Low-Profile Power Inductors
HALOGEN
HF
Pb
FREE
SD6030 Series
Applications
SMD Device
• Notebook computers, digital cameras • Gaming consoles, GPS receivers
• Wireless notebook adapters
• High Power LED driver
• Battery power, TFT-LCD Bias supplies • Wireless handsets, handheld
instruments
Description
Environmental Data
•
•
•
•
•
•
•
•
• Storage temperature range: -40°C to +125°C
• Operating temperature range: -40°C to +125°C
(ambient plus self-temperature rise)
• Solder reflow temperature: J-STD-020D compliant
125°C maximum total temperature operation
Low profile surface mount inductors
6.0 x 6.0 x 3.0mm maximum surface mount package
Ferrite core material
Shielded drum core reduces EMI
Inductance range from 2.7µH to 660µH
Current range from 0.16 to 4.08 Amps
Frequency range up to 1MHz
Packaging
• Supplied in tape and reel packaging, 2000 per 13” diameter reel
Product Specifications
Part Number5
SD6030-2R7-R
SD6030-3R3-R
SD6030-4R2-R
SD6030-5R0-R
SD6030-5R8-R
SD6030-7R8-R
SD6030-100-R
SD6030-120-R
SD6030-150-R
SD6030-180-R
SD6030-220-R
SD6030-270-R
SD6030-330-R
SD6030-360-R
SD6030-440-R
SD6030-520-R
SD6030-680-R
SD6030-820-R
SD6030-101-R
SD6030-121-R
SD6030-151-R
SD6030-181-R
SD6030-221-R
SD6030-271-R
SD6030-331-R
SD6030-391-R
SD6030-471-R
SD6030-561-R
SD6030-681-R
OCL1 µH ± 30%
2.7
3.3
4.1
4.9
5.8
7.8
9.3
11.3
14.1
17.1
20.4
26.0
32.4
34.4
44.0
52.0
65.6
81.6
94.4
110.1
144.5
175.7
210.9
264.2
313.5
373.7
460.0
546.2
659.4
Irms2 (Amps)
4.08
3.54
3.11
2.81
2.58
2.38
2.15
1.99
1.71
1.65
1.57
1.31
1.26
1.19
1.10
0.99
0.92
0.80
0.76
0.70
0.64
0.55
0.50
0.44
0.38
0.35
0.33
0.30
0.27
Isat3.(Amps)
2.60
2.40
2.20
1.90
1.80
1.60
1.30
1.20
1.10
1.00
0.90
0.85
0.75
0.70
0.62
0.58
0.52
0.46
0.42
0.40
0.35
0.32
0.30
0.27
0.25
0.22
0.20
0.18
0.16
1) Open Circuit Inductance Test Parameters: 100kHz, 0.1V, 0.0Adc.
2 Irms: DC current for an approximate DT of 40°C without core loss. Derating is necessary
for AC currents. PCB layout, trace thickness and width, air-flow, and proximity of other
heat generating components will affect the temperature rise. It is recommended that the
temperature of the part not exceed 125°C under worst case operating conditions verified in the end application.
Typ. DCR mW @ 20°C
13
18
23
28
33
39
48
56
76
82
90
130
140
157
185
226
263
343
385
517
608
817
1000
1300
1733
2083
2250
2767
3458
Max DCR mW @ 20°C
18
24
31
38
45
53
65
76
103
110
122
175
189
212
250
305
355
463
520
620
730
980
1200
1560
2080
2500
2700
3320
4150
4 K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K*L*DI, Bp-p (mT), K:
(K factor from table), L: (Inductance in mH), DI (Peak to peak ripple current in Amps).
5 Part Number Definition: SD6030-xxx-R
SD6030 = Product code and size; -xxx = Inductance value in mH;
R = decimal point; If no R is present, third character = # of zeros.
-R suffix = RoHS compliant
3 Isat Amps peak for 35% rolloff (@25°C)
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K-factor4
34
30
27
24
22
19
17
16
14
13
12
11
9.3
8.7
7.9
7.2
6.5
5.9
5.6
5.6
5.0
4.5
4.0
3.6
3.3
3.0
2.8
2.5
2.3
Page 1 of 4
Data Sheet: 4314
Dimensions - mm
Part Marking: Coiltronics logo, xxx = Inductance value in uH. R = decimal point. If no R is present third character = # of zeros, wwlly or wwllyy = Date code, R = Revision level.
Packaging Information - mm
Parts packaged on 13" diameter reel, 2000 parts per reel.
Core Loss
500kHz
300kHz
1MHz
1
200kHz
100kHz
Core Loss (W)
0.1
0.01
0.001
0.0001
1
10
100
1000
Bp-p (mT)
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Page 2 of 4
Data Sheet: 4314
Temperature Rise vs. Loss
Inductance Characteristics
-40°C
+25°C
+85°C
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Page 3 of 4
Data Sheet: 4314
Solder Reflow Profile
TP
tP
Max. Ramp Up Rate = 3°C/s
Max. Ramp Down Rate = 6°C/s
TC -5°C
Package
Thickness
<2.5mm
_2.5mm
>
TL
Preheat
A
Temperature
T smax
Table 1 - Standard SnPb Solder (T c)
t
Volume
mm3
<350
235°C
220°C
Volume
mm3
_350
>
220°C
220°C
Table 2 - Lead (Pb) Free Solder (Tc)
Tsmin
25°C
ts
Time 25°C to Peak
Package
Thickness
<1.6mm
1.6 – 2.5mm
>2.5mm
Volume
mm3
<350
260°C
260°C
250°C
Volume
mm3
350 - 2000
260°C
250°C
245°C
Volume
mm3
>2000
260°C
245°C
245°C
Time
Reference JDEC J-STD-020D
Profile Feature
Preheat and Soak
Standard SnPb Solder
100°C
• Temperature min. (Tsmin)
• Temperature max. (Tsmax)
• Time (Tsmin to Tsmax) (ts)
Average ramp up rate Tsmax to Tp
Liquidous temperature (TL)
Time at liquidous (tL)
150°C
200°C
60-120 Seconds
60-120 Seconds
3°C/ Second Max.
3°C/ Second Max.
183°C
60-150 Seconds
217°C
60-150 Seconds
Peak package body temperature (TP)*
Time (tp)** within 5 °C of the specified classification temperature (Tc)
Average ramp-down rate (Tp to Tsmax)
Time 25°C to Peak Temperature
Lead (Pb) Free Solder
150°C
Table 1
Table 2
20 Seconds**
30 Seconds**
6°C/ Second Max.
6°C/ Second Max.
6 Minutes Max.
8 Minutes Max.
* Tolerance for peak profile temperature (Tp) is defined as a supplier minimum and a user maximum.
** Tolerance for time at peak profile temperature (tp) is defined as a supplier minimum and a user maximum.
North America
Cooper Electronic Technologies
Cooper Bussmann
1225 Broken Sound Parkway NWP.O. Box 14460
Suite F
St. Louis, MO 63178?4460
Boca Raton, FL 33487?3533Tel: 1?636?394?2877
Tel: 1?561?998?4100
Fax: 1?636?527?1607
Fax: 1?561?241?6640
Toll Free: 1?888?414?2645
Asia Pacific
Europe
Cooper Electronic Technologies
Cooper Electronic Technologies
Cooper Electronic Technologies
Cooper (UK) Limited
Avda. Santa Eulalia, 290 1 Jalan Kilang Timor
#06?01 Pacific Tech Centre
Burton?on?the?Wolds
08223
Singapore 159303
Leicestershire ¥ LE12 5THTerrassa,
UK
(Barcelona), Spain
Tel: +65 278 6151
Tel: +44 (0) 1509 882 737Tel:+34 937 362 812
Fax: +44 (0) 1509 882 786
Fax: +65 270 4160
+34 937 362 813
Fax:+34 937 362 719
The only controlled copy of this Data Sheet is the electronic read?only version located on the Cooper Bussmann Network Drive. All other
document are by definition uncontrolled. This bulletin is intended to clearly present comprehensive product data and provide technical i
that will help the end user with design applications. Cooper Bussmann reserves the right, without notice, to change design
? or constructi
ucts and to discontinue or limit distribution of any products. Cooper Bussmann also reserves the right to change or update,
? without noti
nical information contained in this bulletin. Once a product has been selected, it should be tested by the user in all possible applicat
Life Support Policy: Cooper Bussmann does not authorize the use of any of its products for use in life support devices or systems withou
written approval of an officer of the Company. Life support systems are devices which support or sustain life, and whose ?
failure to perf
erly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury t
© 2 0 11 C o o p e r B u s s m a n n
w w w. c o o p e r b u s s m a n n . c o m
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Page 4 of 4
Data Sheet: 4314