Lecture 8 OUTLINE • Metal-Semiconductor Contacts (cont’d) – Current flow in a Schottky diode – Schottky diode applications – Small-signal capacitance – Practical ohmic contacts Reading: Pierret 14.2-14.3; Hu 4.17-4.21 Voltage Drop across the M-S Contact • Under equilibrium conditions (VA = 0), the voltage drop across the semiconductor depletion region is the built-in voltage Vbi. • If VA 0, the voltage drop across the semiconductor depletion region is Vbi - VA. EE130/230M Spring 2013 Lecture 8, Slide 2 Depletion Width, W, for VA 0 Last time, we found that V x qN D W x 2 2K S 0 At x = 0, V = - (Vbi - VA) 2 s (Vbi VA ) W qN D • W increases with increasing –VA • W decreases with increasing ND EE130/230M Spring 2013 Lecture 8, Slide 3 W for p-type Semiconductor V x qN A W x 2 2 K S 0 p-type semiconductor At x = 0, V = Vbi + VA 2 s (VA Vbi ) W qN A • W increases with increasing VA • W decreases with increasing NA EE130/230M Spring 2013 Lecture 8, Slide 4 Current Flow FORWARD BIAS REVERSE BIAS EE130/230M Spring 2013 • Current is determined by majority-carrier flow across the M-S junction: o Under forward bias, majoritycarrier diffusion from the semiconductor into the metal dominates o Under reverse bias, majoritycarrier diffusion from the metal into the semiconductor dominates Lecture 8, Slide 5 Thermionic Emission Theory • Electrons can cross the junction into the metal if 1 2 K.E. x mvx qVbi VA 2 2q Vbi VA vx vmin * mn • Thus the current for electrons at a given velocity is: I s M , v x qAvx n(vx ) • So, the total current over the barrier is: v min I s M qA v n(v )dv x EE130/230M Spring 2013 Lecture 8, Slide 6 x x Schottky Diode I - V For a nondegenerate semiconductor, it can be shown that 4kTmn*2 E E / kT m* / 2 kT v 2 F c n x n v x e e 3 h We can then obtain 4qmn* k 2 2 F / kT qV / kT I S M AT e e 3 h mn* 2 F / kT qV / kT AJ S e , where J S 120 T e A/cm 2 m0 In the reverse direction, the electrons always see the same barrier FB, so I M S I S M VA 0 B A A Therefore B I I S (e qVA / kT 1) where I S AJ S EE130/230M Spring 2013 Lecture 8, Slide 7 Applications of Schottky Diodes • IS of a Schottky diode is 103 to 108 times larger than that of a pn junction diode, depending on FB . Schottky diodes are preferred rectifiers for low-voltage, high-current applications. Block Diagram of a Switching Power Supply EE130/230M Spring 2013 Lecture 8, Slide 8 Charge Storage in a Schottky Diode • Charge is “stored” on both sides of the M-S contact. – The applied bias VA modulates this charge. EE130/230M Spring 2013 Lecture 8, Slide 9 Small-Signal Capacitance • If an a.c. voltage va is applied in series with the d.c. bias VA, the charge stored in the Schottky contact will be modulated at the frequency of the a.c. voltage displacement current will flow: CA EE130/230M Spring 2013 s W Lecture 8, Slide 10 dva iC dt Using C-V Data to Determine FB CA s W A s 2 s Vbi VA qN D qN D s A 2Vbi VA 1 2(Vbi VA ) 2 C qN D s A2 Once Vbi and ND are known, FBn can be determined: qVbi F Bn ( Ec EF ) FB F Bn EE130/230M Spring 2013 Lecture 8, Slide 11 Nc kT ln ND Practical Ohmic Contact • In practice, most M-S contacts are rectifying • To achieve a contact which conducts easily in both directions, we dope the semiconductor very heavily W is so narrow that carriers can “tunnel” directly through the barrier EE130/230M Spring 2013 Lecture 8, Slide 12 Tunneling Current Density Band Diagram for VA0 Equilibrium Band Diagram W 2 sF Bn qN D qVbiFBn Ec, EFS EFM q(Vbi-VA) EFM Ec, EFS Ev tunneling probabilit y P e Ev H ( F Bn VA ) where H 4 s m / h 5.4 10 * n 9 J S M qPN D vthx qN D kT / 2m e * n EE130/230M Spring 2013 Lecture 8, Slide 13 ND * n m / mo cm 3/2 H ( F Bn V A ) / N D V 1 Example: Ohmic Contacts in CMOS EE130/230M Spring 2013 Lecture 8, Slide 14 Specific Contact Resistivity, rc • Unit: W-cm2 – rc is the resistance of a 1 cm2 contact • For a practical ohmic contact, rc e HF B / N D want small FB, large ND for small contact resistance Rcontact EE130/230M Spring 2013 rc Acontact Lecture 8, Slide 15 Approaches to Lowering FB • Image-force barrier lowering F q N a N = dopant concentration in surface region FBo F s 4 a = width of heavily doped surface region EF Ec metal n+ Si Very high active dopant concentration desired • FM engineering – Impurity segregation via silicidation A. Kinoshita et al. (Toshiba), 2004 Symp. VLSI Technology Digest, p. 168 – Dual ( low-FM / high-FM ) silicide technology • Band-gap reduction – strain A. Yagishita et al. (UC-Berkeley), 2003 SSDM Extended Abstracts, p. 708 C. Ozturk et al. (NCSU), – germanium incorporation M. 2002 IEDM Technical Digest, p. 375 EE130/230M Spring 2013 Lecture 8, Slide 16 Voltage Drop across an Ohmic Contact • Ideally, Rcontact is very small, so little voltage is dropped across the ohmic contact, i.e. VA 0 Volts equilibrium conditions prevail EE130/230M Spring 2013 Lecture 8, Slide 17 Summary • Charge is “stored” in a Schottky diode. – The applied bias VA modulates this charge and thus the voltage drop across the semiconductor depletion region The flow of majority carriers into the metal depends exponentially on VA I AJ S (e qVA / kT 1) mn* 2 F B / kT where J S 120 T e A/cm 2 m0 small-signal capacitance C A EE130/230M Spring 2013 s W Lecture 8, Slide 18 W 2 s (Vbi VA ) qN D Summary (cont’d) EF Ec Ec Ev EF EF Ev Ec EF Ev Ec Ev Since it is difficult to achieve small FB in practice, ohmic contacts are achieved with heavy doping, in practice: EF EE130/230M Spring 2013 Ec Ec Ev EF Lecture 8, Slide 19 Ev Summary of Key Points • Schottky barrier height: – Energy barrier that must be surmounted in order for a carrier in the metal to enter the semiconductor • Built-in potential: FBn-(EC-EF)FB for n-type S, FBp-(EF-Ev)FB for p-type S – Ideally is equal to the work function difference between M and S • But in practice (for Si) FBn (2/3)EG and FBp (1/3)EG • In equilibrium the flow of carriers from M to S (IMS) equals the flow of carriers from S to M (ISM) • Under forward bias ISM increases exponentially and dominates • Under reverse bias ISM decreases exponentially so that IMS (which is independent of VA) dominates * qV m I I S e kT 1 where I S 120 AT 2 e F / kT m0 A B