CENTERFORNANOSCALE SCIENCEANDENGINEERING
StandardOperatingProcedures
OxfordPlasmalab80PlusPlasmaEtcher
Version1.1
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Important
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You can only use CeNSE laboratories and equipment if you have been approved by Brian or Chuck, reserved the tool on the calendar, and filled out a form. No Exceptions! If the equipment is acting unusual STOP! Please discuss with Brian or Chuck before proceeding and leave a note on the machine. Gloves should be worn before touching anything that will be under vacuum to reduce contamination. Any accidental damage must be reported immediately. All CeNSE laboratories are protected by video surveillance. Version1.1
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Machineexteriorandpanels
Chamber
Computer
Control Panel Emergency Stop On/Off Switches Gauge
Version1.1
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Gauge Gauge
Gauge Sight Version1.1
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OperatingProcedure
1. Preparation 1.1. Before beginning, be sure to wear gloves to reduce contamination and to protect the hands. 1.2. Review the previous entry in log book to ensure there are no reported problems 1.3. Ensure that gas bottles that you intend to use are turned on 1.4. Fill out the log sheet with the starting time and gases being used 1.5. A clean room mask must be worn while the chamber is open 1.6. Minimize time that the chamber is open 2. Logging on 2.1. Click with the mouse to end the screen saver on the computer and double click the PC 2000 icon 2.2. On the following screen entre your name and password and click the Verify button (note: pressing enter will not complete this process, it will restart the process) 2.3. The system will return with your name and level of access. If the name is correct, then click OK. 3. Chamber venting 3.1. If the chamber is under vacuum, contact the CeNSE Staff to ensure that the prior user is finished and their sample is not in the chamber. 3.2. At this point, you must be wearing clean room gloves and face mask. 3.2.1.WARNING: When opening or closing the process chamber, ensure that everyone stands clear of the chamber lid and hoist assembly. When the nitrogen is first applied to the system, the initial chamber lid movement will be rapid. Please ensure that you do not leave tweezers or your fingers between the lid and the base, damage to yourself and/or the equipment could occur. 3.2.2. Note: If the sample to be etched contains photo resist or any other polymers, then the substrate must be baked immediately before placing it in the chamber. 3.3. To open the processing chamber: set the chamber switch to open, then press both hoist buttons simultaneously and hold them until the chamber is fully opened. If the lid does not open within 3 seconds, release the hoist buttons and try again. If the lid does not open after the second attempt, contact CeNSE Staff. 3.4. Place the sample face up in the center of the stage and clamp is down on the sample holder (if you are using a full 75mm wafer, contact CeNSE Staff to remove the clamping stage) 3.5. Check the O‐Ring in the chamber lid and base plate to ensure that they are free of particles, dirt, and that the O‐Ring is not damaged. If the O‐Ring is damage, contact CeNSE Staff immediately. 3.6. Set the chamber switch to close. Then press both the hoist buttons simultaneously, holding them until the chamber is fully closed. If the chamber does not close in 3 seconds, release the hoist buttons and try again. If the second attempt fails, contact CeNSE staff. Version1.1
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4. Operator etch operation 4.1. Ensure that all the pumps are on before beginning this portion of the process and your sample loaded by using section 3 above. 4.2. In PC2000 select the System Menu and the Recipe option. The recipe page will be displayed. 4.3. Load the required recipe. If the material you want to etch and/or the recipe is not in the system, contact CeNSE Staff and they will work with you to replace the recipe in the system. 4.4. Select the Run button. The following sequence will be automatically carried out: 4.4.1.The process chamber will start to evacuate 4.4.2.When the process chamber reaches base pressure, the process will begin 4.4.3.When all process steps are complete, follow the steps from section 3 above to open the chamber. If you cannot open the chamber after the second attempt, contact CeNSE Staff. 4.5. Note: You may pause the process at any time by selecting the Pause button. You must select the start button to resume the process. 4.6. Note: you may stop the process at any time by selecting the Stop button. The system will display “Process Complete” and begin the venting of the chamber. 5. Etch monitoring 5.1. If there is anything wrong, press the Abort button to abort the process. Then go to Section 4 and select the correct process. 5.2. Always verify through the viewing port that the plasma is on and the brightness and color is correct. (IMPORTANT: do note stare through the viewport at the plasma prolonged, viewing may damage your eyes) 5.3. When the etch is complete, the chamber will vent automatically. 5.4. Note: At this point, you should be wearing clean gloves and a face mask. 5.5. When the timer counts down to 0, the screen shows “Process Complete”. A clear gap between the chamber lid and the chamber should be seen. 5.6. Set the chamber switch to Open. 5.7. WARNING: When opening or closing the processing chamber, ensure that personnel stand clear of the chamber lid and hoist assembly. 5.8. Press both hoist buttons simultaneously and hold them until the chamber is fully opened. If the lid does not open in 3 seconds, release the buttons and try again. If the second attempt fails, contact CeNSE Staff. 5.9. Check that the O‐Ring in the chamber lid and the base plate where the O‐Ring seals are free from particles, scratches and dirty. Use the nitrogen blow gun first to remove particles blowing them toward the outside of the chamber. If that fails, contact CeNSE Staff and makes an entry in the log book. 5.10.
Remove your sample. 5.11.
Set the chamber switch to close, then press both hoist buttons simultaneously and hold them until the chamber is fully closed. If the lid does not close in 3 seconds, release the buttons and try again. If second attempt fails, contact CeNSE staff. Version1.1
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5.12.
Click on Manual mode again. Go to Penning Pressure, change the pressure to 1e‐7 by highlighting the pressure and use the keyboard to enter. 5.13.
Click on start. 5.14.
Fill out the log book, completely noting any problems. Version1.1
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Appendix1 Detailed Information for RIE Recipes
Recipe #
Etch
Material
Gases and Pressure
Flow(sccm)
(torr)
Power
1
Cleaning
100sccm
O2
0.100
200
2
Oxide
Slow
0.035
200
3.
Oxide Fast
0.150
200
4
Nitride
Slow
0.035
200
5.
Nitride
Fast
0.055
200
PROCESS GASES
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(Watts)
Gas Number
Gas
Maximum
Flow(sccm)
1
N2
100
2
C4F8
100
3
SF6
100
4
O2
50
5
Ar
TBD
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Appendix 2 Recipes
Recipe
Etch Materials
1
Cleaning
2
3
4
5
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Steps
H
M
Step 1
0
0
Step 19
Variable
Step 20
0
5
H
M
S
Step 2
0
0
30
Step 3
Variable
Step 20
0
5
H
M
S
Step 4
0
0
30
Step 5
Variable
Step 20
0
5
H
M
S
Step 2
0
0
30
Step 3
Variable
Step 20
0
5
H
M
S
Step 10
0
0
30
Step 11
Variable
Step 20
0
Oxide Slow
Oxide Fast
Nitride Slow
Nitride Fast
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5
S
30
0
0
0
0
0
10
Venting
Step 20
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H
M
0
5
S
0