Bristol, CERN, Glasgow, Lausanne, Liverpool, Manchester, Moscow State, NIKHEF, Oxford, Syracuse University, Warwick PART I Status of the VErtex LOcator Thanks to VELO colleagues for slides, notably Themis Bowcock, Silvia Borghi PART 2 Potential for Upgrade 1 Chris Parkes Warwick 16th July 2009 PART I Status of the LHCb Vertex Locator: Finishing the last spoke of the VELO • • • • • LHCb Intro Velo Design Construction Alignment Commissioning - Data 2 B Physics Progress • Spectacular progress in heavy flavour physics this millenium – Baseline measurement ACP (J/y KS) – Bs and D Oscillation Measurements • B Factories/Tevatron achieved much more than dreamed LHCb Goals • Explore Bs System Bs K K • Charm Physics Bs J /y – Discover CP violation ? • Rare decay Bs Bs K * • Unitarity Triangle Loop Discoveries: Charm..top..Higgs(?) Angle • Compare loops & trees 3 Plagiarism as flattery...Jonas from Monday 4 B Production •LHC: pp-collisions @ 14TeV •2 fb-1 Nominal data taking year of 107s bb correlated Lorentz boost LHCb: forward spectrometer 15-250 mrad acceptance Interactions/crossing •Pile-up at high luminosity •choose 2x1032 cm-2 s-1 most events have single interactions 5 LHC will reach early in run Dedicated Flavour Experiment •Full spectrum of B (&c) hadrons: B , Bd,0 s, c , baryons • Bs system,all angles, sides of both CKM s •Lots of events ! σbb 500 μb, O (1012) bb pairs per year Dipole magnet Tracking system Muon system Calorimeters Vertex Locator p 10 mrad p RICH detectors 6 Muon Calorimeters RICH2 Trackers RICH1 Magnet VELO 7 • UK – – – – Spokesperson Physics Co-ordinator VELO Project Leader 20% of Collaboration Flag Waving • Cost – £ Entire LHCb < Cost of ATLAS SCT – £ VELO R&D < Cost of ATLAS spare module boxes • Glasgow Detector Responsibilities – RICH HPD testing – VELO module testing – VELO HV system – VELO simulation & reco. software – VELO Alignment • Glasgow Physics – CKM angle γ from U-spin methods • Standard Model γ (Tree Diagrams): BD / BsDsK • NP sensitive γ (Penguin Diagrams): B / BsKK – Two body Decays • Lifetime measurements (charm, BsKK) • Rare Bhh • time dependent two body D decays – New Physics sensistive rare decay BK*μμ 8 Aims & Critical Components •LHCb: • study CP violation • rare B decays New Physics •Requirements: • efficient trigger on leptons and hadron channels • efficient particle ID for flavour tagging and background rejection • good proper time resolution for time dependent measurements of Bs decays • good B mass reconstruction for background rejection 9 LHCb: Triggering on B’s 10 MHz Visible collisions L = 2 1032 cm-2 s-1 L0: [hardware] high Pt particles calorimeter + muons 4 μs latency 1 MHz HLT [software] 1 MHz readout ~1800 nodes farm ~2 kHz On tape: Exclusive selections Inclusive streams 10 Velo Rôles • Primary / b decay Vertex reconstruction • Stand alone Tracking – A principle tracking device for the experiment • Second Level Trigger – Fast tracking 1m •In vacuum •Retract each fill One set of half disks •Align each fill 11 Design •VELO sensors as close as possible to beam injection 6 cm •no beam pipe, •sensors ~7mm away from beam BUT •Injection: retraction by 30mm y x stable beams partly overlapping sensors •Protect sensors against RF pickup from LHC beam •Protect LHC Vacuum from possible out-gassing of detector modules •Place sensors in a secondary vacuum in Roman pots 12 UK responsibilities: Design , Build, Test •Si Sensors •Hybrids •Thermal/ mechanical modules •HV system Software •Simulation •Reconstruction •Pattern Recognition •Alignment 13 VELO: Tank 14 Secondary Vacuum – RF Foil •Made from 300m thick Al outer corrugations •Inner corrugations : Minimal material before the first sensor is hit •Outer corrugations: F sensors R sensors allow for overlap of detector halves for full azimuthal coverage and for alignment inner corrugations •Manufactured at NIKHEF method: Hot gas Forming vacuum tight and stiff 15 VELO: Cooling • Biphase CO2 @ 15bar • Low mass 16 • • • • • • highly segmented n+ on n & 1 n on p double metal layer 2048 strips/sensor Laser cut Two designs VELO: Sensors ~4cm – R-measuring – Phi-measuring 17 Sensor Design •R & Phi sensors R-measuring sensor: (concentric strips) •Fast stand-alone tracking and vertexing for trigger •Design allows to optimise resolution vs. number of channels •Design of Sensors: •Active area 8mm to 42 mm •Smooth pitch variation from inner (40m) to outer radii (100m) •2nd metal layer to route signal to chips •n+-on-n DOFZ •Analogue readout, 40MHz clock F–measuring sensor: (Radial strips with a stereo angle) 18 Production: Hybrid • • • • TPG/CF core Double sided Populated Pitch adaptors – Chips • Bonding • Sensors • More bonding 19 Production: Sensor Bonding • • • • Loop heights Row 1 = 250 µm Row 2 = 450 µm Row 3 = 750 µm Row 4 = 900 µm Chip Pitch Adapter The chip pads are four row bonding with small pads, making it difficult but not impossible to do repair work. There are 16 chips per sensor each with 128 wires a total of 4096 wires per module 20 Testing: IR Laser •Programmed & aligned •Noise plots •Laser scan every strip of every detector 21 Testing: Inspection / Burn-in • Visual inspection – Detailed High Resolution • Vacuum Burn-in – Thermal Cycling – 16 hour burn-in – Noise 22 Assembly: Mounting module bridge rotated into position module inserted onto support cooling cookies attached experts brought in for kapton attachments 23 Only 41 to go …. ! 24 25 Installation Lowering into the LHCb cavern … … ready for installation … … insertion of one half Installed October/November 2007 Now Commissioning 26 Readout scheme Processor Board in FPGAs Analogue signals Clusters 27 FPGA based Data Processing • Velo Data Processing Raw -> Clusters in TELL1 RAW •Require 1M parameters Pedestal Following •Optimisation critical for data quality Beetle Cross-talk Correction Cable Cross-talk Filter (FIR) Lower priority Common Mode Suppression (MCMS) Beetle baseline shift Lower priority Reordering Common Mode Suppression (LCMS) • Pedestal & Clusterisation Thresholds most important •Bit Perfect Emulation of Algorithms in full LHCb Software Framework Clusterization 28 CLUSTERS Material Budget / Resolution Material Distribution 20% X0 Resolution Performance: Single Hit best 4 m Primary vertex 42 m in Z, 10 m XY Decay length 220 - 375 m Test-beam Measurement 29 • strip isolation via p-spray • expected max dose: -1.3 · 1014 neq/cm2/year after 4 years [~8 fb-1]: cannot fully deplete • LHCb VELO will be HOT! •VELO in construction – again ! Udep [V] after 1 year of irradiation [2 fb-1] not type inverted • inherently radiation tolerant Radiation type inverted n+ in n-bulk sensors [300 m] R [cm] Middle station •Building replacement sensors: • n-in-p Far station •Radiation damage •Beam accidents 30 Expected Performance = -ln tan(/2) B decays For typical B decay modes: reconstructed track - hits in 3 stations LHCb acceptance: 1.9 < < 4.9 • primary vertex resolution: - x,y: ~10 m, z: ~60 m • Proper time res.: ~40 fs • B Mass res.: 12 -25 MeV 31 Elements of Alignment • Each detector half moved 3cm each fill Hardware Design Rigidity low thermal expansion 10m Si-Si alignment Measurement Measurement machine Individual modules during assembly Complete system Software BEFORE / AFTER Alignment in few minutes At few m level 32 Nucl. Instr. and Meth. A596 (2008) 157-163 Nucl. Instr. and Meth. A596 (2008) 164-171 Aligning the Velo Step 0 Step 1 Step 2 Step 3 Misaligned VELO Sensors aligned in modules Modules aligned in halves Aligned VELO Halves aligned •Physics tracks •Overlap tracks •Beam Halo tracks •Vertices 33 Effect of Misalignment on Physics B • LHCb 2008-012 Impact of misalignments on the analysis of B decays •50% loss of events for 15µm misalignment 34 Global Alignment Method Establish linear expression of residuals as a function of mis-alignments. Fit the tracks simultaneously with the alignment constants xclus = ∑xtrack ai∙di + ∑eaxj∙j Parameters di of the tracks (different for each track) LOCAL PART Residuals expressed as function of misalignments i GLOBAL PART ∂ c2 ∂ c2 rclus = (xclus - x) = =0 ∂ di ∂ ∆i Alignment minimise c2res = ∑ ∑wclus∙r2clus Get all track parameters and all misalignment constants simultaneously BUT… 1 single system to solve. 35 But this system is huge ! (Ntracks∙Nlocal+Nglobal equations) Matrix Inversion The matrix to invert has a very special structure: kCkglobal … HkT Cklocal 0 0 0 … Nglobal dk kwkak … 0 = … 0 … 0 kwkxk … … … Hk Nlocal x Ntraces Inversion in section (implemented in the code MILLEPEDE V.Blobel - NIM. A 566), The problem becomes only Nglobal x Nglobal If Nglobal 100 , the problem can be solved in seconds 36 Commissioning the VELO Single module operation under Neon atmosphere – 18th March 2008. System @ full power Noise level compared with previous data taken in assembly Operation of 15 modules on 15th May 2008 Single module test of 2nd half – from 2nd June 2008. Full half powered for first time – June 10th 2008. First operation in vacuum – 18th June 2008 Full detector operated under vacuum. Operated cooling fully loaded at 25C Modules @ -5C Silvia Borghi A ‘Typical’ day at the pit 37 Nucl. Instr. and Meth. A604, Issues 1-2, 1 June 2009 LHC synchronization test in August and September 2008, June 2009 Beam dumped on injection line beam stopper (TED) 1 shot / 48 seconds 5 109 – 5 1010 protons per shot TED TED is absorber at end of injection line 340m before LHCb 38 38 Results on TED data First Event 17:3322-08-08 September 2008 – 2,000 tracks June 2009 - 60,000 tracks 39 Silvia Borghi 39 An event with high luminosity •25ns Bunch Structure 40 First look at the data: ADC sum of clusters associated to a track fitted by Landau function Preliminary ADC sum (ADC counts) Signal/Noise approximately 20:1 Preliminary ADC sum (ADC counts) 41 VELO Timing • Timed to ~ +/- 2ns • Data taken at 4 timing steps: 0, 6.5, 12.5, 19 ns • Fit pulse shapes • Fast turn around on procedure 42 Alignment Results Step2: Relative Module Alignment from 2008 data Difference of align. constants for X and Y translations A side M. = 0.4 μm X trans Y trans σ = 3.2μm C side X trans Y trans ☛ The detector displacement from metrology is less than 10 m ☛ Module alignment precision is 5 m for X and Y translation and 200 rad for Z rotation 43 Silvia Borghi TIPP09 - 12 March 2009 43 Step1: First Sensor-Sensor Alignment from 2009 data 44 Method for VELO half distance • Fit tracks in two halves separately – constrain to same track z in local frame x Z x • Only works when (almost) closed • For collision data will also constrain using PV fitted VELO was almost in the close position in two halves Twoseparately different positions: x-distance –Resolver distance between the two half of 2 mm –Resolver distance between the two half of 2.45 mm 45 First evaluation of 2 halves distance •Data taken at two VELO closing Positions Very Preliminary injection X mm y x 2mm and 2.45 mm Very Preliminary VELO was moved by 445 ± 10 chocolates 46 VELO Resolution VELO resolution Linear dependency on the pitch Dependency on the track angle Evaluation of the resolution versus the projected angle TED data Resolution evaluated integrating the results of all sensors 47 Silvia Borghi TIPP09 - 12 March 2009 47 Comparison with Metrology •Sensors in module measured with smartscope •Compare with software alignment 48 VELO Summary • VErtex LOcator is small but complex detector • precision tracking very close to the interaction region • radiation tolerant design • results from the testbeams/TED runs – S/N: 24-29 (), 20-24 (R) – Perpendicular track resolution: 9 -20 m • LHCb on schedule for first beams in 2009 (mid-November…..) 49 PART 2 Potential for a Future Upgrade : how to turn a VELO into a VESPA. Vertex Detector with Vertex Trigger Independent of SLHC Competitive & complementary to e+e- super B-factories VElo Superior Performance Apparatus 50 Initial Phase of LHCb Operations • Data taking starts 2009 Defocus LHC beams •LHCb L= 2x1032 cm-2s-1 •Factor 50 below ATLAS/CMS design L 1. Most Events have Single Interaction Number of pp interactions/ beam crossing Pile-up at high luminosity • B mesons identified by separation of primary interaction vertex and decay vertex (few mm) • Displaced Vertex trigger • 2nd level of triggering • Multiple Interactions • Limit Triggering 51 Initial Phase of LHCb Operations • •Displaced Vertex trigger •2nd level of triggering •Multiple Interactions •Limit Triggering •LHCb L= 2x1032 cm-2s-1 •Factor 50 below ATLAS/CMS design L •Most events have single interaction Data taking starts 2009 Defocus LHC beams •LHCb Upgrade L= 2x1033 cm-2s-1 •Cope with 4 int./x-ing •SLHC peak L= 8×1034 cm-2s-1 rate of pp interactions •Baseline - 40MHz, alternate High, Low I LHCb H L Select Low I for desired luminosity GPDs H H Effective 20MHz Crossing rate 52 LHCb Physics Programme But NOT Limited by LHC • Upgrade to extend Physics reach – Exploit advances in detector technology – Radiation Hard Vertex Detector – Displaced Vertex Trigger – Better utilise LHC capabilities Independent of LHC upgrade • Timescale ? Trigger Dependent •Start before SLHC • Upgrade Lumi. by factor 10 •But continue running 33 -2 -1 – 2x10 cm s during SLHC phase • Collect ~100 fb-1 data • Modest cost compared with existing accelerator infrastructure 53 Upgrade Physics Programme Examples Complementary to ATLAS / CMS direct searches •New particles are discovered •LHCb measure flavour couplings though loop diagrams • No new particles are found •LHCb probe NP at multi-TeV energy scale g~ B New Physics in loops ~ b,~ s 0 s ~ b,~ s B 0 s b g~ • CP Violation – Angle to better than 10 B D K 0 – Bs D K s c- Tree Diagram Dominated Decays, 0.10 theory s •Rare Decays Bd K Angular Correlations 54 LHCb Trigger System • Cope with approx 5 interactions / beam crossing Existing 1st Level Trigger •Veto on multiple interactions Current 1st Level Trigger Performance •Existing Trigger based on: •High pT Muons •Calorimeter Clusters Events with muons Events with hadrons Require Displaced Vertex Trigger At 1st level – trigger efficient – need improved trigger Full detector 40MHz readout 55 Detector Upgrade • Critical component to achieve this physics Radiation Hard Vertex Detector with Displaced Vertex Trigger VElo Superior Performance Apparatus 56 Radiation Hard Vertex Locator • UK responsible for Silicon Modules • Upgrade Requires high radiation tolerance device >1015 1 MeV neutroneq /cm2 • Strixels / Pixels VELO Module 8cm 57 Z Beam Enabling Technologies •Low-mass Thermo-Mechanical •Novel processing technologies SiC foam PocoFoam (Low-mass) ATLAS CF, TPG CVD Diamond Junction 2.9m LHCb TEOS Poly TSV Through Silicon Vias BCB Dielectric Layer Radiation Hard Silicon Sensor (UK leading) Front-End Chip Development (Timepix) Micromachining for TSV (3D) BCB deposition on sensors (ATLAS strip upgrade) Mechanical systems (LHC expertise, low-mass) Systems Expertise (ATLAS SCT, LHCb VELO) 58 3D Detector Structure Array of electrode columns passing through substrate • • Electrode spacing << wafer thickness (e.g. 30m:300m) • Benefits – Vdepletion (Electrode spacing)2 – Collection time Electrode spacing – Reduced charge sharing • More complicated fabrication - micromachining +ve +ve Planar 3D +ve -ve n-type electrode +ve n-type electrode electrons electrons Lightly doped p-type silicon holes 300 µm 300 µm holes p-type electrode p-type electrode Particle -ve Particle Around 30µm 59 Lateral depletion around column (~2V in sim.) CV • Pad detector – 90 * 90 columns, 55μm pitch P + 1/Capacitance, Pad detector 5.0E+09 4.5E+09 4.0E+09 1/C (F-1) 3.5E+09 3.0E+09 2.3V lateral depletion 2.5E+09 2.0E+09 ~9V back surface depletion 1.5E+09 N + 1.0E+09 5.0E+08 Depletion to back surface from 0.0E+00 tip of column (~8V in sim.) 0.0 5.0 10.0 Bias (V) 15.0 20.0 60 3D Detectors •3D Detectors provide extreme rad hard solution •novel double sided processing •Devices tested with Beetle / Medipix electronics 25000 signal [electrons] strips pixels 20000 p-in-n n-in-p 3D simulation 15000 140m p-FZ 10000 [1] 3D, double sided, 250m columns, 300m substrate [Pennicard 2007] [2] p-FZ, 280m, (-30oC, 25ns), strip [Casse 2007] [3] p-FZ, 280m, (-30oC, 25ns), strip [Casse 2004] [4] p-MCZ, 300m, (-30OC, s), pad [Bruzzi 2006] [5] p-MCZ, 300m, (<0OC, s), strip [Bernadini 2007] [6] n-MCZ, 300m, (-30OC, 25ns), strip [Messineo 2007] [7] p-FZ, 140m, (-30oC, 25ns), strip [Casse 2007] [8] n-EPI, 150m, (-30OC, 25ns), strip [Messineo 2007] [9] n-epi Si, 150m, (-30oC, 25ns), pad [Kramberger 2006] [10] n-epi Si, 75m, (-30oC, 25ns), pad [Kramberger 2006] 75m n-EPI See also: [M. Bruzzi et al. NIM A 579 (2007) 754-761] [H.Sadrozinski, IEEE NSS 2007, RD50 talk] 14 10 3D - Example diffraction ring 1500 150m n-EPI 5000 Double-sided 3D, 250 m, simulation! [1] n-in-p (FZ), 280 m [2,3] n-in-p (MCZ), 300m [4,5] p-in-n (MCZ), 300m [6] n-in-p (FZ), 140 m, 500V [7] p-in-n (EPI), 150 m [8,9] p-in-n (EPI), 75m [10] 15 10 Feq [cm-2] 10 50 1000 100 150 16 M.Moll 2007 500 200 61 250 50 100 150 200 250 0 Timepix Front-End chip • Spin-out from HEP, now being spun back for SLHC • Same chip developers as ALICE/LHCb pixel chip 55 x 55 μm pixels elongated in periphery TSV: Hole etched between front & back surfaces – sensor or chip 130nm future development, New! demonstrated rad. hard (Medipix 3 - 400 Mrad) Time Over Threshold -‘Analogue’ information improves resolution 62 LHCb Strawman 1m 390 mrad LHCb Pixel Upgrade Layout modules x 60 mrad cross section at y=0 15 mrad z LHCb Pixel Module interaction region s = 5.3 cm Retract During LHC Injection Beam aperture 7mm to active silicon Hybrid / Cooling outside acceptance 63 Example Pixel Tile Element •Module constructed from common tile elements •Thermally conductive Mechanical Support •‘Edgeless’ Sensor to reduce guard-ring dead space •TSV through sensor to Readout Chip •BCB layer deposited for signal transmission •Hybrid connected to cooling with thermal solder 64 Upgrade Summary • Key Upgrade Elements – Physics Studies – Radiation Hard Vertex Detector – With Displaced Vertex Trigger • Independent of LHC upgrade plans • Major Physics Programme at modest cost – Flavour Sector of New Physics b B s0 ?W s LHCb preparation in good shape Looking forward to first data And an even brighter far future s ?t Bs0 ?W ?t b 65