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HMC659
v01.0708
LINEAR & POWER AMPLIFIERS - CHIP
3
GaAs PHEMT MMIC
POWER AMPLIFIER, DC - 15 GHz
Typical Applications
Features
The HMC659 is ideal for:
P1dB Output Power: +26.5 dBm
• Telecom Infrastructure
Gain: 19 dB
• Microwave Radio & VSAT
Output IP3: +35 dBm
• Military & Space
Supply Voltage: +8V @ 300 mA
• Test Instrumentation
50 Ohm Matched Input/Output
• Fiber Optics
Die Size: 3.115 x 1.630 x 0.1 mm
Functional Diagram
General Description
The HMC659 is a GaAs MMIC PHEMT Distributed
Power Amplifier die which operates between DC and
15 GHz. The amplifier provides 19 dB of gain,
+35 dBm output IP3 and +26.5 dBm of output power
at 1 dB gain compression while requiring 300 mA
from a +8V supply. Gain flatness is excellent at ±0.5
dB from DC to 10 GHz making the HMC659 ideal for
EW, ECM, Radar and test equipment applications.
The HMC659 amplifier I/Os are internally matched
to 50 ohms facilitating integration into Mutli-ChipModules (MCMs). All data is taken with the chip
connected via two 0.025mm (1 mil) wire bonds of minimal length 0.31 mm (12 mils).
Electrical Specifi cations, TA = +25° C, Vdd= +8V, Vgg2= +3V, Idd= 300 mA*
Parameter
Min.
Frequency Range
Gain
Typ.
Max.
Min.
DC - 6
16.1
Max.
Min.
17.8
dB
dB
Gain Variation Over Temperature
0.013
0.018
0.025
dB/ °C
Input Return Loss
19
17
15
dB
Output Return Loss
18
17
15
dB
25
dBm
Saturated Output Power (Psat)
26.5
22.5
26
27
27
dBm
Output Third Order Intercept (IP3)
35
32
29
dBm
Noise Figure
2.5
2
3
dBc
Supply Current
(Idd) (Vdd= 8V, Vgg1= -0.8V Typ.)
300
300
300
mA
* Adjust Vgg1 between -2 to 0V to achieve Idd= 300 mA typical.
3 - 110
GHz
±0.6
24
14.8
Units
±0.15
25.5
18.5
Max.
±0.5
23
15.5
Typ.
11 - 15
Gain Flatness
Output Power for 1 dB Compression (P1dB)
19.1
Typ.
6 - 11
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
HMC659
v01.0708
GaAs PHEMT MMIC
POWER AMPLIFIER, DC - 15 GHz
Gain & Return Loss
Gain vs. Temperature
24
30
20
S21
S11
S22
0
3
16
12
+25C
+85C
-55C
8
-10
4
-20
0
-30
0
2
4
6
8
10
12
14
16
0
18
2
4
6
FREQUENCY (GHz)
10
12
14
16
18
Output Return Loss vs. Temperature
Input Return Loss vs. Temperature
0
0
RETURN LOSS (dB)
+25C
+85C
-55C
-5
RETURN LOSS (dB)
8
FREQUENCY (GHz)
-10
-15
-20
+25C
+85C
-55C
-10
-20
-30
-25
-30
-40
0
2
4
6
8
10
12
14
16
0
18
2
4
FREQUENCY (GHz)
0
7
-10
6
NOISE FIGURE (dB)
ISOLATION (dB)
8
10
12
14
16
Noise Figure vs. Temperature
Reverse Isolation vs. Temperature
+25C
+85C
-55C
-20
6
FREQUENCY (GHz)
-30
-40
-50
LINEAR & POWER AMPLIFIERS - CHIP
10
GAIN (dB)
RESPONSE (dB)
20
+25C
+85C
-55C
5
4
3
2
1
-60
0
0
2
4
6
8
FREQUENCY (GHz)
10
12
0
2
4
6
8
10
12
14
16
18
FREQUENCY (GHz)
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
3 - 111
HMC659
v01.0708
GaAs PHEMT MMIC
POWER AMPLIFIER, DC - 15 GHz
Psat vs. Temperature
32
30
30
28
28
Psat (dBm)
32
26
26
24
24
22
22
20
+25C
+85C
-55C
20
0
3
6
9
12
15
0
2.5
5
FREQUENCY (GHz)
7.5
10
12.5
Output IP3 vs. Output Power @ 7GHz
50
45
+25C
+85C
-55C
7.5V
8.0V
8.5V
45
IP3 (dBm)
40
35
30
40
35
25
20
30
2
4
6
8
10
12
14
0
16
4
8
FREQUENCY (GHz)
12
16
20
OUTPUT POWER (dBm)
Gain, Power & Output IP3 vs.
Supply Voltage @ 10 GHz, Fixed Vgg
Gain (dB), P1dB (dBm), Psat (dBm), IP3 (dBm)
0
40
36
32
28
24
20
16
12
7.5
Gain
P1dB
8
Psat
IP3
8.5
Vdd (V)
3 - 112
15
FREQUENCY (GHz)
Output IP3 vs. Temperature
IP3 (dBm)
LINEAR & POWER AMPLIFIERS - CHIP
3
P1dB (dBm)
P1dB vs. Frequency
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
24
28
HMC659
v01.0708
GaAs PHEMT MMIC
POWER AMPLIFIER, DC - 15 GHz
Power Compression @ 7 GHz
Power Compression @ 2 GHz
32
28
24
20
16
12
8
Pout
Gain
PAE
4
0
28
24
3
20
16
12
8
Pout
Gain
PAE
4
0
0
3
6
9
12
15
0
3
6
INPUT POWER (dBm)
12
15
Power Dissipation
Power Compression @ 15 GHz
10
32
28
POWER DISSIPATION (W)
Pout (dBm), GAIN (dB), PAE (%)
9
INPUT POWER (dBm)
24
20
16
12
8
Pout
Gain
PAE
4
0
0
3
6
9
12
15
Max Pdis @ 85C
2 GHz
12 GHz
8
6
4
2
0
-10
-6
INPUT POWER (dBm)
Absolute Maximum Ratings
Drain Bias Voltage (Vdd)
+9 Vdc
-2
2
6
10
14
18
INPUT POWER (dBm)
Typical Supply Current vs. Vdd
Vdd (V)
Idd (mA)
Gate Bias Voltage (Vgg1)
0 to -2 Vdc
+7.5
299
Gate Bias Voltage (Vgg2)
+2V to +4V
+8.0
300
RF Input Power (RFIN)(Vdd = +12V)
+20 dBm
+8.5
301
Channel Temperature
175 °C
Continuous Pdiss (T= 85 °C)
(derate 41 mW/°C above 85 °C)
3.69 W
Thermal Resistance
(channel to die bottom)
24.4 °C/W
Storage Temperature
-65 to 150°C
Operating Temperature
-55 to 85 °C
LINEAR & POWER AMPLIFIERS - CHIP
Pout (dBm), GAIN (dB), PAE (%)
Pout (dBm), GAIN (dB), PAE (%)
32
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
3 - 113
HMC659
v01.0708
GaAs PHEMT MMIC
POWER AMPLIFIER, DC - 15 GHz
Outline Drawing
LINEAR & POWER AMPLIFIERS - CHIP
3
3 - 114
Die Packaging Information [1]
Standard
Alternate
GP-1 (Gel Pack)
[2]
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
NOTES:
1. ALL DIMENSIONS IN INCHES [MILLIMETERS]
2. DIE THICKNESS IS 0.004 (0.100)
3. TYPICAL BOND PAD IS 0.004 (0.100) SQUARE
4. BOND PAD METALIZATION: GOLD
5. BACKSIDE METALLIZATION: GOLD
6. BACKSIDE METAL IS GROUND
7. NO CONNECTION REQUIRED FOR UNLABELED BOND PADS
8. OVERALL DIE SIZE IS ±.002
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
HMC659
v01.0708
GaAs PHEMT MMIC
POWER AMPLIFIER, DC - 15 GHz
Pad Descriptions
Function
Description
1
IN
This pad is DC coupled and matched
to 50 Ohms. Blocking capacitor is required.
2
Vgg2
Gate control 2 for amplifier. Attach bypass
capacitor per application circuit herein. For nominal
operation +3V should be applied to Vgg2.
3
ACG1
Low frequency termination. Attach bypass
capacitor per application circuit herein.
4
ACG2
Low frequency termination. Attach bypass
capacitor per application circuit herein.
5
OUT & Vdd
RF output for amplifier. Connect DC bias (Vdd) network to
provide drain current (Idd). See application circuit herein.
7
ACG3
Low frequency termination. Attach bypass
capacitor per application circuit herein.
6
Vgg1
Gate control 1 for amplifier. Attach bypass
capacitor per application circuit herein. Please
follow “MMIC Amplifier Biasing Procedure”
application note.
Die Bottom
GND
Die bottom must be connected to RF/DC ground.
Interface Schematic
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
3
LINEAR & POWER AMPLIFIERS - CHIP
Pad Number
3 - 115
HMC659
v01.0708
GaAs PHEMT MMIC
POWER AMPLIFIER, DC - 15 GHz
Assembly Diagram
LINEAR & POWER AMPLIFIERS - CHIP
3
Application Circuit
NOTE 1: Drain Bias (Vdd) must be applied through a broadband bias tee
with low series resistance and capable of providing 500mA
3 - 116
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
HMC659
v01.0708
GaAs PHEMT MMIC
POWER AMPLIFIER, DC - 15 GHz
Mounting & Bonding Techniques for Millimeterwave GaAs MMICs
50 Ohm Microstrip transmission lines on 0.127mm (5 mil) thick alumina
thin film substrates are recommended for bringing RF to and from the chip
(Figure 1). If 0.254mm (10 mil) thick alumina thin film substrates must be
used, the die should be raised 0.150mm (6 mils) so that the surface of
the die is coplanar with the surface of the substrate. One way to accomplish this is to attach the 0.102mm (4 mil) thick die to a 0.150mm (6 mil)
thick molybdenum heat spreader (moly-tab) which is then attached to the
ground plane (Figure 2).
0.102mm (0.004”) Thick GaAs MMIC
Wire Bond
0.076mm
(0.003”)
RF Ground Plane
Microstrip substrates should be placed as close to the die as possible in
order to minimize bond wire length. Typical die-to-substrate spacing is
0.076mm to 0.152 mm (3 to 6 mils).
0.127mm (0.005”) Thick Alumina
Thin Film Substrate
Figure 1.
Handling Precautions
Follow these precautions to avoid permanent damage.
Storage: All bare die are placed in either Waffle or Gel based ESD protective containers, and then sealed in an ESD protective bag for shipment.
Once the sealed ESD protective bag has been opened, all die should be
stored in a dry nitrogen environment.
Cleanliness: Handle the chips in a clean environment. DO NOT attempt
to clean the chip using liquid cleaning systems.
Static Sensitivity:
strikes.
0.102mm (0.004”) Thick GaAs MMIC
Wire Bond
0.076mm
(0.003”)
RF Ground Plane
Follow ESD precautions to protect against ESD
Transients: Suppress instrument and bias supply transients while bias is
applied. Use shielded signal and bias cables to minimize inductive pickup.
0.150mm (0.005”) Thick
Moly Tab
0.254mm (0.010”) Thick Alumina
Thin Film Substrate
Figure 2.
General Handling: Handle the chip along the edges with a vacuum collet or with a sharp pair of bent tweezers. The
surface of the chip may have fragile air bridges and should not be touched with vacuum collet, tweezers, or fingers.
Mounting
The chip is back-metallized and can be die mounted with AuSn eutectic preforms or with electrically conductive epoxy.
The mounting surface should be clean and flat.
Eutectic Die Attach: A 80/20 gold tin preform is recommended with a work surface temperature of 255 °C and a tool
temperature of 265 °C. When hot 90/10 nitrogen/hydrogen gas is applied, tool tip temperature should be 290 °C. DO
NOT expose the chip to a temperature greater than 320 °C for more than 20 seconds. No more than 3 seconds of
scrubbing should be required for attachment.
3
LINEAR & POWER AMPLIFIERS - CHIP
The die should be attached directly to the ground plane eutectically or with
conductive epoxy (see HMC general Handling, Mounting, Bonding Note).
Epoxy Die Attach: Apply a minimum amount of epoxy to the mounting surface so that a thin epoxy fillet is observed
around the perimeter of the chip once it is placed into position. Cure epoxy per the manufacturer’s schedule.
Wire Bonding
RF bonds made with two 1 mil wires are recommended. These bonds should be thermosonically bonded with a force
of 40-60 grams. DC bonds of 0.001” (0.025 mm) diameter, thermosonically bonded, are recommended. Ball bonds
should be made with a force of 40-50 grams and wedge bonds at 18-22 grams. All bonds should be made with a
nominal stage temperature of 150 °C. A minimum amount of ultrasonic energy should be applied to achieve reliable
bonds. All bonds should be as short as possible, less than 12 mils (0.31 mm).
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373
Order On-line at www.hittite.com
3 - 117