 4-cell InP HBT amplifier with 4-1 power combiners. The die is 0.7x0.65 mm2. 19 Thomas Reed S-parameters (dB) 0 -5 -10 S21 Measured S21 Simulated -15 200 220 240 260 280 300 320 340 Frequency (GHz) UCSB CSICS M.4 10/19/2011 48.8 mW 4-finger Power Amplifiers 20 Thomas Reed UCSB CSICS M.4 10/19/2011 MMIC Measurements and Data Small Signal Measurement VNA with 206-340 GHz frequency extender heads SOLT calibration for circuits Power Sweep Measurement 200 & 220 GHz frequency multiplier chains and sub-mm wave power meter Insertion Loss Calibration VDI Source 21 Thomas Reed UCSB To Meter CSICS M.4 10/19/2011 P out (dBm) 2-Cell PA Results 14 2-Cell HBT Power Amplifier 12 10 LL1, P = 26.3mW 8 LL2, P = 23.7mW 6 LL3, P = 20.3mW ΔV = 2, 2.5, 3V 4 2 Operating frequency = 208GHz 0 -10 -5 0 5 10 P (dBm) S21=10.9 dB @ 220GHz Pout,max=26.3mW @ 208GHz out,max out,max out,max in 10 S-parameters (dB) S-parameters (dB) 15 5 0 -5 -10 S21 Measured S21 Simulated -15 -20 200 220 240 260 280 300 320 340 Frequency (GHz) 22 5 0 -5 -10 -15 -20 S11 Measured S11 Simulated -25 S22 Measured S22 Simulated -30 -35 200 220 240 260 280 300 320 340 Frequency (GHz) Thomas Reed UCSB CSICS M.4 10/19/2011 4-Cell PA Results S21 = 10.1 dB @ 220 GHz Pout ≈ 48mW @ 210-220GHz 10 S21 Measured S21 Simulated 5 0 -5 -10 -15 4-Cell HBT Power Amplifier 23 (mW) out P out P -10 12 11 P = 48.8mW 10 out 9.0 P out 8.0 Gain 7.0 6.0 5.0 Operating frequency = 220GHz 4.0 -5 0 5 10 15 P (dBm) 55 49.7mW 50 P 45 out 40 5.1dB 35 30 25 20 205 210 8.0 47.9mW 48.8mW 6.2dB Thomas Reed UCSB 6.0 40.2mW 5.0 3.7dB 4.2dB 32.1mW 4.5dB Gain 215 220 225 Frequency (GHz) in 7.0 CSICS M.4 10/19/2011 4.0 3.0 2.0 230 Gain (dB) 18 16 14 12 10 8 6 4 2 Gain (dB) (dBm) -20 200 220 240 260 280 300 320 340 Frequency (GHz) 5 0 -5 -10 -15 -20 S11 Measured -25 S11 Simulated S22 Measured -30 S22 Simulated -35 200 220 240 260 280 300 320 340 Frequency (GHz) SParameters (dB) SParameters (dB) 15 . 8-Cell Power Amplifiers Pout = 66.1mW @ 215 GHz S21,max = 9.1dB @ 217 GHz 3dB Bandwidth 206-242GHz Measured Pout limited by 220GHz source power S-parameters (dB) 10 S21 0 S22 -10 -20 -30 S11 8-Cell Amplifier -40 200 220 240 260 280 300 320 340 Frequency (GHz) 8.5 8.0 15 P = 58.4mW 7.5 P out 10 7.0 6.5 5 Gain 6.0 0 5.5 Operating frequency = 220GHz 5.0 -5 -10 -5 0 5 10 15 P out out P (dBm) in 24 Thomas Reed UCSB CSICS M.4 10/19/2011 Gain (dB) (dBm) 20 8-Cell HBT Power Amplifier Linear Power Density Pout, amp 48.8mW Pout,cell Pout, finger Pout, amp 4cells Pout, cell 12.2mW 4fingers 3.05mW Pout, finger W Linear Power Density 0.51 6 m mm InP HBT process is a competitive high power-density technology. 25 Thomas Reed UCSB CSICS M.4 10/19/2011 Recapitulation Modular amplifier cells have been designed to have high gain and high output power. 4-cell amplifiers show 48.8 mW saturated output power at 220 GHz using InP HBTs. 8-cell amplifiers show 58 mW output power at 220 GHz but measurements were limited by source power. 26 Thomas Reed UCSB CSICS M.4 10/19/2011 THANK YOU! CSICS Technical Committee Zach Griffith, Mark Rodwell, and Mark Field UCSB Rodwell Group Members DARPA MTO HiFive Program 27 Thomas Reed UCSB CSICS M.4 10/19/2011 Questions? 28 Thomas Reed UCSB CSICS M.4 10/19/2011 Bonus Slides 29 Thomas Reed UCSB CSICS M.4 10/19/2011 mm-Wave Power Amplifiers Current Power Amplifier Results Fab Author Paper Journal/Conference Raytheon UCSB Brown, A. Reed, T. UCSB Reed, T. NGST Radisic, V. W-band GaN amplifier MMICs 66.1 mW InP HBT Power Amplifier 48.8 mW Multi-cell InP HBT Amplifier with on-wafer power combining at 220 GHz A 50mW 220GHZ Power Amplifier Module NGST Huang, P.P. A 20mW G-band monolithic driver amplifier using 0.07-um InP HEMT IEEE MTT-S 2006 UCSB Paidi NGST Deal, W.R. NGST Chen, Y.C. UCSB Reed, T. NGST Mei, X.B. NGST Deal, W.R. 30 G-band (140-220GHz) and W-band (75-110GHz) InP DHBT medium power amplifiers Development of Sub-MillimeterWave Power Amplifiers A 95-GHz InP HEMT MMIC amplifier with 427-mW power output 3.0 mW Common Base Power Amplifier with 3 dB Small Signal Gain at 221 GHz in InP DHBT Technology Sub-50nm InGaAs/InAlAs/InP HEMT for sub-millimeter wave power amplifier applications A balanced sub-millimeter wave power amplifier Key Black – GaN Red – InP HEMT Green – My InP HBT Results Yellow – Other InP HBT Results IMS 2011 * Not Published Yet Pout (dB) vs. Freq (GHz) 35 CSICS 2011 IMS 2010 IEEE Trans. Microwave Theory Tech Feb 2005 IEEE Trans. Microwave Theory Tech Dec 2007 IEEE Microwave and Guided Wave Letters Nov 1998 Lester Eastman Conference 2010 30 25 20 15 10 IPRM 2010 IMS Digest 2008 Thomas Reed 5 0 30 UCSB 300 CSICS M.4 10/19/2011 Collector Metal Ground Extension DC Blocking Capacitors Ground Plane Ground Plane hole Large enough to represent a short at 220GHz. Blocking Caps create a hole in the ground plane DC Block Cap Inductance (Think Slot Antenna) Port 1 Port 2 Port 1 Metal 2 Metal 2 MIM CAP GND Metal 1 GND Collector Metal 31 Thomas Reed UCSB CSICS M.4 10/19/2011 Port 2 System Components at High Frequency High Frequency LNAs 94 GHz InP mHEMT: 3dB NF 150-215 GHz InP HBT: 5-12dB NF (J. Hacker, et al. THz MMICs based on InP HBT Technology. IMS 2010.) 670 GHz InP HEMT: 13dB NF 32 (Samoska, L. Towards Terahertz MMIC Amplifiers: Present Status and Trends. MTT-S 2006.) 300 GHz InP HBT LNA: 11.2dB NF (Mikko Karkkainen, et al. Coplanar 94 GHz Metamorphic HEMT Low Noise Amplifiers. CSICS 2006.) (Deal, W.R., et al. Low Noise Amplification at 0.67 THz Using 30nm InP HEMTs. Microwave and Wireless Components Letters July 2011.) Thomas Reed UCSB CSICS M.4 10/19/2011 Rain, Fog, & Humidy Reduce Range and Reliability rain 50 mm/hr: 20 dB/km, 30-1000 GHz 150 mm/hr : 50 dB/km, 30-1000 GHz Clouds, heavy fog: ~(25 dB/km)x(frequency/500 GHz) 90% Humidity: >30 dB/km above 300 GHz nondominant below 250 GHz (Rosker 2007 IEEE IMS) Manabe, Yoshida, .1993 EEE Int. Conf. on Communications, tropical deluge heavy rain very heavy fog Liebe, Manabe, Hufford, IEEE Trans Antennas and Propagation, Dec. 1989 rain Olsen, Rogers, Hodge, IEEE Trans Antennas & Propagation Mar 1978 33 Thomas Reed UCSB CSICS M.4 10/19/2011 MMIC Measurements and Data “Load Pull” Station Power Sweep using VDI 200 GHz and 220GHz Multiplier Chain Calorimeter—Erickson submm wave power meter Calibration 34 VDI Source To Meter Above Photo Courtesy Zach Griffith Insertion Loss calibration with the reference plane at the probe tips Waveguide flange to probe tip insertion loss ~1.7dB Thomas Reed UCSB CSICS M.4 10/19/2011