Joint ITU-T/IEEE Workshop on Next Generation Optical Access Systems Optical Component Technology
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Joint ITU-T/IEEE Workshop on Next Generation Optical Access Systems Optical Component Technology Review and Future Trends David Li CTO, Ligent Photonics Geneva, 19-20 June 2008 International Telecommunication 1 Outline Introduction Key Components in OAN Conventional Transceiver Technologies Challenges in 10GPON Future Trends and Optical Integration Summary Geneva, 19-20 June 2008 International Telecommunication 2 Optical Access Network Trends • Higher bandwidth/capacity technologies are required for HDTV, IPTV, VOD, PVR, digital home, etc. Geneva, 19-20 June 2008 International Telecommunication 3 Passive Optical Network Structure 1550nm (if used) 2 1490nm 1 OLT 1 ONU 2 3 3 1310nm Passive Optical Splitter Upstream 1260 -1360 nm Geneva, 19-20 June 2008 For Futrue Use Down Stream 1380 -1460 nm 1480 -1500 nm Enhancement For Futrue Use λ 1539 -1565 nm International Telecommunication 4 10GEPON Quadplexer Structure 10GEPON and 1GEPON must be able to coexist in the existing fiber distribution network Geneva, 19-20 June 2008 International Telecommunication 5 EPON/GPON/10GEPON Review EPON GPON 10GEPON PX-10 PX-20 Class B+ Class C+ PR-30 Link Budget 23dB 26dB 28/30dB 32/33dB 29dB Data rate 1.25G 1.25G 2.5G/1.2 5G 2.5G/1.2 5G 10.3G TX Laser FP/DFB DFB DFB H DFB H EML H DML RX PD/TIA PIN/TIA PIN/TIA APD/TIA H Sen. APD/TIA Driver Discrete/Integrated Discrete Discrete APD+ TIA(S)+ FEC Discrete Discrete Discrete Discrete High High+ (OLT) High++++ (ONU/OLT) PA Cost Low Geneva, 19-20 June 2008 Medium Low International Telecommunication 6 Key Components in the OAN Passive Optics Splitters, Diplexer WDM filters 1550nm 1490nm Active Optics Laser, Digital APD/PIN Analog PD, SOA, Fast Optical Switch Geneva, 19-20 June 2008 TIA ATC SP Microelectronics Laser 1310nm Optical Port OLT Transceivers Tx LD Rx Rx PD 1490 nm Optical Port RF Overlay WDM Tx LD & PD 1310 nm Data WDM Driver, TIA, PA, CDR, FEC Tx LD & PD 1310 nm Rx PD 1490 nm Rx PD 1550 nm Tx LD TIA ATC SP Rx Triplexer DM RF Video Rx International Telecommunication 7 Key Issues in EPON/GPON Transceiver Microelectronics Burst mode, short response time for detection and threshold adjustment Large dynamic range High sensitivity for small signal detection Relative high speed, up to 2.5Gbit/s Intelligence (e.g., FEC, EDC, Monitoring, etc.) Active Optics Transmit laser diodes (high power, narrow spectral width, wide temperature, low noise, high speed, etc.) Receive photo diodes (high sensitivity, high linearity, high SNR, etc.) Passive Optics Low loss Low polarization dependence Low temperature dependence Operating Temperature Range and Power Consumption Low Cost, High Performance, and High Volume Geneva, 19-20 June 2008 International Telecommunication 8 FTTH Equipment Value Chain Opto Chip Opto Packaging Optical Chip Vendor Optical Sub-Assembly OSA (Optical Sub Assembly) Module System Transceiver Equipment Laser Die TO-Can Packaging BOSA Assembly Transceiver Assembly OLT & ONU Equipment PIN Die APD Die TIA Chip Limiting Amplifier Chip Laser Driver Chip OLT + ONU ASIC Geneva, 19-20 June 2008 Optical Interface Chip Vendor International ASIC Vendor Telecommunication 9 Conventional Transceiver Technologies - Complex, robust, improving, and yet reaching limit? ¾Discrete chips for LD, PD, lens, etc. ¾Stand-alone TO-cans for TX & RX ¾TX, RX and bidirectional optical sub-assemblies based on coaxialpackages OE Chips ¾Separate integrated MICs for analog and digital functions ¾Manual testing module assembly and BOSA TO-Cans MIC Chip Module Filter Chip Capital intensive, Automated fab, Manual processing Capital intensive, Automated assembly, Manual test Geneva, 19-20 June 2008 Labor intensive, Manual assembly, Manual test Labor intensive, Manual assembly, ManualInternational test Telecommunication 10 Availability of 10GPON Components Now 10GE CM transmission technologies and 1G/2G BM technologies are mature Challenges in 10GEPON BM components 9 Special 10G lasers to meet the IEEE802.3av requirements 1577nm high power 10G EML laser for OLT Low cost 1270nm 10G DML laser 9 10G burst mode drivers 9 10G/1G selective burst mode TIA and post amplifier 9 10G burst mode CDR and signal conditioner Geneva, 19-20 June 2008 International Telecommunication 11 Problem for 10G Eye Pattern 3av_0804_benamram_2 10G signal is much noisy – Electrical, Optical, Test Equipment Geneva, 19-20 June 2008 International Telecommunication 12 Challenges in 10GPON Signal degradation at 10G Link budget – 29dB TX power – high RX sensitivity – high BM 1G/10G switching OSA - Integration Cost - low High TX Power, High RX Sensitivity, Price Geneva, 19-20 June 2008 International Telecommunication 13 Optcal Module Packaging 100G Ligent 10GPON XFP 10G GPON/EPON 1G Customized Design SFF/SFP Pigtail 100M GBIC SFF/SFP or receptacle 1x9 96 98 00 02 04 06 08 Small, Pluggable, High Density, Low Power International Geneva, 19-20 June 2008 Telecommunication 14 Progress on the 10GEPON Laser Eudyna Devices, 06.02.2008 Geneva, 19-20 June 2008 International Telecommunication 15 Integration Platform Technologies ce n a m for r e P & y t i l a ion t c n u F Board Level Box Level Pre-packaged devices connected by fibers Present Geneva, 19-20 June 2008 Chips and sub-components assembled on silicon bench, and/or metal carriers Next Chip Level Chips connected with each other by hybrid or monolithic integration Future Hybrid or monolithical PLC InP-based Silica-based Silicon-based International Telecommunication 16 Basic Building Blocks for PICs •Packaging Challenges for Optical Integration •Design and Fabrication •Yield •Coupling to Fibers •Electrical Control •Multi-Functionality Wafer uniformity •Thermal Management •Complexity Coating •Hermetic issue •Redundancy testing •Low cost assembly International Geneva, 19-20 June 2008 Telecommunication 17 The Dream Device: Optical Port Integrated Optical Transceivers based on Two-Chips Tx LD & PD 1310 nm WDM LD Rx PD 1490 nm TIA Optical Port Tx LD & PD 1310 nm Rx PD 1490 nm WDM CATV Rx PD 1550 nm PIC Chip ATC SP Diplexer Rx MIC Chip PIC Chip Data GND Tx DC power LD TIA Tx ATC SP Rx DM Triplexer Video MIC Chip W.P.Huang, OSA Optics Express, Vol. 14, International 2006 Geneva, 19-20 June 2008 Telecommunication 18 Summary ¾ The design and manufacturing of optical module in the access networks follows a process from discrete components to optical sub-assemblies and microelectronic chips, to module assembly and test ¾ The conventional transceiver technologies based on discrete optoelectronic chips and coaxial packaging are still the key enabler and continue to improve ¾ The emerging technologies based on planar packaging, hybrid/monolithic optical integration are under development and will have significant (not immediate) impact on the cost and performance ¾ The WDM, and other approaches are necessary for next generation access network beyond the 10Gbps. 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