Photo-induced trimming of chalcogenide-assisted silicon photonic circuits The MIT Faculty has made this article openly available. Please share how this access benefits you. Your story matters. Citation Melloni, Andrea, Stefano Grillanda, Antonio Canciamilla, Carlo Ferrari, Francesco Morichetti, Michael Strain, Marc Sorel, Vivek Singh, Anu Agarwal, and Lionel C. Kimerling. “Photo-induced trimming of chalcogenide-assisted silicon photonic circuits.” In Silicon Photonics VII, edited by Joel Kubby and Graham T. Reed, 82660A-82660A-8. SPIE - International Society for Optical Engineering, 2012. SPIE © 2012 As Published http://dx.doi.org/10.1117/12.908521 Publisher SPIE Version Final published version Accessed Thu May 26 09:01:40 EDT 2016 Citable Link http://hdl.handle.net/1721.1/81199 Terms of Use Article is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use. Detailed Terms Invited Paper Photo-induced trimming of chalcogenide-assisted silicon photonic circuits Andrea Melloni*a, Stefano Grillandaa, Antonio Canciamillaa, Carlo Ferraria, Francesco Morichettia, Michael Strainb, Marc Sorelb, Vivek Singhc, Anu Agarwalc, Lionel C. Kimerlingc a Dipartimento di Elettronica e Informazione, Politecnico di Milano, 20133 Milano, Italy; b School of Engineering, University of Glasgow, Glasgow G12 8LT, United Kingdom; c Microphotonics Center, Massachusetts Institute of Technology, Cambridge, Massachusetts 02139, USA ABSTRACT We present an innovative and efficient technique for post-fabrication trimming of silicon photonic integrated circuits (PICs). Our approach exploits the high photosensitivity of chalcogenide glasses (ChGs) to induce local and permanent modifications of the optical properties and spectral responses of ChG-assisted silicon devices. We experimentally demonstrate the potential of this technique on ring resonator filters realized on a silicon-on-insulator platform, for which post-fabrication treatments enable to counteract the strong sensitivity to technological tolerances. Photosensitive ChGassisted silicon waveguides were realized by deposition of a As2S3 chalcogenide layer on top of conventional silicon channel waveguides. A resonant wavelength shift of 6.7 nm was achieved, largely exceeding the random resonance spread due to fabrication tolerances. Neither the ChG layer deposition, nor the trimming process introduces appreciable additional losses with respect to the bare silicon core waveguide. Performances of the trimming technique, such as speed and saturation effects, as well as nonlinear behavior and infrared writing issues are investigated and experimentally characterized. Keywords: Chalcogenide-assisted photonics, silicon photonics, visible light trimming, photo-induced trimming, photosensitivity, programmable photonics, reconfigurable photonics 1. INTRODUCTION Silicon-on-insulator (SOI) is one of the most promising technological platform for the realization of photonic integrated circuits (PICs) for all-optical processing, network and sensing applications1-6. Thanks to the high confinement of the light in the core of waveguides, SOI technology allows the fabrication and exploitation of devices with large bandwidth, high selectivity and ultra-small footprint. However, one of the main impairments to the full exploitation of SOI devices is the strong sensitivity to fabrication tolerances. This limitation, common to all high-index contrast technologies, is particularly relevant in the SOI platform where, as a rule of thumb, a deviation of 1 nm in the width of the waveguide results in a wavelength shift of 1 nm in the spectral response of any interferometric device. This suggests that, even in the most advanced and reliable fabrication processes, devices with bandwidth of few tens of GHz are hardly controllable7. Therefore, for the complete utilization and exploitation of the properties of the SOI technology, it is mandatory to provide post-fabrication treatments to compensate for technological tolerances and to recover desired functionalities and specifications. In the past several approaches have been proposed. One of the most common solution is to provide on-chip active tuning techniques, like local heating through thermo-optic actuators6 or carrier injection through p-i-n junctions8. These methods however are “power hungry” and require “always-on” mechanisms. Also, these approaches are efficient when a fast and continuous reconfiguration is required, but are less effective to counteract fabrication tolerances. *melloni@elet.polimi.it; phone +39 02 2399 3546; fax +39 02 2399 3413; Silicon Photonics VII, edited by Joel Kubby, Graham Trevor Reed, Proc. of SPIE Vol. 8266, 82660A · © 2012 SPIE · CCC code: 0277-786X/12/$18 · doi: 10.1117/12.908521 Proc. of SPIE Vol. 8266 82660A-1 Downloaded From: http://proceedings.spiedigitallibrary.org/ on 07/25/2013 Terms of Use: http://spiedl.org/terms On the other side, different techniques for the trimming of SOI waveguides have been presented, such as oxide compaction induced by electron beam exposure9, or oxidation by the tip of an atomic force microscope10. These solutions however are quite expensive, require sophisticated equipments, and are hardly in line with low-cost processes. Other approaches exploit waveguides with UV sensitive polymer cladding, whose properties are tailored by UV irradiation. However, polymers suffer from poor time stability and optical degradation at relatively low temperatures11. In this contribution we propose a new, innovative technique to compensate for fabrication tolerances of SOI devices, and therefore to recover functionalities and fully exploit their potentialities. Our approach employs chalcogenide-assisted silicon waveguides, where the silicon core is covered with a thin film of As2S3 chalcogenide glass. The photosensitivity of ChGs is therefore utilized to tailor the local optical properties of the silicon core waveguide. Our trimming technique is simple, accurate, low-cost and low-power consuming. First, we introduce the chalcogenide-assisted silicon waveguide, describing its properties and the central role of ChGs. Then, we describe the main characteristics and performances of the technique employed to trim the devices and issues related to nonlinear behavior and infrared writing. 2. CHALCOGENIDE-ASSISTED SILICON WAVEGUIDES: FABRICATION AND CHARACTERISTICS ChGs are a class of amorphous semiconductor compounds that have been widely employed in optical applications to realize mainly optical fibers and thin film devices. Recently, thanks to the high transparency to infrared radiation and to the high photosensitivity to near band-gap visible light12, they are emerging as a promising technological platform to realize integrated optical devices13. In fact, they have been employed to directly write planar waveguides14 and a wide variety of devices, ranging from Bragg gratings15 to photonic crystal cavities16, ring resonators17 and, more recently, to modify the optical properties of complex coupled resonator filters18,19. The ability of locally inducing a permanent refractive index change in the chalcogenide material by means of a lowintensity, visible light illumination is the key to operate a post fabrication trimming functionality. In fact by changing the refractive index of the material it is possible to change the effective refractive index of the waveguide, and therefore to finely tailor its optical properties. In this work ChGs are employed as a cladding material to cover silicon core waveguides, thus giving birth to chalcogenide-assisted silicon waveguides (Fig. 1). Silicon channel waveguides with a width of 500 nm were written on a SOI wafer with a 220 nm thick silicon layer by means of electron-beam lithography and inductively coupled plasma reactive ion etching process20. Waveguide width is widened up to 5 µm approaching the chip end-facets in order to improve the fiber-to-waveguide coupling efficiency. The oxide buffer layer has a thickness of 2 µm. As depicted in Fig. 1(a), a layer of As2S3 chalcogenide glass with a thickness of 420 nm was thermally evaporated21 on top of the silicon core waveguide. The As2S3 upper cladding does not introduce further appreciable propagation losses, which are about 2 dB/cm. Fig. 1(b) reports a scanning electron microscope (SEM) image of the waveguide cross section, showing a good uniformity and conformity of the deposition process. The 70 nm thick layer between the silicon core and the As2S3 upper cladding is the hydrogen silsesquioxane (HSQ) electron-beam resist, which has not been removed since it does not affect the waveguide properties. The effect of the ChG cladding and the impact of the photosensitivity of the material on the optical properties of the waveguide have been investigated through electromagnetic simulations in order to optimize the thickness of the As2S3 glass. A variation in the index of the As2S3 coverage results in a variation of the effective index of the waveguide and therefore in a wavelength shift of any interferometric device. Fig. 2 reports simulations of the effective index change (a) and of the wavelength shift (b) versus the ChG thickness for both TE (blue solid line) and TM (red dashed line) polarizations, given a variation of 4·10-2 in the index of the As2S3 glass. The green dotted line indicates the value of ChG thickness chosen for the fabrication of the devices. As shown in the figures, the effective index change is always greater on TM polarization than on TE polarization because TM mode is less confined than TE mode. Therefore the same amount of refractive index change corresponds to a higher effective index change on TM polarization than on TE polarization. Proc. of SPIE Vol. 8266 82660A-2 Downloaded From: http://proceedings.spiedigitallibrary.org/ on 07/25/2013 Terms of Use: http://spiedl.org/terms Figure 1. (a) Schematic view and (b) SEM image of the cross section of the waveguide fabricated for the trimming experiments. Figure 2. Electromagnetic simulations of the effective index change (a) and of the wavelength shift (b) versus the chalcogenide thickness for a variation of 4·10-2 in the index of the material for both TE (blue solid line) and TM (red dashed line) polarization. The green dotted line refers to the value of ChG thickness employed for the fabrication of the devices. 3. EXPERIMENTAL TRIMMING: TECHNIQUE, PROPERTIES AND PERFORMANCES The trimming functionality of the chalcogenide-assisted silicon waveguide was demonstrated on a ring resonator coupled to a bus waveguide in an all-pass filter configuration as shown in the optical microscope image reported in Fig. 3. The ring has a circular shape with radius of 40 µm and a free-spectral-range (FSR) of 2.48 nm (310 GHz). Both the ring and the waveguide are covered with As2S3 glass. In order to operate the trimming of the device, a multimode optical fiber directly coupled to a halogen lamp was positioned on top of the ring resonator. The position of the fiber (which has a mode field diameter of 30 µm) was controlled with a micropositioning stage in order to locally and selectively expose specific areas of the device. The lamp employed in the experiment has a spectrum in the visible region (i.e. wavelength ranging from 450 nm to 650 nm) with an intensity that can be varied from 0.5 mW/cm2 to 10 mW/cm2. Fig. 4(a) reports the spectral response of the ring resonator (black dashed line) and the shift of the resonant frequency over a whole free-spectral-range (from blue to red solid line) when exposed to visible light with an intensity of 1 mW/cm2. The trimming process does not introduce any additional loss to the waveguide, in fact no significant changes are visible in the spectral response, shape and width of the notches after the procedure. Proc. of SPIE Vol. 8266 82660A-3 Downloaded From: http://proceedings.spiedigitallibrary.org/ on 07/25/2013 Terms of Use: http://spiedl.org/terms Figure 3. Top view image of the ring resonator filter fabricated for the visible light trimming experiment. Fig. 4(b) shows the behavior of resonant wavelength shift versus the time of exposure to visible light. Visible light illumination with an intensity of 1 mW/cm2 was maintained over time in order to investigate the saturation limit of the trimming process. A wavelength shift of about 6.7 nm was obtained with a time constant (90%) of 400 min (Fig. 4(b)). The wavelength shift achieved corresponds to a variation in the effective index of the waveguide of 2·10-2. After 90 days of storage in dark conditions only a little deviation of 0.15 nm was observed, corresponding to 2% of the total wavelength shift induced. Figure 4. (a) Spectral response of the ring resonator filter (black dashed line) and resonant frequency shift over a full free-spectral-range during the visible light exposure (from blue to red solid line); (b) Wavelength shift of the ring resonance versus time: complete saturation curve for light intensity of 1 mW/cm2; (c) Wavelength shift of the ring resonance versus time: comparison of the trimming velocity for visible light with various intensities (from 1 mW/cm2 to 3 mW/cm2). Proc. of SPIE Vol. 8266 82660A-4 Downloaded From: http://proceedings.spiedigitallibrary.org/ on 07/25/2013 Terms of Use: http://spiedl.org/terms The trimming performance was observed also for different light intensities: Fig. 4(c) reports the wavelength shift measured for 1 mW/cm2 (black circles), 2 mW/cm2 (blue squares) and 3 mW/cm2 (green triangles). It can be noticed that the speed of the trimming process is linear with the intensity of light, with a figure of 60IT pm/min (where IT is the intensity of the trimming light in mW/cm2 units). The shift over the entire FSR is obtained in 38 min with an intensity of 1 mW/cm2, thus indicating that the entire process can be carried out in 1 min at the low intensity of 40 mW/cm2. The design of the waveguide can be further optimized to improve the performances of the trimming functionality. For instance, by narrowing the width of the waveguide it is possible to strengthen the interaction between the ChG upper cladding and the light propagating in the silicon core, and thus to achieve a better trimming performance. However, it must be noticed that a narrower waveguide produces a higher level of losses and backscattering22. Therefore a trade-off between the device specifications and the “trimmability” of the waveguide must be found. 4. NONLINEAR BEHAVIOR AND IR-WRITING It is well known that, when the propagating optical power increases, TPA (two photon absorption) and FCD (free carrier dispersion) effects arise in SOI platform. These non linear phenomena are responsible for both propagation losses increase and refractive index change, that are power dependent and can significantly affect device response and performance7. We recently demonstrated that ChG-based PICs exhibit a certain degree of photosensitivity also to IR radiation (1550 nm wavelength), when optical power density in the waveguide exceeds the threshold of 0.1 GW/cm2. For these reasons, we investigated the non linear behavior of the proposed ChG assisted SOI waveguides. The spectral response of a ChG-assisted SOI ring resonator was measured with a pump-probe experimental setup (Fig. 5) with the launch optical pump power that increases from -1 dBm to 17 dBm (solid lines, red arrow) and then decreases down to -1 dBm again (dotted lines, blue arrow). Due to the build-up factor of the resonator, that is about 16, the pump power propagating inside of the cavity is correspondingly increased up to about 250 mW (taking into account also coupling losses), enhancing therefore all the non linear effects. Figure 5. Spectral response of the ring resonator measured with a pump-probe experimental setup with the launch optical pump power that increases from -1 dBm to 17 dBm (solid lines, red arrow) and then decreases down to -1 dBm (dotted lines, blue arrow). Proc. of SPIE Vol. 8266 82660A-5 Downloaded From: http://proceedings.spiedigitallibrary.org/ on 07/25/2013 Terms of Use: http://spiedl.org/terms The resonance wavelength shift of the ring’s notch is reported in Fig. 6 versus the rising (red line) and decreasing (blue line) value of the launch optical pump power. As expected, two effects can be observed: - the FCD-induced refractive index change in the silicon core produces a maximum non linear red shift of about 30 pm; this effect is completely reversible and disappears when the pump power decreases down to the linear regime. This behavior is in good agreement with previous results on SOI ring resonators7, demonstrating that the ChG cladding does not remarkably modify the TPA and FCD induced effects on silicon waveguides. - the IR-photosensitivity of the ChG cladding produces a red shift of about 11 pm: this effect is the result of an exposure of about 20 minutes to a 1550 nm wavelength radiation with power above 10 dBm. This effect is permanent and the wavelength shift is maintained also when the optical pump power is decreased down to the linear regime. Figure 6. Resonance wavelength shift of the ring’s notch versus the rising (red line) and decreasing (blue line) value of the launch optical pump power. 5. CONCLUSIONS In this contribution we have presented a technique to operate a post-fabrication trimming of PICs and have demonstrated its effectiveness on ChG-assisted silicon waveguides. Our approach exploits the high photosensitivity of ChGs to visible light to induce a change in the optical properties of the silicon device. By selectively exposing the ChG cladding to visible light it is possible to change its refractive index and therefore to induce a variation in the effective index of the silicon core waveguide. With respect to different approaches, our technique is simple, low-cost and low-power consuming, and requires only a common halogen lamp with no need of expensive equipment or additional fabrication steps. The effective index change achieved, which exceeds 10-2, is large enough to compensate the fabrication tolerances of the typical SOI platform. 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