International Journal of Application or Innovation in Engineering & Management (IJAIEM) Web Site: www.ijaiem.org Email: editor@ijaiem.org, editorijaiem@gmail.com Volume 2, Issue 6, June 2013 ISSN 2319 - 4847 Thin film technique for preparing nano-Zno gas sensing (O2, No2) using Plasma Deposition Mohammed K.Khalaf1 , Baha T. Chiad2 , Ala' F. Ahmed3 & Falah A-H. Mutlak4 1 Center of Applied Physics, Ministry of Science and Technology, Baghdad, Iraq 2 Dept. of Physics, College of Science, University of Baghdad, Baghdad, Iraq 3 Dept. of Astronomy, College of Science, University of Baghdad, Baghdad, Iraq 4 Center of Applied Physics, Ministry of Science and Technology, Baghdad, Iraq Abstract Zinc oxide thin films in 40 nm crystalline sizes were deposited on glass plates by using DC- sputtering of Ar/O2 (10%) plasma glow discharges. Home-made DC-glow discharge plasma (reactive ion) source was designed and implemented for this work. Our electrodes assembly configuration is special and less complex for preparing the nanocrystalline thin films in minimum grain size. Investigation concerned the technologies of depositing very thin film (~214-280nm) of zinc oxide and investigated both morphological structure of the produced layers and there optical properties. The structural details and microstructure were obtained from X-ray diffraction, optical microscope and atomic force microscope (AFM). Plasma deposited ZnO films exhibits the uniform prefer rential growth of nano crystalline film and hexagonal type structure with good crystallinity and no indication of amorphous components or other crystalline compounds. The minimum and average crystallite size was obtained using atomic force microscope. The spherical ZnO nanoparticlles form a spatial homogenous film on the substrate without any discontinuities was exhibited from the optical microscope. The energy gap of these plasma deposited ZnO films lies in the range of 3.1-3.3eV. This work also presents investigations on the technology of gas sensing using home-made gas sensing unite and ZnO nanocrystalline films in the O2 and NO2 gases. Keywords: Nanotechnology, Thin Films, Gas Sensing, Zinc Oxide, Sputtering . 1. INTRODUCTION The analysis of high band gap oxide semiconductors proved the potential possibility of applying very thin layers of zinc oxide ZnO, titanium dioxide TiO2 and tin dioxide SnO2 both as sensor layers to detect selected lights and gases. Zinc oxide thin films are one of the most prominent transparent conducting oxides for advanced applications such as window layer in hetero junction solar cells, heat mirrors, piezoelectric devices, multilayer photo-thermal conversion systems, solid state gas sensors etc. The direct optical energy gap of 3.3 eV for ZnO is large enough to transmit most of the useful solar radiation. Further, abundant availability of ZnO in nature makes it less expensive and its sharp UV-cutoff makes it desirable in many applications. Thin films of ZnO have been prepared by using several deposition techniques which include chemical vapor deposition, magnetron sputtering, oxidation of an evaporated metallic film, spray pyrolysis, pulsed laser deposition, sol-gel technique etc. [1]–[6]. Among these methods, dc reactive sputtering received much attention because of sputtering from elemental target in the presence of reactive gas for preparation of compound films with high energy of sputtered species, low pressure operation and low substrate temperature rise, made it as an attractive technique to deposit films on different substrates. When compared to other physical deposition techniques, sputtered films have better adhesion and greater uniformity over large areas [1],[7]. The physical properties of ZnO films prepared by dc reactive sputtering mainly depend on the sputtering parameters such as substrate temperature, oxygen partial pressure and sputtering pressure apart from the target-substrate distance, sputtering power and deposition rate. In the present investigation, an attempt was made in the deposition of ZnO films by dc reactive sputtering at various sputtering pressures and studied its effect on the some physical properties of the films. 2. Experimental (ZnO Films Deposition) This section is commended by the deposition procedure for films sputtering. Figure1 shows the schematic of the sputtering chamber and the associated dc power supply of the home – built glow discharge plasma system. The diameter of the target is (20 mm and approximated 3mm thick) and the distance between the top electrode and target is 4.6cm. The material to be sputtered is made into target; consist of electrode 99.99% purity Zn. The sputtering procedure is commenced by evaluating the chamber to pressure lower than 1x10-6 mbar. Ar, being a noble gas which does not react with either the target or the matunal specimen . Ar/O2 (10%) gas mixer introduce into the chamber at a specified pressure. The dc power supply is then switched on and established to the required current and cathode bias Volume 2, Issue 6, June 2013 Page 178 International Journal of Application or Innovation in Engineering & Management (IJAIEM) Web Site: www.ijaiem.org Email: editor@ijaiem.org, editorijaiem@gmail.com Volume 2, Issue 6, June 2013 ISSN 2319 - 4847 voltage. Surface finish and nature of the substrate used for depositing is very important since it influences the properties of the films tremendously. The ZnO films were deposited on glass substrates, which was ultrasonically cleaned in acetone and blown dry in air before loading into the deposition chamber .The substrates were sputtered etched in Ar/O2 (10%) plasma at bias voltage of 1500 volt for 30 minute. The films were allowed to deposit for 60 minute in most of the cases and then the bias voltage was turned off along with the gas supply to the system. A small area on each sample surface was covered to prevent deposition and used after processing to measure film thickness. Figure 1 Schematic of the dc- Sputtering reactor The thickness of the ZnO film deposited was in the range 214-280 nm. The average thickness of the deposited film was investigated and determined by three methods: (a) Weighing Method: the film thickness was calculated by using a theoretical formula given by[1]: t m 2 r 2 (1) where t is the thickness of the film; m is the mass of material taken in the ZnO target; is the density of the material; r is the distance between the target and substrate. (b) The AFM method was used to determine the prepared ZnO films thickness. (c) Interferometric Method: Measuring interference fringes produced by reflections from two reflection surfaces brought into close proximity in an arrangement called an interferometer. 3. Results and Discussion Effective sputtering of the cathode target (ZnO) is possible only when both the number and the energy of bombarding ions are large. In short, the energy of the bombarding ions depends on the voltage across the cathode dark space and the thickness of the dark space, which is inversely proportional to the gas pressure p. 3.1 Ar/O2 Mixture Plasma Characteristics The Ar/O2 mixture discharge current as a function of cathode potential is shown in Figure2 depends on the bombardment ions and its energy and working pressure. The discharge current was varied by changing the cathode potential (dc applied voltage) with a constant ballast resistor. Electric field accelerates the ions and electrons which then collide elastically with atoms of working gas giving rise to discharge current and gas temperature .The Ar/O2mixture discharge current as a function of working pressure is shown in Figure 2. With increasing working pressure, the discharge current is increased which attributed to more molecules are available for the electrons to collide with and to generate a new free electron and a positive ion. In this way, an increase in pressure would increase the number of free electrons, truing the dc voltage more negative. The dependence of the discharge current on the applied voltage and working gas pressure is given as following formula [8]: Ie = B Pk Vm (2) where B, k and m are constant with values depending on the cathode material and working gas. This behavior attributed to the increase of the secondary electron emission coefficient γ, when the ion energy bombarding the cathode increases, as mentioned by Auday et al (1998). Volume 2, Issue 6, June 2013 Page 179 International Journal of Application or Innovation in Engineering & Management (IJAIEM) Web Site: www.ijaiem.org Email: editor@ijaiem.org, editorijaiem@gmail.com Volume 2, Issue 6, June 2013 ISSN 2319 - 4847 50.00 Ar discharge plasma Vc=-1000V Vc=-650V Vc=-450V DischargeCurrent(m A) 40.00 30.00 20.00 10.00 0.00 0.00 0.20 0.40 0.60 0.80 Working Pressure(mbar) Figure 2 The variation of discharge current with working pressure for different applied voltage. The characteristic of sputtered ZnO films is obtained, when the gas pressure of Ar /O2 mixture was held constant at 8x10-3, 4.6x10-2 and 8x10-2 mbar. The deposition rate (film thickness) decreases from 282nm to 214nm with increase of sputtering pressure from 8x10-3mbar to 4.6x10-2mbar respectively as shown in table 1 and Figure3. Table1: The ZnO film thickness and plasma sputtering conditions Increasing the Ar/O2 pressure further increases the number of electron and ions but decreases their energy because the voltage across the cathode dark space falls due to thermionic emission from the cathode at high current densities. The decrease in cathode potential will also result in the decrease of sputtering power hence a decrease of thickness of prepared films. Also, when the sputtering pressure increased the mean free path of the sputtered particles travel from the target to the substrate, and some of the sputtered particles were back scattered towards the target. This resulted in the decrease of the deposition thickness of ZnO prepared films. At higher gas pressure, the sputtered atoms are prevented from reaching the substrate at the anode because of randomization due to the large number of collisions with gas molecules. Park et al [9],[10] also observed a decrease of deposition rate of ZnO sputtered films from 12.5nm/min to 9.0nm/min with the increase of sputtering pressure from 1.5x103- mbar to 6x10-3mbar respectively. 340.00 ZnO sputtered films ZnOFilm sThickness(nm ) Current Density=0.2 - 1mA/cm2 300.00 260.00 220.00 0.02 0.06 0.10 Working Pressure (mbar) Figure 3 The variation of ZnO film thickness with sputtering gas pressure. 3.2 Structure Analysis of ZnO Sputtered Films In the present work, diffraction studies are carried out using X- Ray shemadzu XRD-Diffractrometer (operated at 40 kV an accelerating potential and 30mA with filtered CuKα radiation 1.5418 Ao wavelengths) was performed to identify the crystalline phases present in the surface layers. It was found that the XRD pattern of ZnO films prepared in this work are similar to the corresponding patterns of A.S.T.M standard compound. In Fig. 4, the peak positions and the d spacing calculated from them are in agreement with previous studied [11, 12]. The analysis of the peak positions and intensities showed that Bragg reflection, of ZnO films correspond to the (002) and (101) orientation, at Bragg angles around 34.17° and 35.9° respectively. The peaks of reflections indicate that the sputtered films are of polycrystalline structure and the intensity of (002) reflection is higher than that of other planes, which means is a suitable plane for crystal growth. Figure 4 shows that the peak intensity increases with decrease of sputtering pressure from 4.6x102 mbar to 8x10-3mbar, in dc reactive sputtered This intensity reduction attributed to orientation of the crystallites changed from c-axis perpendicular the substrate to that of parallel to the substrate when the sputtering pressure increase in dc sputtered films. Volume 2, Issue 6, June 2013 Page 180 International Journal of Application or Innovation in Engineering & Management (IJAIEM) Web Site: www.ijaiem.org Email: editor@ijaiem.org, editorijaiem@gmail.com Volume 2, Issue 6, June 2013 ISSN 2319 - 4847 The grain size of the films can be evaluated from the Scherrer's relation [1]. In present work ,with the decrease in sputtering pressure from 4.6x10-2 mbar to 8x10-3mbar respectively as shown in Figure 4 we expected increasing the grain size which indicated by increasing of the peak intensity of (002)and (101) orientations. The increase of grain size with the decreasing sputtering pressure was due to the improvement in the degree of crystalline and increasing thickness of the films. ZnO Sputtered Film Thickness=283nm,P=0.008mbar Thickness=260nm,P=0.02mbar Thickness=214nm,P=0.046mbar Intensity(a.u)/cps (002) (101) 20.00 30.00 40.00 50.00 2Theta(deg.) Figure 4 XRD pattern of ZnO films prepared by plasma sputtering The microstructure of the plasma treated samples was examined by optical metallographic techniques using Nikon type 120-Japan optical microscope with digital camera DXM1200F, and the images were analyzed with Act-Version 2,62,2000 program. Optical micrographs of ZnO films deposited at Ar/O2 pressure of 6.4x10-2 mbar are shown in Fig.5. This micrograph exhibited the uniform distribution of microstructures without any cracks and voids with the variation in particle size of the grain are regular and microstructure revealed many round shaped particles in cluster combinations. Figure 5 Optical micrograph of ZnO sputtered thin film of 214 nm thickness. The pictures of morphological structure of ZnO films were obtained by using an atomic force microscopy (A° 2000 setup-AFM) as shown in Figure 6. Table 2 and Figure7 shows the surface morphology details of a film nanostructure determined by means of the AFM method. AFM characterization of the films surfaces revealed a granular, polycrystalline morphology with grain size and roughness of 5nm.The grain size measured as described in table 2 was varying from 40to Figure 6 Morphological structure of ZnO by using an atomic force microscopy (AFM) Volume 2, Issue 6, June 2013 Page 181 International Journal of Application or Innovation in Engineering & Management (IJAIEM) Web Site: www.ijaiem.org Email: editor@ijaiem.org, editorijaiem@gmail.com Volume 2, Issue 6, June 2013 ISSN 2319 - 4847 Table 2 The grain size percentage in sputtered ZnO film. Figure 8 The optical transmission and absorbance spectra of ZnO thin films. 3.4 Gas sensing Measurements The sensitivity of the gas sensor is defined as the capability of the sensor to respond the presence of a given gas concentration. Mathematically, the sensitivity S is defined by the formula; S= Rg/Rn for redactor gas, and S= Rn/Rg , for oxidator gas, where Rg and Rn is the resistance of the sensor after and before passing the gas and reaches the saturation[13]. Resistance of ZnO films exposed to various environmental gases at 200 and 250°C was also measured inside the home made chamber (Figure 9). The resistance measurements of ZnO samples were carried out in the dark, so that photo excitation of carriers should not be significant. A result of resistance change vs environmental gas change. The film sensor is relatively inert to nitrogen and argon, but sensitive to oxidation gas. The sensitivity was found to increase with increasing of working temperature which is attributed to decrease of mobility of carriers (resistance increased) as shown in Figures 10, 11, 12. The samples show high sensitivity to O2 and NO2 gases at operating temperature 250 oC 1E+8 Gas senser resistance as function to the temprature for different gases. Rair R N2 1E+7 R Ar Resistance(ohm) R O2 1E+6 1E+5 1E+4 1E+3 1.60 2.00 2.40 2.80 3.20 3.60 Temprature 1/T(1000/K) Figure 9 The gas sensor resistance as a function of the temperature for different gases Volume 2, Issue 6, June 2013 Page 182 International Journal of Application or Innovation in Engineering & Management (IJAIEM) Web Site: www.ijaiem.org Email: editor@ijaiem.org, editorijaiem@gmail.com Volume 2, Issue 6, June 2013 ISSN 2319 - 4847 6 Resistance ratio at 200o C Resistance ratio at 250o C Resistance ratio at 350o C RO2/RN2 Resistanceratio 5 4 3 2 1 0 100 Time (sec) 200 300 Figure 10 The gas sensor resistance ratio (sensitivity of O2) for different working temperatures 300 Senstivity of ZnO specimens at 250oC Senstivity(resistance ratio) O2 N2 200 100 N2 O2 0 0 20 40 60 Time (min) Figure 11 Sensitivity of ZnO Thin Films to O2 20 Senstivity of ZnO specimens at 250oC NO2 air Senstivity(resistanceratio) 16 12 8 4 air NO2 0 0 20 40 60 Time (min) Figure 12 Sensitivity of ZnO Thin Films to NO2 4 Conclusions Prototype ZnO partial pressure (O2 and NO2) sensor has been built using Ar/O2 (10%) discharges plasma. ZnO sputtered films is a strong function of working temperature. ZnO sputtered films in nanostructure and the thicknesses are related to working sputtering pressure. References [1] K. Chopra and I. Kaur, Thin Film Device Application, Pllenum press, New York and London, 20, 1983. [2] T. K. Subramanyam , B. Srinivasulu Naidu, S. Uthanna , "Physical Properties of Zinc Oxide Films Prepared by dc Reactive Magnetron Sputtering at Different Sputtering Pressures", Cryst. Res. Technol. 35, 10, p. 1193, 2000. [3] K. Golaszewskaa , E. Kaminskaa, T. Pustelny, and K. Gut," Planar Optical Waveguides for Application in Optoelectronic Gas Sensors", ACTA PHYSICA POLONICA A, 114, No. 6-A, A-223 , 2008. [4] T. Pustelny, Physical and Technical Aspects of Optoelectronic Sensors, SUT, Gliwice, p. 86, 2005. Volume 2, Issue 6, June 2013 Page 183 International Journal of Application or Innovation in Engineering & Management (IJAIEM) Web Site: www.ijaiem.org Email: editor@ijaiem.org, editorijaiem@gmail.com Volume 2, Issue 6, June 2013 ISSN 2319 - 4847 [5] S. M. Rossnagel, "Thin film deposition with physical vapor deposition and related technologies", J. Vac. Sci. Technol. A, 21, 5, pp. S74-S87, September, 2003. [6] L.I. Maissel, R. Glang (eds.), Handbook of Thin Film Technology, New York, McGraw Hill pp. 3-23, 1970. [7] H. Meixner, J. Gerblinger, U. Lampe, and M. Fleischer, Thin-film Gas Sensors Based on Semiconducting Metal Oxides, Sensors and Actuators B, 23, pp.119-125, 1995. [8] A. M. Suhail," Electron Beam Pumped Carbon Dioxide", Ph.D. Thesis, Dep. Phys., University of Essex, U.K., , 1983. [9] G. Auday,Guillot Ph. Galy J."Expermental Study of the Effective Secondary emission Coefficient for Rare Gases and Copper Electrodes", J.Appl.Phys. 83, 11, p.5917, 1998. [10] D.Y. Park, K.H. Ma, Kim, "RF Magnetron Sputtering on Glass Substrate" J. Appl. Phys., 81, p. 7764, 1997. [11] B.T. Kneri, G.S. Kino, "Studies of the Optimum Condition for Growth of RF Sputtered ZnO Films" J. Appl. Phys., 46, p. 3266, 1975. [12] K. Matsubara, T. Yamada, "Properties of ZnO Films Prepared by Reactive Ionized Cluster Beam Deposition" Surf. Sci., 86, 290, 1979. [13] P. P. Sahay , S. Tewari , S. Iha , M. Shamsuddin ,"Thin Film for Gas Sensor Application", J. Mater. Sci. 40, p.1791 2005. Author Dr. Mohammed K.Khalaf, received a B. Sc. in Department of Physics in 1993, M.Sc. in Physics Science degree in 1998 and Ph.D. degrees in plasma physics in 2010, from University of Baghdad, College of science, Department of Physics. Presently, he is a researcher at the Applied Physics Center and member of plasma application Department, Ministry of Science and Technology, Baghdad, Iraq Dr. Baha T. Chiad, completed his Ph.D. at the physics department in laser spectroscopy from Baghdad University – Baghdad-Iraq in 1993. His research interests lie in the field of organic semiconductor and molecular spectroscopy. He is currently a chief of the molecular spectroscopy and laser Research Group at the Physics department of Baghdad University. Dr. Falah A-H. Mutlak, received a B. Sc. in Department of Physics in 1998, M.Sc. in spectroscopy physics degree in 2002 and Ph.D. degrees in molecular spectroscopy physics in 2011, from University of Baghdad, College of science, Department of Physics. Presently. he is a lecturer at the Department of Physics and member of renewable energy research group Department of Phyics, College of Science of Baghdad University, Baghdad, Iraq. Dr. Ala' F. Ahmed Alrashidy. received a B. Sc. in Department of Physics in 1999, M.Sc. in Astronomy Science degree in 2002 and Ph.D. degrees in plasma physics in 2011, from University of Baghdad, College of science, Department of Physics. Presently. She is a lecturer at the Department of Astronomy & Space and member of plasma research group Department of Astronomy & Space, College of Science from Baghdad University, Baghdad, Iraq. Volume 2, Issue 6, June 2013 Page 184