Octal, 14-Bit, 50 MSPS,
Serial LVDS, 1.8 V ADC
AD9252
Data Sheet
8 analog-to-digital converters (ADCs) integrated into 1 package
93.5 mW ADC power per channel at 50 MSPS
SNR = 73 dB (to Nyquist)
ENOB = 12 bits
SFDR = 84 dBc (to Nyquist)
Excellent linearity
DNL = ±0.4 LSB (typical); INL = ±1.5 LSB (typical)
Serial LVDS (ANSI-644, default)
Low power, reduced signal option (similar to IEEE 1596.3)
Data and frame clock outputs
325 MHz, full-power analog bandwidth
2 V p-p input voltage range
1.8 V supply operation
Serial port control
Full-chip and individual-channel power-down modes
Flexible bit orientation
Built-in and custom digital test pattern generation
Programmable clock and data alignment
Programmable output resolution
Standby mode
APPLICATIONS
Medical imaging and nondestructive ultrasound
Portable ultrasound and digital beam-forming systems
Quadrature radio receivers
Diversity radio receivers
Tape drives
Optical networking
Test equipment
GENERAL DESCRIPTION
The AD9252 is an octal, 14-bit, 50 MSPS ADC with an on-chip
sample-and-hold circuit designed for low cost, low power, small size,
and ease of use. Operating at a conversion rate of up to 50 MSPS,
it is optimized for outstanding dynamic performance and low
power in applications where a small package size is critical.
The ADC requires a single 1.8 V power supply and LVPECL-/
CMOS-/LVDS-compatible sample rate clock for full performance
operation. No external reference or driver components are
required for many applications.
The ADC automatically multiplies the sample rate clock for
the appropriate LVDS serial data rate. A data clock (DCO)
for capturing data on the output and a frame clock (FCO) for
signaling a new output byte are provided. Individual channel
power-down is supported and typically consumes less than
2 mW when all channels are disabled.
FUNCTIONAL BLOCK DIAGRAM
PDWN
AVDD
DRVDD
AD9252
DRGND
14
VIN + A
VIN – A
ADC
VIN + B
VIN – B
ADC
VIN + C
VIN – C
ADC
VIN + D
VIN – D
ADC
VIN + E
VIN – E
ADC
VIN + F
VIN – F
ADC
VIN + G
VIN – G
ADC
VIN + H
VIN – H
ADC
SERIAL
LVDS
D+A
D–A
SERIAL
LVDS
D+B
D–B
SERIAL
LVDS
D+C
D–C
SERIAL
LVDS
D+D
D–D
SERIAL
LVDS
D+E
D–E
SERIAL
LVDS
D+F
D–F
SERIAL
LVDS
D+G
D–G
SERIAL
LVDS
D+H
D–H
14
14
14
14
14
14
14
VREF
SENSE
FCO+
0.5V
REFT
REFB
REF
SELECT
RBIAS
SERIAL PORT
INTERFACE
AGND CSB
SDIO/
ODM
SCLK/
DTP
DATA RATE
MULTIPLIER
CLK+
CLK–
FCO–
DCO+
DCO–
06296-001
FEATURES
Figure 1.
The ADC contains several features designed to maximize
flexibility and minimize system cost, such as programmable
clock and data alignment and programmable digital test pattern
generation. The available digital test patterns include built-in
deterministic and pseudorandom patterns, along with custom userdefined test patterns entered via the serial port interface (SPI).
The AD9252 is available in an RoHS compliant, 64-lead LFCSP. It is
specified over the industrial temperature range of −40°C to +85°C.
PRODUCT HIGHLIGHTS
1.
2.
3.
4.
5.
Small Footprint. Eight ADCs are contained in a small package.
Low Power of 93.5 mW per Channel at 50 MSPS.
Ease of Use. A data clock output (DCO) operates up to
350 MHz and supports double data rate (DDR) operation.
User Flexibility. SPI control offers a wide range of flexible
features to meet specific system requirements.
Pin-Compatible Family. This includes the AD9212 (10-bit)
and AD9222 (12-bit).
Rev. E
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.461.3113 ©2006–2011 Analog Devices, Inc. All rights reserved.
AD9252
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Clock Input Considerations ...................................................... 19
Applications ....................................................................................... 1
Serial Port Interface (SPI) .............................................................. 27
General Description ......................................................................... 1
Hardware Interface ..................................................................... 27
Functional Block Diagram .............................................................. 1
Memory Map .................................................................................. 29
Product Highlights ........................................................................... 1
Reading the Memory Map Table .............................................. 29
Revision History ............................................................................... 2
Reserved Locations .................................................................... 29
Specifications..................................................................................... 3
Default Values ............................................................................. 29
AC Specifications.......................................................................... 4
Logic Levels ................................................................................. 29
Digital Specifications ................................................................... 5
Applications Information .............................................................. 32
Switching Specifications .............................................................. 6
Design Guidelines ...................................................................... 32
Timing Diagrams.......................................................................... 7
Evaluation Board ............................................................................ 33
Absolute Maximum Ratings ............................................................ 9
Power Supplies ............................................................................ 33
Thermal Impedance ..................................................................... 9
Input Signals................................................................................ 33
ESD Caution .................................................................................. 9
Output Signals ............................................................................ 33
Pin Configuration and Function Descriptions ........................... 10
Default Operation and Jumper Selection Settings ................. 34
Equivalent Circuits ......................................................................... 12
Alternative Analog Input Drive Configuration...................... 35
Typical Performance Characteristics ........................................... 14
Outline Dimensions ....................................................................... 52
Theory of Operation ...................................................................... 17
Ordering Guide .......................................................................... 52
Analog Input Considerations.................................................... 17
REVISION HISTORY
12/11—Rev. D to Rev. E
Changes to Output Signals Section and Figure 58 ..................... 33
Change to Default Operation and Jumper Selection Settings
Section .............................................................................................. 34
Added Endnote 2 in Ordering Guide .......................................... 52
4/10—Rev. C to Rev. D
Changes to Address 16 in Table 16............................................... 31
Updated Outline Dimensions ....................................................... 52
Changes to Ordering Guide .......................................................... 52
12/09—Rev. B to Rev. C
Updated Outline Dimensions ....................................................... 52
Changes to Ordering Guide .......................................................... 52
7/09—Rev. A to Rev. B
Changes to Figure 5 ........................................................................ 10
Changes to Figure 38 and Figure 39............................................. 18
Changes to Figure 51 and Figure 52............................................. 25
Updated Outline Dimensions ....................................................... 52
12/07—Rev. 0 to Rev. A
Changes to Features.......................................................................... 1
Changes to Crosstalk Parameter..................................................... 3
Changes to Figure 2 to Figure 4 ...................................................... 7
Changes to Table 9 Endnote .......................................................... 23
Changes to Digital Outputs and Timing Section ....................... 24
Added Table 10 ............................................................................... 24
Changes to Table 11 and Table 12 ................................................ 24
Changes to RBIAS Pin Section ..................................................... 25
Deleted Figure 51 to Figure 52...................................................... 25
Moved Figure 53 ............................................................................. 25
Changes to Serial Port Interface (SPI) Section ........................... 27
Changes to Table 15 ....................................................................... 28
Changes to Reading the Memory Map Table Section ............... 29
Added Applications Information and
Design Guidelines Sections ...................................................... 32
Changes to Input Signals Section ................................................. 33
Changes to Output Signals Section .............................................. 33
Changes to Figure 60...................................................................... 33
Changes to Default Operation and Jumper Selection
Settings Section .......................................................................... 34
Changes to Alternative Analog Input Drive
Configuration Section............................................................... 35
Added Figure 62 and Figure 63 .................................................... 35
Changes to Figure 68...................................................................... 42
Changes to Table 17 ....................................................................... 48
Updated Outline Dimensions ....................................................... 52
Changes to Ordering Guide .......................................................... 52
10/06—Revision 0: Initial Version
Rev. E | Page 2 of 52
Data Sheet
AD9252
SPECIFICATIONS
AVDD = 1.8 V, DRVDD = 1.8 V, 2 V p-p differential input, 1.0 V internal reference, AIN = −0.5 dBFS, unless otherwise noted.
Table 1.
Parameter 1
RESOLUTION
ACCURACY
No Missing Codes
Offset Error
Offset Matching
Gain Error
Gain Matching
Differential Nonlinearity (DNL)
Integral Nonlinearity (INL)
TEMPERATURE DRIFT
Offset Error
Gain Error
Reference Voltage (1 V Mode)
REFERENCE
Output Voltage Error (VREF = 1 V)
Load Regulation @ 1.0 mA (VREF = 1 V)
Input Resistance
ANALOG INPUTS
Differential Input Voltage Range (VREF = 1 V)
Common-Mode Voltage
Differential Input Capacitance
Analog Bandwidth, Full Power
POWER SUPPLY
AVDD
DRVDD
IAVDD
IDRVDD
Total Power Dissipation (Including Output Drivers)
Power-Down Dissipation
Standby Dissipation 2
CROSSTALK
AIN = −0.5 dBFS
Overrange 3
Temperature
Min
14
AD9252-50
Typ
Max
Full
Full
Full
Full
Full
Full
Full
Guaranteed
±1
±3
±1.5
±0.3
±0.4
±1.5
Full
Full
Full
±2
±17
±21
Full
Full
Full
±2
3
6
Full
Full
Full
Full
2
AVDD/2
7
325
Full
Full
Full
Full
Full
Full
Full
Full
Full
1.7
1.7
1.8
1.8
360
55.5
748
2
89
−90
−90
±8
±8
±2.5
±0.7
±1
±4
Unit
Bits
mV
mV
% FS
% FS
LSB
LSB
ppm/°C
ppm/°C
ppm/°C
±30
mV
mV
kΩ
V p-p
V
pF
MHz
1.9
1.9
373.4
58
773
11
V
V
mA
mA
mW
mW
mW
dB
dB
See the AN-835 Application Note, Understanding High Speed ADC Testing and Evaluation, for a complete set of definitions and how these tests were completed.
Can be controlled via the SPI.
3
Overrange condition is specific with 6 dB of the full-scale input range.
1
2
Rev. E | Page 3 of 52
AD9252
Data Sheet
AC SPECIFICATIONS
AVDD = 1.8 V, DRVDD = 1.8 V, 2 V p-p differential input, 1.0 V internal reference, AIN = −0.5 dBFS, unless otherwise noted.
Table 2.
Parameter 1
SIGNAL-TO-NOISE RATIO (SNR)
fIN = 2.4 MHz
fIN = 19.7 MHz
fIN = 35 MHz
fIN = 70 MHz
SIGNAL-TO-NOISE AND DISTORTION RATIO (SINAD)
fIN = 2.4 MHz
fIN = 19.7 MHz
fIN = 35 MHz
fIN = 70 MHz
EFFECTIVE NUMBER OF BITS (ENOB)
fIN = 2.4 MHz
fIN = 19.7 MHz
fIN = 35 MHz
fIN = 70 MHz
SPURIOUS-FREE DYNAMIC RANGE (SFDR)
fIN = 2.4 MHz
fIN = 19.7 MHz
fIN = 35 MHz
fIN = 70 MHz
WORST HARMONIC (SECOND OR THIRD)
fIN = 2.4 MHz
fIN = 19.7 MHz
fIN = 35 MHz
fIN = 70 MHz
WORST OTHER (EXCLUDING SECOND OR THIRD)
fIN = 2.4 MHz
fIN = 19.7 MHz
fIN = 35 MHz
fIN = 70 MHz
TWO-TONE INTERMODULATION DISTORTION (IMD)—AIN1 AND AIN2 = −7.0 dBFS
fIN1 = 15 MHz, fIN2 = 16 MHz
fIN1 = 70 MHz, fIN2 = 71 MHz
1
Temperature
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Full
Min
71
70.2
11.5
73
AD9252-50
Typ
Max
Unit
73.2
73
72.7
71
dB
dB
dB
dB
72.5
72.2
72
70.5
dB
dB
dB
dB
11.87
11.84
11.79
11.5
Bits
Bits
Bits
Bits
85
84
83
79
dBc
dBc
dBc
dBc
Full
Full
Full
Full
−85
−84
−83
−79
Full
Full
Full
Full
−90
−90
−90
−89
25°C
25°C
80.0
80.0
−73
−80
dBc
dBc
dBc
dBc
dBc
dBc
dBc
dBc
dBc
dBc
See the AN-835 Application Note, Understanding High Speed ADC Testing and Evaluation, for a complete set of definitions and how these tests were completed.
Rev. E | Page 4 of 52
Data Sheet
AD9252
DIGITAL SPECIFICATIONS
AVDD = 1.8 V, DRVDD = 1.8 V, 2 V p-p differential input, 1.0 V internal reference, AIN = −0.5 dBFS, unless otherwise noted.
Table 3.
Parameter 1
CLOCK INPUTS (CLK+, CLK−)
Logic Compliance
Differential Input Voltage 2
Input Common-Mode Voltage
Input Resistance (Differential)
Input Capacitance
LOGIC INPUTS (PDWN, SCLK/DTP)
Logic 1 Voltage
Logic 0 Voltage
Input Resistance
Input Capacitance
LOGIC INPUT (CSB)
Logic 1 Voltage
Logic 0 Voltage
Input Resistance
Input Capacitance
LOGIC INPUT (SDIO/ODM)
Logic 1 Voltage
Logic 0 Voltage
Input Resistance
Input Capacitance
LOGIC OUTPUT (SDIO/ODM)3
Logic 1 Voltage (IOH = 800 μA)
Logic 0 Voltage (IOL = 50 μA)
DIGITAL OUTPUTS (D + x, D − x), (ANSI-644)
Logic Compliance
Differential Output Voltage (VOD)
Output Offset Voltage (VOS)
Output Coding (Default)
DIGITAL OUTPUTS (D + x, D − x),
(LOW POWER, REDUCED SIGNAL OPTION)
Logic Compliance
Differential Output Voltage (VOD)
Output Offset Voltage (VOS)
Output Coding (Default)
1
2
3
Temperature
Min
Full
Full
25°C
25°C
250
Full
Full
25°C
25°C
1.2
Full
Full
25°C
25°C
1.2
Full
Full
25°C
25°C
1.2
0
AD9252-50
Typ
Max
Unit
CMOS/LVDS/LVPECL
mV p-p
V
kΩ
pF
1.2
20
1.5
3.6
0.3
V
V
kΩ
pF
3.6
0.3
V
V
kΩ
pF
DRVDD + 0.3
0.3
V
V
kΩ
pF
30
0.5
70
0.5
30
2
Full
Full
1.79
0.05
V
V
454
1.375
mV
V
250
1.30
mV
V
LVDS
Full
Full
247
1.125
Offset binary
LVDS
Full
Full
150
1.10
Offset binary
See the AN-835 Application Note, Understanding High Speed ADC Testing and Evaluation, for a complete set of definitions and how these tests were completed.
This is specified for LVDS and LVPECL only.
This is specified for 13 SDIO pins sharing the same connection.
Rev. E | Page 5 of 52
AD9252
Data Sheet
SWITCHING SPECIFICATIONS
AVDD = 1.8 V, DRVDD = 1.8 V, 2 V p-p differential input, 1.0 V internal reference, AIN = −0.5 dBFS, unless otherwise noted.
Table 4.
Parameter 1
CLOCK 2
Maximum Clock Rate
Minimum Clock Rate
Clock Pulse Width High (tEH)
Clock Pulse Width Low (tEL)
OUTPUT PARAMETERS2, 3
Propagation Delay (tPD)
Rise Time (tR) (20% to 80%)
Fall Time (tF) (20% to 80%)
FCO Propagation Delay (tFCO)
DCO Propagation Delay (tCPD) 4
DCO to Data Delay (tDATA)4
DCO to FCO Delay (tFRAME)4
Data-to-Data Skew (tDATA-MAX − tDATA-MIN)
Wake-Up Time (Standby)
Wake-Up Time (Power-Down)
Pipeline Latency
APERTURE
Aperture Delay (tA)
Aperture Uncertainty (Jitter)
Out-of-Range Recovery Time
Temp
Min
Full
Full
Full
Full
50
Full
Full
Full
Full
Full
Full
Full
Full
25°C
25°C
Full
1.5
AD9252-50
Typ
Max
10
10.0
10.0
1.5
(tSAMPLE/28) − 300
(tSAMPLE/28) − 300
25°C
25°C
25°C
2.3
300
300
2.3
tFCO + (tSAMPLE/28)
(tSAMPLE/28)
(tSAMPLE/28)
±50
600
375
8
750
<1
1
3.1
3.1
(tSAMPLE/28) + 300
(tSAMPLE/28) + 300
±200
Unit
MSPS
MSPS
ns
ns
ns
ps
ps
ns
ns
ps
ps
ps
ns
μs
CLK cycles
ps
ps rms
CLK cycles
See the AN-835 Application Note, Understanding High Speed ADC Testing and Evaluation, for a complete set of definitions and how these tests were completed.
Can be adjusted via the SPI.
3
Measurements were made using a part soldered to FR-4 material.
4
tSAMPLE/28 is based on the number of bits divided by 2 because the delays are based on half duty cycles.
1
2
Rev. E | Page 6 of 52
Data Sheet
AD9252
TIMING DIAGRAMS
N–1
VIN ± x
tA
N
tEH
CLK–
tEL
CLK+
tCPD
DCO–
DCO+
tFRAME
tFCO
FCO–
FCO+
tPD
tDATA
MSB
N–9
D12
N–9
D11
N–9
D10
N–9
D9
N–9
D8
N–9
D7
N–9
D6
N–9
D5
N–9
D4
N–9
D3
N–9
D2
N–9
D1
N–9
D0
N–9
MSB
N–8
D12
N–8
D+x
Figure 2. 14-Bit Data Serial Stream (Default), MSB First
N–1
VIN ± x
tA
N
tEH
CLK–
tEL
CLK+
tCPD
DCO–
DCO+
tFRAME
tFCO
FCO–
FCO+
tPD
tDATA
MSB
N–9
D10
N–9
D9
N–9
D8
N–9
D7
N–9
D6
N–9
D5
N–9
D+x
Figure 3. 12-Bit Data Serial Stream, MSB First
Rev. E | Page 7 of 52
D4
N–9
D3
N–9
D2
N–9
D1
N–9
D0
N–9
MSB
N–8
D10
N–8
06296-003
D–x
06296-002
D–x
AD9252
Data Sheet
N–1
VIN ± x
tA
N
tEL
tEH
CLK–
CLK+
tCPD
DCO–
DCO+
tFRAME
tFCO
FCO–
FCO+
tPD
tDATA
LSB
N–9
D0
N–9
D1
N–9
D2
N–9
D3
N–9
D4
N–9
D5
N–9
D6
N–9
D+x
Figure 4. 14-Bit Data Serial Stream, LSB First
Rev. E | Page 8 of 52
D7
N–9
D8
N–9
D9
N–9
D10
N–9
D11
N–9
D12
N–9
LSB
N–8
D0
N–8
06296-004
D–x
Data Sheet
AD9252
ABSOLUTE MAXIMUM RATINGS
THERMAL IMPEDANCE
Table 5.
Parameter
ELECTRICAL
AVDD
DRVDD
AGND
AVDD
Digital Outputs
(D + x, D − x, DCO+,
DCO−, FCO+, FCO−)
CLK+, CLK−
VIN + x, VIN − x
SDIO/ODM
PDWN, SCLK/DTP, CSB
REFT, REFB, RBIAS
VREF, SENSE
ENVIRONMENTAL
Operating Temperature
Range (Ambient)
Storage Temperature
Range (Ambient)
Maximum Junction
Temperature
Lead Temperature
(Soldering, 10 sec)
Table 6.
With
Respect To
Rating
AGND
DRGND
DRGND
DRVDD
DRGND
−0.3 V to +2.0 V
−0.3 V to +2.0 V
−0.3 V to +0.3 V
−2.0 V to +2.0 V
−0.3 V to +2.0 V
Air Flow Velocity (m/s)
0.0
1.0
2.5
1
θJB
θJC
8.7
0.6
Unit
°C/W
°C/W
°C/W
θJA for a 4-layer PCB with solid ground plane (simulated). Exposed pad
soldered to PCB.
ESD CAUTION
AGND
AGND
AGND
AGND
AGND
AGND
θJA1
17.7
15.5
13.9
−0.3 V to +3.9 V
−0.3 V to +2.0 V
−0.3 V to +2.0 V
−0.3 V to +3.9 V
−0.3 V to +2.0 V
−0.3 V to +2.0 V
−40°C to +85°C
−65°C to +150°C
150°C
300°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Rev. E | Page 9 of 52
AD9252
Data Sheet
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
VIN + F
VIN – F
AVDD
VIN – E
VIN + E
AVDD
REFT
REFB
VREF
SENSE
RBIAS
VIN + D
VIN – D
AVDD
VIN – C
VIN + C
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
PIN 1
INDICATOR
EXPOSED PADDLE, PIN 0
(BOTTOM OF PACKAGE)
AD9252
TOP VIEW
(Not to Scale)
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
AVDD
VIN + B
VIN – B
AVDD
VIN – A
VIN + A
AVDD
PDWN
CSB
SDIO/ODM
SCLK/DTP
AVDD
DRGND
DRVDD
D+A
D–A
NOTES
1. THE EXPOSED PAD MUST BE CONNECTED TO ANALOG GROUND
Figure 5. 64-Lead LFCSP Pin Configuration, Top View
Table 7. Pin Function Descriptions
Pin No.
0
1, 4, 7, 8, 11,
12, 37, 42, 45,
48, 51, 59, 62
13, 36
14, 35
2
3
5
6
9
10
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
Mnemonic
AGND
AVDD
Description
Analog Ground (Exposed Paddle)
1.8 V Analog Supply
DRGND
DRVDD
VIN + G
VIN − G
VIN − H
VIN + H
CLK−
CLK+
D−H
D+H
D−G
D+G
D−F
D+F
D−E
D+E
DCO−
DCO+
FCO−
FCO+
D−D
D+D
D−C
D+C
D−B
Digital Output Driver Ground
1.8 V Digital Output Driver Supply
ADC G Analog Input True
ADC G Analog Input Complement
ADC H Analog Input Complement
ADC H Analog Input True
Input Clock Complement
Input Clock True
ADC H Digital Output Complement
ADC H Digital Output True
ADC G Digital Output Complement
ADC G Digital Output True
ADC F Digital Output Complement
ADC F Digital Output True
ADC E Digital Output Complement
ADC E Digital Output True
Data Clock Digital Output Complement
Data Clock Digital Output True
Frame Clock Digital Output Complement
Frame Clock Digital Output True
ADC D Digital Output Complement
ADC D Digital Output True
ADC C Digital Output Complement
ADC C Digital Output True
ADC B Digital Output Complement
Rev. E | Page 10 of 52
06296-005
D–G
D+G
D–F
D+F
D–E
D+E
DCO–
DCO+
FCO–
FCO+
D–D
D+D
D–C
D+C
D–B
D+B
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
AVDD
VIN + G
VIN – G
AVDD
VIN – H
VIN + H
AVDD
AVDD
CLK–
CLK+
AVDD
AVDD
DRGND
DRVDD
D–H
D+H
Data Sheet
Pin No.
32
33
34
38
39
40
41
43
44
46
47
49
50
52
53
54
55
56
57
58
60
61
63
64
AD9252
Mnemonic
D+B
D−A
D+A
SCLK/DTP
SDIO/ODM
CSB
PDWN
VIN + A
VIN − A
VIN − B
VIN + B
VIN + C
VIN − C
VIN − D
VIN + D
RBIAS
SENSE
VREF
REFB
REFT
VIN + E
VIN − E
VIN − F
VIN + F
Description
ADC B Digital Output True
ADC A Digital Output Complement
ADC A Digital Output True
Serial Clock/Digital Test Pattern
Serial Data Input-Output/Output Driver Mode
Chip Select Bar
Power-Down
ADC A Analog Input True
ADC A Analog Input Complement
ADC B Analog Input Complement
ADC B Analog Input True
ADC C Analog Input True
ADC C Analog Input Complement
ADC D Analog Input Complement
ADC D Analog Input True
External Resistor to Set the Internal ADC Core Bias Current
Reference Mode Selection
Voltage Reference Input/Output
Negative Differential Reference
Positive Differential Reference
ADC E Analog Input True
ADC E Analog Input Complement
ADC F Analog Input Complement
ADC F Analog Input True
Rev. E | Page 11 of 52
AD9252
Data Sheet
EQUIVALENT CIRCUITS
DRVDD
V
V
D–x
D+x
06296-006
V
DRGND
Figure 9. Equivalent Digital Output Circuit
Figure 6. Equivalent Analog Input Circuit
CLK+
V
06296-009
VIN ± x
10Ω
10kΩ
1.25V
10kΩ
SCLK/DTP OR PDWN
10Ω
1kΩ
30kΩ
06296-010
06296-007
CLK–
Figure 10. Equivalent SCLK/DTP or PDWN Input Circuit
Figure 7. Equivalent Clock Input Circuit
RBIAS
30kΩ
06296-011
350Ω
06296-008
SDIO/ODM
100Ω
Figure 11. Equivalent RBIAS Circuit
Figure 8. Equivalent SDIO/ODM Input Circuit
Rev. E | Page 12 of 52
Data Sheet
AD9252
AVDD
70kΩ
CSB
1kΩ
6kΩ
Figure 12. Equivalent CSB Input Circuit
Figure 14. Equivalent VREF Circuit
1kΩ
06296-013
SENSE
06296-014
06296-012
VREF
Figure 13. Equivalent SENSE Circuit
Rev. E | Page 13 of 52
AD9252
Data Sheet
TYPICAL PERFORMANCE CHARACTERISTICS
0
AIN = –0.5dBFS
SNR = 71.16dB
ENOB = 11.53 BITS
–20
SFDR = 72.92dBc
AMPLITUDE (dBFS)
–20
–40
–60
–80
–60
–80
0
5
10
15
20
25
FREQUENCY (MHz)
–120
06296-048
–120
0
5
10
15
25
20
FREQUENCY (MHz)
Figure 15. Single-Tone 32k FFT with fIN = 2.3 MHz, fSAMPLE = 50 MSPS
06296-051
–100
–100
Figure 18. Single-Tone 32k FFT with fIN = 120 MHz, fSAMPLE = 50 MSPS
90
0
AIN = –0.5dBFS
SNR = 72.98dB
ENOB = 11.83 BITS
–20 SFDR = 83.8dBc
SFDR
85
–40
SNR/SFDR (dB)
–60
–80
80
75
SNR
70
65
–100
0
5
10
15
20
25
FREQUENCY (MHz)
60
10
06296-049
–120
25
30
35
40
45
50
50
Figure 19. SNR/SFDR vs. fSAMPLE, fIN = 10.3 MHz, AD9252-50
90
AIN = –0.5dBFS
SNR = 72.36dB
ENOB = 11.73 BITS
SFDR = 86.21dBc
–20
20
ENCODE RATE (MSPS)
Figure 16. Single-Tone 32k FFT with fIN = 35 MHz, fSAMPLE = 50 MSPS
0
15
06296-039
AMPLITUDE (dBFS)
–40
06296-040
AMPLITUDE (dBFS)
0
AIN = –0.5dBFS
SNR = 73.71dB
ENOB = 11.95 BITS
SFDR = 85.86dBc
85
SNR/SFDR (dB)
AMPLITUDE (dBFS)
SFDR
–40
–60
–80
80
75
SNR
70
65
–120
0
5
10
15
FREQUENCY (MHz)
20
25
06296-050
–100
Figure 17. Single-Tone 32k FFT with fIN = 70 MHz, fSAMPLE = 50 MSPS
60
10
15
20
25
30
35
40
45
ENCODE RATE (MSPS)
Figure 20. SNR/SFDR vs. fSAMPLE, fIN = 19.7 MHz, AD9252-50
Rev. E | Page 14 of 52
Data Sheet
AD9252
90
0
AIN1 AND AIN2 = –7dBFS
SFDR = 83.64dB
IMD2 = 95.57dBc
–20 IMD3 = 84.26dBc
80
SFDR
AMPLITUDE (dBFS)
SNR/SFDR (dB)
70
60
50
80dB REFERENCE
40
–40
–60
–80
SNR
30
–100
–50
–40
–30
–20
ANALOG INPUT LEVEL (dBFS)
–10
0
–120
0
Figure 21. SNR/SFDR vs. Analog Input Level, fIN = 10.3 MHz, fSAMPLE = 50 MSPS
5
10
15
FREQUENCY (MHz)
20
25
06296-044
10
–60
06296-041
20
Figure 24. Two-Tone 32k FFT with fIN1 = 70 MHz and
fIN2 = 71 MHz, fSAMPLE = 50 MSPS
90
90
80
85
SFDR
SFDR
80
60
SNR/SFDR (dB)
SNR/SFDR (dB)
70
50
80dB REFERENCE
40
SNR
75
SNR
70
30
65
–50
–40
–30
–20
ANALOG INPUT LEVEL (dBFS)
–10
0
60
1
90
AIN1 AND AIN2 = –7dBFS
SFDR = 86.27dB
IMD2 = 97.82dBc
IMD3 = 86.13dBc
85
–40
SINAD/SFDR (dB)
–60
–80
–100
SFDR
80
75
SINAD
70
65
0
5
10
15
FREQUENCY (MHz)
20
Figure 23. Two-Tone 32k FFT with fIN1 = 15 MHz and
fIN2 = 16 MHz, fSAMPLE = 50 MSPS
25
60
–40
06296-043
–120
–20
0
20
40
TEMPERATURE (°C)
60
80
06296-046
AMPLITUDE (dBFS)
–20
1000
Figure 25. SNR/SFDR vs. fIN, fSAMPLE = 50 MSPS
Figure 22. SNR/SFDR vs. Analog Input Level, fIN = 19.7 MHz, fSAMPLE = 50 MSPS
0
10
100
ANALOG INPUT FREQUENCY (MHz)
06296-045
10
–60
06296-042
20
Figure 26. SINAD/SFDR vs. Temperature, fIN = 19.7 MHz, fSAMPLE = 50 MSPS
Rev. E | Page 15 of 52
AD9252
Data Sheet
2.0
1.8
1.5
1.6
NUMBER OF HITS (Millions)
1.047LSB rms
1.0
0
–0.5
–1.0
–1.5
1.2
1.0
0.8
0.6
0.4
0.2
0
2000
4000
6000
8000
10000 12000 14000 16000
CODE
0
06296-053
–2.0
N–3
N–1
N
N+1
N+2
N+3
CODE
Figure 27. INL, fIN = 2.3 MHz, fSAMPLE = 50 MSPS
Figure 30. Input-Referred Noise Histogram, fSAMPLE = 50 MSPS
1.0
0
NPR = 62.5dB
NOTCH = 18.0MHz
NOTCH WIDTH = 2.3MHz
0.8
–20
0.6
AMPLITUDE (dBFS)
0.4
DNL (LSB)
N–2
06296-054
INL (LSB)
0.5
1.4
0.2
0
–0.2
–0.4
–0.6
–40
–60
–80
–100
0
2000
4000
6000
8000
10000 12000 14000 16000
CODE
–120
06296-052
–1.0
0
5
10
20
15
25
FREQUENCY (MHz)
Figure 28. DNL, fIN = 2.3 MHz, fSAMPLE = 50 MSPS
06296-038
–0.8
Figure 31. Noise Power Ratio (NPR), fSAMPLE = 50 MSPS
–30
0
–1
–35
–3dB BANDWIDTH = 325MHz
–2
AMPLITUDE (dBFS)
–3
–45
–50
–55
–4
–5
–6
–7
–8
–60
–9
–65
–70
0
5
10
15
20
25
30
35
FREQUENCY (MHz)
40
Figure 29. CMRR vs. Frequency, fSAMPLE = 50 MSPS
–11
0
50
100
150
200
250
300
350
400
450
500
FREQUENCY (MHz)
Figure 32. Full-Power Bandwidth vs. Frequency, fSAMPLE = 50 MSPS
Rev. E | Page 16 of 52
06296-037
–10
06296-055
CMRR (dB)
–40
Data Sheet
AD9252
THEORY OF OPERATION
The AD9252 architecture consists of a pipelined ADC divided
into three sections: a 4-bit first stage followed by eight 1.5-bit
stages and a 3-bit flash. Each stage provides sufficient overlap
to correct for flash errors in the preceding stage. The quantized
outputs from each stage are combined into a final 14-bit result
in the digital correction logic. The pipelined architecture permits
the first stage to operate with a new input sample while the
remaining stages operate with preceding samples. Sampling
occurs on the rising edge of the clock.
Each stage of the pipeline, excluding the last, consists of a low
resolution flash ADC connected to a switched-capacitor DAC
and an interstage residue amplifier (for example, a multiplying
digital-to-analog converter (MDAC)). The residue amplifier
magnifies the difference between the reconstructed DAC output
and the flash input for the next stage in the pipeline. One bit of
redundancy is used in each stage to facilitate digital correction
of flash errors. The last stage simply consists of a flash ADC.
front end at high IF frequencies. Either a shunt capacitor or two
single-ended capacitors can be placed on the inputs to provide a
matching passive network. This ultimately creates a low-pass
filter at the input to limit unwanted broadband noise. See the
AN-742 Application Note, Frequency Domain Response of
Switched-Capacitor ADCs; the AN-827 Application Note, A
Resonant Approach to Interfacing Amplifiers to Switched-Capacitor
ADCs; and the Analog Dialogue article “Transformer-Coupled
Front-End for Wideband A/D Converters” (Volume 39, April 2005)
for more information. In general, the precise values depend on
the application.
The analog inputs of the AD9252 are not internally dc-biased.
Therefore, in ac-coupled applications, the user must provide
this bias externally. Setting the device so that VCM = AVDD/2 is
recommended for optimum performance, but the device can
function over a wider range with reasonable performance, as
shown in Figure 34 and Figure 35.
The output staging block aligns the data, corrects errors, and
passes the data to the output buffers. The data is then serialized
and aligned to the frame and data clocks.
90
SNR/SFDR (dB)
ANALOG INPUT CONSIDERATIONS
The analog input to the AD9252 is a differential switchedcapacitor circuit designed for processing differential input signals.
This circuit can support a wide common-mode range while
maintaining excellent performance. An input common-mode
voltage of midsupply minimizes signal-dependent errors and
provides optimum performance.
SFDR (dBc)
85
80
75
SNR (dB)
70
65
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
06296-056
0
H
1.6
06296-057
60
ANALOG INPUT COMMON-MODE VOLTAGE (V)
Figure 34. SNR/SFDR vs. Common-Mode Voltage,
fIN = 2.3 MHz, fSAMPLE = 50 MSPS
CPAR
H
VIN + x
CSAMPLE
S
90
S
S
S
CSAMPLE
85
SFDR (dBc)
VIN – x
H
Figure 33. Switched-Capacitor Input Circuit
The clock signal alternately switches the input circuit between
sample mode and hold mode (see Figure 33). When the input
circuit is switched into sample mode, the signal source must be
capable of charging the sample capacitors and settling within
one-half of a clock cycle. A small resistor in series with each
input can help reduce the peak transient current injected from
the output stage of the driving source. In addition, low-Q inductors
or ferrite beads can be placed on each leg of the input to reduce
high differential capacitance at the analog inputs and therefore
achieve the maximum bandwidth of the ADC. Such use of low-Q
inductors or ferrite beads is required when driving the converter
SNR/SFDR (dB)
CPAR
06296-017
H
Rev. E | Page 17 of 52
80
75
SNR (dB)
70
65
60
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
ANALOG INPUT COMMON-MODE VOLTAGE (V)
Figure 35. SNR/SFDR vs. Common-Mode Voltage,
fIN = 35 MHz, fSAMPLE = 50 MSPS
AD9252
Data Sheet
ADT1-1WT
1:1 Z RATIO
For best dynamic performance, the source impedances driving
VIN + x and VIN − x should be matched such that common-mode
settling errors are symmetrical. These errors are reduced by the
common-mode rejection of the ADC. An internal reference buffer
creates the positive and negative reference voltages, REFT and
REFB, respectively, that define the span of the ADC core. The
output common mode of the reference buffer is set to midsupply,
and the REFT and REFB voltages and span are defined as
2V p-p
C
R
49.9Ω
VIN + x
ADC
AD9252
CDIFF1
R
AVDD
VIN – x
AGND
C
1kΩ
1kΩ
REFT = 1/2 (AVDD + VREF)
REFB = 1/2 (AVDD − VREF)
Span = 2 × (REFT − REFB) = 2 × VREF
06296-018
0.1μF
1C
DIFF
IS OPTIONAL.
Figure 36. Differential Transformer-Coupled Configuration
for Baseband Applications
2V p-p
It can be seen from these equations that the REFT and REFB
voltages are symmetrical about the midsupply voltage and, by
definition, the input span is twice the value of the VREF voltage.
16nH
ADT1-1WT
0.1μF 1:1 Z RATIO 16nH
33Ω
VIN+ x
65Ω
499Ω
16nH
2.2pF
ADC
AD9252
1kΩ
33Ω
VIN– x
AVDD
Maximum SNR performance is achieved by setting the ADC to
the largest span in a differential configuration. In the case of the
AD9252, the largest input span available is 2 V p-p.
1kΩ
Differential Input Configurations
06296-019
0.1μF
1kΩ
Figure 37. Differential Transformer-Coupled Configuration for IF Applications
There are several ways to drive the AD9252 either actively or
passively; however, optimum performance is achieved by driving
the analog input differentially. For example, using the AD8334
differential driver to drive the AD9252 provides excellent performance and a flexible interface to the ADC (see Figure 39) for
baseband applications. This configuration is commonly used
for medical ultrasound systems.
Single-Ended Input Configuration
A single-ended input may provide adequate performance in costsensitive applications. In this configuration, SFDR and distortion
performance degrade due to the large input common-mode swing.
If the application requires a single-ended input configuration,
ensure that the source impedances on each input are well matched
in order to achieve the best possible performance. A full-scale input
of 2 V p-p can still be applied to the ADC’s VIN + x pin while the
VIN − x pin is terminated. Figure 38 details a typical singleended input configuration.
For applications where SNR is a key parameter, differential
transformer coupling is the recommended input configuration
(see Figure 36 and Figure 37), because the noise performance of
most amplifiers is not adequate to achieve the true performance
of the AD9252.
AVDD
C
1kΩ
Regardless of the configuration, the value of the shunt capacitor,
C, is dependent on the input frequency and may need to be
reduced or removed.
2V p-p
R
1kΩ 25Ω
R
VIN – x
C
1kΩ
06296-020
0.1µF
ADC
AD9252
CDIFF1
AVDD
1C
DIFF
VIN + x
0.1µF 1kΩ
49.9Ω
IS OPTIONAL.
Figure 38. Single-Ended Input Configuration
0.1μF
0.1μF 120nH
VIP
VOH
INH
1V p-p
187Ω
AD8334
22pF
0.1μF
LNA
VGA
374Ω
LMD
VOL
LON
18nF
274Ω
VIN + x
VIN
187Ω
R
VIN – x
0.1μF
0.1μF
0.1μF
Figure 39. Differential Input Configuration Using the AD8334
Rev. E | Page 18 of 52
ADC
AD9252
C
1.0kΩ
0.1μF
R
1.0kΩ
AVDD
10μF
1kΩ
1kΩ
06296-021
LOP
Data Sheet
AD9252
For optimum performance, the AD9252 sample clock inputs
(CLK+ and CLK−) should be clocked with a differential signal.
This signal is typically ac-coupled into the CLK+ and CLK− pins
via a transformer or capacitors. These pins are biased internally
and require no additional biasing.
Figure 40 shows the preferred method for clocking the AD9252.
The low jitter clock source is converted from single-ended to
differential using an RF transformer. The back-to-back Schottky
diodes across the secondary transformer limit clock excursions
into the AD9252 to approximately 0.8 V p-p differential. This
helps prevent the large voltage swings of the clock from feeding
through to other portions of the AD9252, and it preserves the
fast rise and fall times of the signal, which are critical to low
jitter performance.
CLK+
50Ω
0.1µF
CLK+
CLK
CMOS DRIVER
0.1µF
CLK
50Ω1
CMOS DRIVER
AD9510/AD9511/
AD9512/AD9513/
AD9514/AD9515
0.1µF
CLK+
100Ω
PECL DRIVER
0.1µF
ADC
AD9252
CLK–
CLK
240Ω
240Ω
06296-023
150Ω
0.1µF
CLK
RESISTORS ARE OPTIONAL.
Figure 41. Differential PECL Sample Clock
AD9510/AD9511/
AD9512/AD9513/
AD9514/AD9515
0.1µF
CLK+
0.1µF
CLK–
CLK+
LVDS DRIVER
100Ω
0.1µF
CLK
ADC
AD9252
CLK–
50Ω1
150Ω RESISTORS ARE OPTIONAL.
Figure 42. Differential LVDS Sample Clock
06296-024
50Ω1
0.1µF
CLK
OPTIONAL 0.1µF
100Ω
CLK
Another option is to ac-couple a differential PECL signal to the
sample clock input pins as shown in Figure 41. The AD9510/
AD9511/AD9512/AD9513/AD9514/AD9515 family of clock
drivers offers excellent jitter performance.
50Ω1
39kΩ
AD9510/AD9511/
AD9512/AD9513/
AD9514/AD9515
0.1µF
CLK+
06296-022
SCHOTTKY
DIODES:
HSM2812
Figure 40. Transformer-Coupled Differential Clock
50Ω1
CLK–
0.1µF
ADC
AD9252
CLK–
CLK–
ADC
AD9252
CLK
CLK+
0.1µF
0.1µF
CLK+
Figure 43. Single-Ended 1.8 V CMOS Sample Clock
100Ω
CLK+
OPTIONAL
0.1µF
100Ω
50Ω1
150Ω RESISTOR IS OPTIONAL.
Mini-Circuits®
ADT1-1WT, 1:1Z
0.1µF
XFMR
0.1µF
AD9510/AD9511/
AD9512/AD9513/
AD9514/AD9515
0.1µF
0.1µF
CLK+
ADC
AD9252
CLK–
150Ω
RESISTOR IS OPTIONAL.
06296-026
0.1µF
In some applications, it is acceptable to drive the sample clock
inputs with a single-ended CMOS signal. In such applications,
CLK+ should be driven directly from a CMOS gate, and the
CLK− pin should be bypassed to ground with a 0.1 μF capacitor
in parallel with a 39 kΩ resistor (see Figure 43). Although the
CLK+ input circuit supply is AVDD (1.8 V), this input is
designed to withstand input voltages of up to 3.3 V, making the
selection of the drive logic voltage very flexible.
06296-025
CLOCK INPUT CONSIDERATIONS
Figure 44. Single-Ended 3.3 V CMOS Sample Clock
Clock Duty Cycle Considerations
Typical high speed ADCs use both clock edges to generate a
variety of internal timing signals. As a result, these ADCs may
be sensitive to the clock duty cycle. Commonly, a 5% tolerance is
required on the clock duty cycle to maintain dynamic performance
characteristics. The AD9252 contains a duty cycle stabilizer (DCS)
that retimes the nonsampling edge, providing an internal clock
signal with a nominal 50% duty cycle. This allows a wide range
of clock input duty cycles without affecting the performance of
the AD9252. When the DCS is on, noise and distortion performance are nearly flat for a wide range of duty cycles. However,
some applications may require the DCS function to be off. If so,
keep in mind that the dynamic range performance can be affected
when operated in this mode. See the Memory Map section for
more details on using this feature.
The duty cycle stabilizer uses a delay-locked loop (DLL) to
create the nonsampling edge. As a result, any changes to the
sampling frequency require approximately eight clock cycles
to allow the DLL to acquire and lock to the new rate.
Rev. E | Page 19 of 52
AD9252
Data Sheet
Clock Jitter Considerations
Power Dissipation and Power-Down Mode
High speed, high resolution ADCs are sensitive to the quality of the
clock input. The degradation in SNR at a given input frequency
(fA) due only to aperture jitter (tJ) can be calculated by
As shown in Figure 46, the power dissipated by the AD9252 is
proportional to its sample rate. The digital power dissipation
does not vary much because it is determined primarily by the
DRVDD supply and bias current of the LVDS output drivers.
0.40
In this equation, the rms aperture jitter represents the root mean
square of all jitter sources, including the clock input, analog input
signal, and ADC aperture jitter specifications. IF undersampling
applications are particularly sensitive to jitter (see Figure 45).
Refer to the AN-501 Application Note and the AN-756
Application Note for more in-depth information about jitter
performance as it relates to ADCs.
130
0.35
0.75
0.30
AVDD CURRENT
0.20
0.60
0.10
0
10
12 BITS
70
10 BITS
60
8 BITS
50
40
0.125ps
0.25ps
0.5ps
1.0ps
2.0ps
30
1
10
100
ANALOG INPUT FREQUENCY (MHz)
1000
20
25
30
35
40
45
50
Figure 46. Supply Current vs. fSAMPLE for fIN = 10.3 MHz, fSAMPLE = 50 MSPS
06296-015
SNR (dB)
14 BITS
80
0.50
15
ENCODE (MSPS)
110
16 BITS
0.55
DRVDD CURRENT
0.05
RMS CLOCK JITTER REQUIREMENT
90
0.65
TOTAL POWER
0.15
120
100
0.70
0.25
POWER (W)
CURRENT (A)
The clock input should be treated as an analog signal in cases
where aperture jitter may affect the dynamic range of the AD9252.
Power supplies for clock drivers should be separated from the
ADC output driver supplies to avoid modulating the clock signal
with digital noise. Low jitter crystal-controlled oscillators make
the best clock sources. If the clock is generated from another
type of source (by gating, dividing, or other methods), it should
be retimed by the original clock at the last step.
0.80
Figure 45. Ideal SNR vs. Input Frequency and Jitter
Rev. E | Page 20 of 52
06296-062
SNR Degradation = 20 × log 10(1/2 × π × fA × tJ)
Data Sheet
AD9252
By asserting the PDWN pin high, the AD9252 is placed into
power-down mode. In this state, the ADC typically dissipates
11 mW. During power-down, the LVDS output drivers are placed
into a high impedance state. The AD9252 returns to normal
operating mode when the PDWN pin is pulled low. This pin is
both 1.8 V and 3.3 V tolerant.
recommended that the trace length be no longer than 24 inches
and that the differential output traces be kept close together and
at equal lengths. An example of the FCO and data stream when
the AD9252 is used with traces of proper length and position is
shown in Figure 47.
There are several other power-down options available when
using the SPI. The user can individually power down each
channel or put the entire device into standby mode. The latter
option allows the user to keep the internal PLL powered when
fast wake-up times (~600 ns) are required. See the Memory
Map section for more details on using these features.
Digital Outputs and Timing
The AD9252 differential outputs conform to the ANSI-644 LVDS
standard by default upon power-up. This can be changed to a low
power, reduced signal option (similar to the IEEE 1596.3 standard)
via the SDIO/ODM pin or the SPI. This LVDS standard can further
reduce the overall power dissipation of the device by approximately
36 mW. See the SDIO/ODM Pin section or Table 16 in the
Memory Map section for more information. The LVDS driver
current is derived on chip and sets the output current at each
output equal to a nominal 3.5 mA. A 100 Ω differential termination
resistor placed at the LVDS receiver inputs results in a nominal
350 mV swing at the receiver.
The AD9252 LVDS outputs facilitate interfacing with LVDS
receivers in custom ASICs and FPGAs for superior switching
performance in noisy environments. Single point-to-point net
topologies are recommended with a 100 Ω termination resistor
placed as close to the receiver as possible. If there is no far-end
receiver termination or there is poor differential trace routing,
timing errors may result. To avoid such timing errors, it is
CH1 500mV/DIV = FCO
CH2 500mV/DIV = DCO
CH3 500mV/DIV = DATA
5.0ns/DIV
06296-027
In power-down mode, low power dissipation is achieved by
shutting down the reference, reference buffer, PLL, and biasing
networks. The decoupling capacitors on REFT and REFB are
discharged when entering power-down mode and must be
recharged when returning to normal operation. As a result, the
wake-up time is related to the time spent in the power-down
mode: shorter cycles result in proportionally shorter wake-up
times. With the recommended 0.1 µF and 4.7 µF decoupling
capacitors on REFT and REFB, approximately 1 sec is required
to fully discharge the reference buffer decoupling capacitors and
approximately 375 µs is required to restore full operation.
Figure 47. LVDS Output Timing Example in ANSI-644 Mode (Default)
An example of the LVDS output using the ANSI-644 standard
(default) data eye and a time interval error (TIE) jitter histogram
with trace lengths less than 24 inches on standard FR-4 material
is shown in Figure 48. Figure 49 shows an example of the trace
length exceeding 24 inches on standard FR-4 material. Notice
that the TIE jitter histogram reflects the decrease of the data eye
opening as the edge deviates from the ideal position. It is the user’s
responsibility to determine if the waveforms meet the timing
budget of the design when the trace lengths exceed 24 inches.
Additional SPI options allow the user to further increase the
internal termination (increasing the current) of all eight outputs
in order to drive longer trace lengths (see Figure 50). Even though
this produces sharper rise and fall times on the data edges and
is less prone to bit errors, the power dissipation of the DRVDD
supply increases when this option is used. In addition, notice in
Figure 50 that the histogram has improved.
In cases that require increased driver strength to the DCO± and
FCO± outputs because of load mismatch, Register 0x15 allows
the user to increase the drive strength by 2×. To do this, first
set the appropriate bit in Register 0x05. Note that this feature
cannot be used with Bit 4 and Bit 5 in Register 0x15. Bit 4 and
Bit 5 take precedence over this feature. See the Memory Map
section for more details.
Rev. E | Page 21 of 52
AD9252
EYE: ALL BITS
400
ULS: 12071/12071
EYE DIAGRAM VOLTAGE (mV)
EYE DIAGRAM VOLTAGE (mV)
400
300
200
100
0
–100
–200
–300
–400
–500
–1.0ns
–0.5ns
0ns
0.5ns
1.0ns
0
–100
–200
–300
80
80
70
70
60
50
40
30
20
500
–50ps
0ps
50ps
100ps
150ps
06296-030
–100ps
EYE: ALL BITS
0ns
0.5ns
1.0ns
1.5ns
–100ps
–50ps
0ps
50ps
100ps
150ps
50
40
30
20
Figure 50. Data Eye for LVDS Outputs in ANSI-644 Mode with 100 Ω
Termination On and Trace Lengths Greater Than 24 Inches on Standard FR-4
The format of the output data is offset binary by default. An
example of the output coding format can be found in Table 8.
To change the output data format to twos complement, see the
Memory Map section.
ULS: 12067/12067
300
200
100
Table 8. Digital Output Coding
0
–100
Code
16383
8192
8191
0
–200
–300
–400
–500
–1.0ns
–0.5ns
0ns
0.5ns
1.0ns
1.5ns
(VIN + x) − (VIN − x),
Input Span = 2 V p-p (V)
+1.00
0.00
−0.000122
−1.00
Digital Output Offset Binary
(D13 ... D0)
11 1111 1111 1111
10 0000 0000 0000
01 1111 1111 1111
00 0000 0000 0000
Data from each ADC is serialized and provided on a separate
channel. The data rate for each serial stream is equal to 14 bits
times the sample clock rate, with a maximum of 700 Mbps
(14 bits × 50 MSPS = 700 Mbps). The lowest typical conversion
rate is 10 MSPS. However, if lower sample rates are required for
a specific application, the PLL can be set up via the SPI to allow
encode rates as low as 5 MSPS. See the Memory Map section for
information about enabling this feature.
100
90
80
70
60
50
40
30
20
–100ps
0ps
100ps
200ps
06296-028
10
0
–200ps
–0.5ns
60
0
–150ps
400
–1.5ns
–1.0ns
10
Figure 48. Data Eye for LVDS Outputs in ANSI-644 Mode with Trace Lengths
Less Than 24 Inches on Standard FR-4
EYE DIAGRAM VOLTAGE (mV)
100
–1.5ns
1.5ns
10
TIE JITTER HISTOGRAM (Hits)
200
90
0
–150ps
ULS: 12072/12072
300
–400
TIE JITTER HISTOGRAM (Hits)
TIE JITTER HISTOGRAM (Hits)
–1.5ns
EYE: ALL BITS
06296-029
500
Data Sheet
Figure 49. Data Eye for LVDS Outputs in ANSI-644 Mode with Trace Lengths
Greater Than 24 Inches on Standard FR-4
Rev. E | Page 22 of 52
Data Sheet
AD9252
Two output clocks are provided to assist in capturing data from
the AD9252. The DCO is used to clock the output data and is
equal to seven times the sample clock (CLK) rate. Data is clocked
out of the AD9252 and must be captured on the rising and
falling edges of the DCO that supports double data rate (DDR)
capturing. The FCO is used to signal the start of a new output
byte and is equal to the sample clock rate. See the timing
diagram shown in Figure 2 for more information.
Table 9. Flexible Output Test Modes
Output Test
Mode Bit
Sequence
0000
0001
Pattern Name
Off (default)
Midscale short
0010
+Full-scale short
0011
−Full-scale short
0100
Checkerboard
0101
0110
0111
PN sequence long 1
PN sequence short1
One-/zero-word toggle
1000
1001
User input
1-/0-bit toggle
1010
1× sync
1011
One bit high
1100
Mixed frequency
1
Digital Output Word 1
N/A
1000 0000 (8-bit)
10 0000 0000 (10-bit)
1000 0000 0000 (12-bit)
10 0000 0000 0000 (14-bit)
1111 1111 (8-bit)
11 1111 1111 (10-bit)
1111 1111 1111 (12-bit)
11 1111 1111 1111 (14-bit)
0000 0000 (8-bit)
00 0000 0000 (10-bit)
0000 0000 0000 (12-bit)
00 0000 0000 0000 (14-bit)
1010 1010 (8-bit)
10 1010 1010 (10-bit)
1010 1010 1010 (12-bit)
10 1010 1010 1010 (14-bit)
N/A
N/A
1111 1111 (8-bit)
11 1111 1111 (10-bit)
1111 1111 1111 (12-bit)
11 1111 1111 1111 (14-bit)
Register 0x19 and Register 0x1A
1010 1010 (8-bit)
10 1010 1010 (10-bit)
1010 1010 1010 (12-bit)
10 1010 1010 1010 (14-bit)
0000 1111 (8-bit)
00 0001 1111 (10-bit)
0000 0011 1111 (12-bit)
00 0000 0111 1111 (14-bit)
1000 0000 (8-bit)
10 0000 0000 (10-bit)
1000 0000 0000 (12-bit)
10 0000 0000 0000 (14-bit)
1010 0011 (8-bit)
10 0110 0011 (10-bit)
1010 0011 0011 (12-bit)
10 1000 0110 0111 (14-bit)
Digital Output Word 2
N/A
Same
Subject
to Data
Format
Select
N/A
Yes
Same
Yes
Same
Yes
0101 0101 (8-bit)
01 0101 0101 (10-bit)
0101 0101 0101 (12-bit)
01 0101 0101 0101 (14-bit)
N/A
N/A
0000 0000 (8-bit)
00 0000 0000 (10-bit)
0000 0000 0000 (12-bit)
00 0000 0000 0000 (14-bit)
Register 0x1B and Register 0x1C
N/A
No
No
No
N/A
No
N/A
No
N/A
No
Yes
Yes
No
All test mode options except PN sequence short and PN sequence long can support 8- to 14-bit word lengths in order to verify data capture to the receiver.
Rev. E | Page 23 of 52
AD9252
Data Sheet
When the SPI is used, the DCO phase can be adjusted in 60°
increments relative to the data edge. This enables the user to
refine system timing margins if required. The default DCO+
and DCO− timing, as shown in Figure 2, is 90° relative to the
output data edge.
An 8-, 10-, and 12-bit serial stream can also be initiated from
the SPI. This allows the user to implement different serial stream
to test the device’s compatibility with lower and higher resolution
systems. When changing the resolution to an 8-, 10-, or 12-bit
serial stream, the data stream is shortened. See Figure 3 for a
12-bit example.
When the SPI is used, the data outputs can be inverted from
their nominal state. This is not to be confused with inverting
the serial stream to an LSB-first mode. In default mode, as
shown in Figure 2, the MSB is first in the data output serial
stream. However, this can be inverted so that the LSB is first in
the data output serial stream (see Figure 4).
There are 12 digital output test pattern options available that
can be initiated through the SPI. This feature is useful when
validating receiver capture and timing. Refer to Table 9 for the
output bit sequencing options available. Some test patterns have
two serial sequential words and can be alternated in various
ways, depending on the test pattern chosen. Note that some
patterns do not adhere to the data format select option. In
addition, customer user-defined test patterns can be assigned in
the 0x19, 0x1A, 0x1B, and 0x1C register addresses. All test mode
options except PN sequence short and PN sequence long can
support 8- to 14-bit word lengths in order to verify data capture
to the receiver.
The PN sequence short pattern produces a pseudorandom bit
sequence that repeats itself every 29 − 1 or 511 bits. A description
of the PN sequence and how it is generated can be found in
Section 5.1 of the ITU-T 0.150 (05/96) standard. The only
difference is that the starting value must be a specific value
instead of all 1s (see Table 10 for the initial values).
The PN sequence long pattern produces a pseudorandom bit
sequence that repeats itself every 223 − 1 or 8,388,607 bits. A
description of the PN sequence and how it is generated can be
found in Section 5.6 of the ITU-T 0.150 (05/96) standard. The
only differences are that the starting value must be a specific
value instead of all 1s (see Table 10 for the initial values) and the
AD9252 inverts the bit stream with relation to the ITU standard.
SDIO/ODM Pin
The SDIO/ODM pin is for use in applications that do not require
SPI mode operation. This pin can enable a low power, reduced
signal option (similar to the IEEE 1596.3 reduced range link
output standard) if it and the CSB pin are tied to AVDD during
device power-up. This option should only be used when the
digital output trace lengths are less than 2 inches from the LVDS
receiver. When this option is used, the FCO, DCO, and outputs
function normally, but the LVDS signal swing of all channels is
reduced from 350 mV p-p to 200 mV p-p, allowing the user to
further reduce the power on the DRVDD supply.
For applications where this pin is not used, it should be tied low.
In this case, the device pin can be left open, and the 30 kΩ internal
pull-down resistor pulls this pin low. This pin is only 1.8 V tolerant.
If applications require this pin to be driven from a 3.3 V logic level,
insert a 1 kΩ resistor in series with this pin to limit the current.
Table 11. Output Driver Mode Pin Settings
Selected ODM
Normal
Operation
ODM
Initial
Value
0x0df
0x26e028
First Three Output Samples
(MSB First)
0x37e4, 0x3533, 0x0063
0x191f, 0x35c2, 0x2359
Resulting
Output Standard
ANSI-644
(default)
Resulting
FCO and DCO
ANSI-644
(default)
Low power,
reduced signal
option
Low power,
reduced signal
option
SCLK/DTP Pin
The SCLK/DTP pin is for use in applications that do not require
SPI mode operation. This pin can enable a single digital test pattern
if it and the CSB pin are held high during device power-up. When
the SCLK/DTP is tied to AVDD, the ADC channel outputs shift
out the following pattern: 10 0000 0000 0000. The FCO and DCO
function normally while all channels shift out the repeatable test
pattern. This pattern allows the user to perform timing alignment
adjustments among the FCO, DCO, and output data. For normal
operation, this pin should be tied to AGND through a 10 kΩ
resistor. This pin is both 1.8 V and 3.3 V tolerant.
Table 12. Digital Test Pattern Pin Settings
Selected DTP
Normal
Operation
DTP
Table 10. PN Sequence
Sequence
PN Sequence Short
PN Sequence Long
ODM Voltage
AGND
(10 kΩ pulldown resistor)
AVDD
DTP Voltage
AGND
(10 kΩ pulldown resistor)
AVDD
Resulting
D + x and D − x
Normal
operation
Resulting
FCO and DCO
Normal operation
10 0000 0000
0000
Normal operation
Additional and custom test patterns can also be observed when
commanded from the SPI port. Consult the Memory Map section
for information about the options available.
Rev. E | Page 24 of 52
Data Sheet
AD9252
CSB Pin
VIN + x
The CSB pin should be tied to AVDD for applications that do
not require SPI mode operation. By tying CSB high, all SCLK
and SDIO information is ignored. This pin is both 1.8 V and
3.3 V tolerant.
VIN – x
REFT
0.1µF
ADC
CORE
0.1µF
4.7µF
REFB
RBIAS Pin
0.1µF
VREF
1µF
0.1µF
0.5V
SELECT
LOGIC
SENSE
06296-031
To set the internal core bias current of the ADC, place a resistor
that is nominally equal to 10.0 kΩ between the RBIAS pin and
ground. The resistor current is derived on chip and sets the
AVDD current of the ADC to a nominal 360 mA at 50 MSPS.
Therefore, it is imperative that at least a 1% tolerance on this
resistor be used to achieve consistent performance.
+
Voltage Reference
A stable, accurate 0.5 V voltage reference is built into the
AD9252. This is gained up internally by a factor of 2, setting
VREF to 1.0 V, which results in a full-scale differential input
span of 2 V p-p. VREF is set internally by default; however, the
VREF pin can be driven externally with a 1.0 V reference to
improve accuracy.
When applying the decoupling capacitors to the VREF, REFT,
and REFB pins, use ceramic low-ESR capacitors. These capacitors
should be close to the ADC pins and on the same layer of the
PCB as the AD9252. The recommended capacitor values and
configurations for the AD9252 reference pin are shown in
Figure 51.
Figure 51. Internal Reference Configuration
VIN + x
VIN – x
REFT
0.1µF
ADC
CORE
0.1µF
4.7µF
REFB
EXTERNAL
REFERENCE
0.1µF
VREF
1µF1
+
0.1µF1
0.5V
SELECT
LOGIC
AVDD
SENSE
AGND to 0.2 V
Resulting
VREF (V)
N/A
1.0
Resulting
Differential
Span (V p-p)
2 × external
reference
2.0
1OPTIONAL.
Figure 52. External Reference Operation
5
0
Internal Reference Operation
–5
A comparator within the AD9252 detects the potential at the
SENSE pin and configures the reference. If SENSE is grounded,
the reference amplifier switch is connected to the internal
resistor divider (see Figure 51), setting VREF to 1 V.
The REFT and REFB pins establish their input span of the ADC
core from the reference configuration. The analog input fullscale range of the ADC equals twice the voltage at the reference
pin for either an internal or an external reference configuration.
If the reference of the AD9252 is used to drive multiple
converters to improve gain matching, the loading of the reference by the other converters must be considered. Figure 53
depicts how the internal reference voltage is affected by loading.
Rev. E | Page 25 of 52
–10
–15
–20
–25
06296-061
SENSE
Voltage
AVDD
VREF ERROR (%)
Selected
Mode
External
Reference
Internal,
2 V p-p FSR
06296-032
Table 13. Reference Settings
–30
0
0.5
1.0
1.5
2.0
2.5
CURRENT LOAD (mA)
Figure 53. VREF Accuracy vs. Load
3.0
3.5
AD9252
Data Sheet
External Reference Operation
0.02
–0.02
–0.04
–0.06
–0.08
–0.10
–0.12
–0.14
–0.16
–0.18
–40
–20
0
20
40
TEMPERATURE (°C)
Figure 54. Typical VREF Drift
Rev. E | Page 26 of 52
60
80
06296-060
When the SENSE pin is tied to AVDD, the internal reference is
disabled, allowing the use of an external reference. The external
reference is loaded with an equivalent 6 kΩ load. An internal
reference buffer generates the positive and negative full-scale
references, REFT and REFB, for the ADC core. Therefore, the
external reference must be limited to a nominal voltage of 1.0 V.
0
VREF ERROR (%)
The use of an external reference may be necessary to enhance
the gain accuracy of the ADC or improve thermal drift characteristics. Figure 54 shows the typical drift characteristics of the
internal reference in 1 V mode.
Data Sheet
AD9252
SERIAL PORT INTERFACE (SPI)
The AD9252 serial port interface allows the user to configure
the converter for specific functions or operations through a
structured register space provided inside the ADC. This may
provide the user with additional flexibility and customization,
depending on the application. Addresses are accessed via the
serial port and can be written to or read from via the port. Memory
is organized into bytes that can be further divided into fields, as
documented in the Memory Map section. Detailed operational
information can be found in the AN-877 Application Note,
Interfacing to High Speed ADCs via SPI.
Three pins define the SPI: the SCLK, SDIO, and CSB pins (see
Table 14). The SCLK pin is used to synchronize the read and
write data presented to the ADC. The SDIO pin is a dualpurpose pin that allows data to be sent to and read from the
internal ADC memory map registers. The CSB pin is an active
low control that enables or disables the read and write cycles.
Table 14. Serial Port Pins
Pin
SCLK
SDIO
CSB
Function
Serial Clock. The serial shift clock input, which is used to
synchronize serial interface reads and writes.
Serial Data Input/Output. A dual-purpose pin that typically
serves as an input or output, depending on the instruction
sent and the relative position in the timing frame.
Chip Select Bar (Active Low). This control gates the read
and write cycles.
The falling edge of the CSB in conjunction with the rising edge
of the SCLK determines the start of the framing sequence. During
an instruction phase, a 16-bit instruction is transmitted, followed
by one or more data bytes, which is determined by Bit Field W0
and Bit Field W1. An example of the serial timing and its
definitions can be found in Figure 56 and Table 15.
During normal operation, CSB is used to signal to the device
that SPI commands are to be received and processed. When
CSB is brought low, the device processes SCLK and SDIO to
execute instructions. Normally, CSB remains low until the
communication cycle is complete. However, if connected to a
slow device, CSB can be brought high between bytes, allowing
older microcontrollers enough time to transfer data into shift
registers. CSB can be stalled when transferring one, two, or
three bytes of data.
When W0 and W1 are set to 11, the device enters streaming
mode and continues to process data, either reading or writing,
until CSB is taken high to end the communication cycle. This
allows complete memory transfers without requiring additional
instructions.
Regardless of the mode, if CSB is taken high in the middle of a
byte transfer, the SPI state machine is reset and the device waits
for a new instruction.
In addition to the operation modes, the SPI port configuration
influences how the AD9252 operates. For applications that do
not require a control port, the CSB line can be tied and held high.
This places the remainder of the SPI pins into their secondary
modes, as defined in the SDIO/ODM Pin and SCLK/DTP Pin
sections. CSB can also be tied low to enable 2-wire mode. When
CSB is tied low, SCLK and SDIO are the only pins required for
communication. Although the device is synchronized during
power-up, the user should ensure that the serial port remains
synchronized with the CSB line when using this mode. When
operating in 2-wire mode, it is recommended that a 1-, 2-, or 3byte transfer be used exclusively. Without an active CSB line,
streaming mode can be entered but not exited.
In addition to word length, the instruction phase determines if
the serial frame is a read or write operation, allowing the serial
port to be used to both program the chip and read the contents
of the on-chip memory. If the instruction is a readback operation,
performing a readback causes the SDIO pin to change from an
input to an output at the appropriate point in the serial frame.
Data can be sent in MSB- or LSB-first mode. MSB-first mode
is the default at power-up and can be changed by adjusting the
configuration register. For more information about this and
other features, see the AN-877 Application Note, Interfacing to
High Speed ADCs via SPI.
HARDWARE INTERFACE
The pins described in Table 14 constitute the physical interface
between the user’s programming device and the serial port of
the AD9252. The SCLK and CSB pins function as inputs when
using the SPI. The SDIO pin is bidirectional, functioning as an
input during write phases and as an output during readback.
If multiple SDIO pins share a common connection, care should be
taken to ensure that proper VOH levels are met. Assuming the same
load for each AD9252, Figure 55 shows the number of SDIO pins
that can be connected together and the resulting VOH level.
This interface is flexible enough to be controlled by either serial
PROMs or PIC microcontrollers, providing the user with an
alternative method, other than a full SPI controller, to program
the ADC (see the AN-812 Application Note).
If the user chooses not to use the SPI, these dual-function pins
serve their secondary functions when the CSB is strapped to
AVDD during device power-up. See the Theory of Operation
section for details on which pin-strappable functions are
supported on the SPI pins.
Rev. E | Page 27 of 52
1.800
1.795
1.790
1.785
1.780
1.775
1.770
1.765
1.760
1.755
1.750
1.745
1.740
1.735
1.730
1.725
1.720
1.715
0
10
20
30
40
50
60
70
80
90
100
NUMBER OF SDIO PINS CONNECTED TOGETHER
06296-059
Data Sheet
VOH (V)
AD9252
Figure 55. SDIO Pin Loading
tDS
tS
tHI
tCLK
tDH
tH
tLO
CSB
SCLK DON’T CARE
R/W
W1
W0
A12
A11
A10
A9
A8
A7
D5
D4
D3
D2
D1
D0
DON’T CARE
06296-033
SDIO DON’T CARE
DON’T CARE
Figure 56. Serial Timing Details
Table 15. Serial Timing Definitions
Parameter
tDS
tDH
tCLK
tS
tH
tHI
tLO
tEN_SDIO
Timing (Minimum, ns)
5
2
40
5
2
16
16
10
tDIS_SDIO
10
Description
Setup time between the data and the rising edge of SCLK
Hold time between the data and the rising edge of SCLK
Period of the clock
Setup time between CSB and SCLK
Hold time between CSB and SCLK
Minimum period that SCLK should be in a logic high state
Minimum period that SCLK should be in a logic low state
Minimum time for the SDIO pin to switch from an input to an output relative to the SCLK
falling edge (not shown in Figure 56)
Minimum time for the SDIO pin to switch from an output to an input relative to the SCLK
rising edge (not shown in Figure 56)
Rev. E | Page 28 of 52
Data Sheet
AD9252
MEMORY MAP
READING THE MEMORY MAP TABLE
RESERVED LOCATIONS
Each row in the memory map register table (Table 16) has eight
address locations. The memory map is divided into three sections:
the chip configuration register map (Address 0x00 to Address 0x02),
the device index and transfer register map (Address 0x04,
Address 0x05, and Address 0xFF), and the ADC functions register
map (Address 0x08 to Address 0x22).
Undefined memory locations should not be written to except
when writing the default values suggested in this data sheet.
Addresses that have values marked as 0 should be considered
reserved and have 0 written to their registers during power-up.
The leftmost column of the memory map indicates the register
address number; the default value is shown in the second rightmost column. The Bit 7 column is the start of the default
hexadecimal value given. For example, Address 0x09, the clock
register, has a default value of 0x01, meaning Bit 7 = 0, Bit 6 = 0,
Bit 5 = 0, Bit 4 = 0, Bit 3 = 0, Bit 2 = 0, Bit 1 = 0, and Bit 0 = 1, or
0000 0001 in binary. This setting is the default for the duty cycle
stabilizer in the on condition. By writing 0 to Bit 0 of this address
followed by writing 0x01 in Register 0xFF (transfer bit), the duty
cycle stabilizer turns off. It is important to follow each writing
sequence with a transfer bit to update the SPI registers. All
registers, except Register 0x00, Register 0x04, Register 0x05, and
Register 0xFF, are buffered with a master-slave latch and require
writing to the transfer bit. For more information on this and
other functions, consult the AN-877 Application Note,
Interfacing to High Speed ADCs via SPI.
DEFAULT VALUES
When the AD9252 comes out of a reset, critical registers are
preloaded with default values. These values are indicated in
Table 16, where an X refers to an undefined feature.
LOGIC LEVELS
An explanation of various registers follows: “bit is set” is
synonymous with “bit is set to Logic 1” or “writing Logic 1 for
the bit.” Similarly, “clear a bit” is synonymous with “bit is set to
Logic 0” or “writing Logic 0 for the bit.”
Rev. E | Page 29 of 52
AD9252
Data Sheet
Table 16. Memory Map Register 1
Addr.
(MSB)
(Hex) Parameter Name Bit 7
Chip Configuration Registers
00
chip_port_config 0
01
chip_id
02
chip_grade
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
Bit 1
LSB first
1 = on
0 = off
(default)
Soft
reset
1 = on
0 = off
(default)
1
1
Soft
reset
1 = on
0 = off
(default)
LSB first
1 = on
0 = off
(default)
(LSB)
Bit 0
Default
Value
(Hex)
0
0x18
8-bit Chip ID Bits [7:0]
(AD9252 = 0x09), (default)
Read
only
Notes/
Comments
The nibbles
should be
mirrored so
that LSB- or
MSB-first mode
is set correctly
regardless of
shift mode.
Default is unique
chip ID, different
for each device.
This is a readonly register.
Child ID used to
differentiate
graded devices.
Child ID [6:4]
(identify device variants of Chip ID)
011 = 50 MSPS
X
X
X
X
Read
only
Device Index and Transfer Registers
04
device_index_2
X
X
X
X
Data
Channel
G
1 = on
(default)
0 = off
Data
Channel
F
1 = on
(default)
0 = off
Data
Channel
E
1 = on
(default)
0 = off
0x0F
Bits are set to
determine which
on-chip device
receives the next
write command.
05
device_index_1
X
X
X
X
Data
Channel
C
1 = on
(default)
0 = off
X
Data
Channel
B
1 = on
(default)
0 = off
X
Data
Channel
A
1 = on
(default)
0 = off
SW
transfer
1 = on
0 = off
(default)
Bits are set to
determine which
on-chip device
receives the next
write command.
device_update
Clock
Channel
FCO
1 = on
0 = off
(default)
X
0x0F
FF
Clock
Channel
DCO
1 = on
0 = off
(default)
X
Data
Channel
H
1 = on
(default)
0 = off
Data
Channel
D
1 = on
(default)
0 = off
X
0x00
Synchronously
transfers data
from the master
shift register to
the slave.
ADC Functions Registers
08
modes
X
X
X
X
X
0x00
Determines
various generic
modes of chip
operation.
09
clock
X
X
X
X
X
0x01
Turns the
internal duty
cycle stabilizer
on and off.
0D
test_io
User test mode
00 = off (default)
01 = on, single alternate
10 = on, single once
11 = on, alternate once
Reset PN
long gen
1 = on
0 = off
(default)
Reset
PN short
gen
1 = on
0 = off
(default)
Output test mode—see5BCMF in the
%JHJUBM0VUQVUTBOE5JNJOHsection
0000 = off (default)
0001 = midscale short
0010 = +FS short
0011 = −FS short
0100 = checkerboard output
0101 = PN 23 sequence
0110 = PN 9 sequence
0111 = one-/zero-word toggle
1000 = user input
1001 = 1-/0-bit toggle
1010 = 1× sync
1011 = one bit high
1100 = mixed bit frequency
(format determined by output_mode)
0x00
When this register
is set, the test
data is placed on
the output pins
in place of
normal data.
X
Rev. E | Page 30 of 52
Internal power-down mode
000 = chip run (default)
001 = full power-down
010 = standby
011 = reset
Duty
X
X
cycle
stabilizer
1 = on
(default)
0 = off
Data Sheet
AD9252
Addr.
(Hex)
14
Parameter Name
output_mode
(MSB)
Bit 7
X
15
output_adjust
16
Bit 5
X
X
Bit 6
0 = LVDS
ANSI-644
(default)
1 = LVDS
low power,
(IEEE 1596.3
similar)
X
output_phase
X
19
user_patt1_lsb
1A
Default
Value
(Hex)
0x00
Bit 3
X
Bit 2
Output
invert
1 = on
0 = off
(default)
Output driver
termination
00 = none (default)
01 = 200 Ω
10 = 100 Ω
11 = 100 Ω
X
X
X
X
X
B7
B6
B5
B4
0011 = output clock phase adjust
(0000 through 1010)
0000 = 0° relative to data edge
0001 = 60° relative to data edge
0010 = 120° relative to data edge
0011 = 180° relative to data edge (default)
0101 = 300° relative to data edge
0110 = 360° relative to data edge
1000 = 480° relative to data edge
1001 = 540° relative to data edge
1010 = 600° relative to data edge
1011 to 1111 = 660° relative to data edge
B3
B2
B1
B0
0x00
user_patt1_msb
B15
B14
B13
B12
B11
B10
B9
B8
0x00
1B
user_patt2_lsb
B7
B6
B5
B4
B3
B2
B1
B0
0x00
1C
user_patt2_msb
B15
B14
B13
B12
B11
B10
B9
B8
0x00
21
serial_control
LSB first
1 = on
0 = off
(default)
X
X
X
000 = 14 bits (default, normal bit
stream)
001 = 8 bits
010 = 10 bits
011 = 12 bits
100 = 14 bits
0x00
22
serial_ch_stat
X
X
X
X
<10
MSPS,
low
encode
rate
mode
1 = on
0 = off
(default)
X
Channel
powerdown
1 = on
0 = off
(default)
0x00
1
Bit 4
X
(LSB)
Bit 0
Bit 1
00 = offset binary
(default)
01 = twos complement
X = an undefined feature.
Rev. E | Page 31 of 52
X
X
Channel
output
reset
1 = on
0 = off
(default)
DCO and
FCO
2× drive
strength
1 = on
0 = off
(default)
0x00
0x03
Notes/
Comments
Configures the
outputs and the
format of the data.
Determines
LVDS or other
output properties.
Primarily functions to set the
LVDS span and
common-mode
levels in place of
an external
resistor.
On devices that
utilize global
clock divide,
this register
determines
which phase
of the divider
output is used
to supply the
output clock.
Internal latching
is unaffected.
User-defined
pattern, 1 LSB.
User-defined
pattern, 1 MSB.
User-defined
pattern, 2 LSB.
User-defined
pattern, 2 MSB.
Serial stream
control. Default
causes MSB first
and the native
bit stream
(global).
Used to power
down individual
sections of a
converter (local).
AD9252
Data Sheet
APPLICATIONS INFORMATION
Exposed Paddle Thermal Heat Slug Recommendations
DESIGN GUIDELINES
Before starting design and layout of the AD9252 as a system, it
is recommended that the designer become familiar with these
guidelines, which discuss the special circuit connections and
layout requirements needed for certain pins.
Power and Ground Recommendations
When connecting power to the AD9252, it is recommended
that two separate 1.8 V supplies be used: one for analog (AVDD)
and one for digital (DRVDD). If only one supply is available, it
should be routed to the AVDD first and then tapped off and
isolated with a ferrite bead or a filter choke preceded by
decoupling capacitors for the DRVDD. The user can employ
several different decoupling capacitors to cover both high and
low frequencies. These capacitors should be located close to the
point of entry at the PC board level and close to the parts with
minimal trace lengths.
To maximize the coverage and adhesion between the ADC and
PCB, partition the continuous copper plane by overlaying a
silkscreen on the PCB into several uniform sections. This provides
multiple tie points between the ADC and PCB during the
reflow process, whereas using one continuous plane with no
partitions guarantees only one tie point. See Figure 57 for a PCB
layout example. For detailed information on packaging and the
PCB layout of chip scale packages, see the AN-772 Application
Note, A Design and Manufacturing Guide for the Lead Frame
Chip Scale Package (LFCSP).
SILKSCREEN PARTITION
PIN 1 INDICATOR
06296-034
A single PC board ground plane should be sufficient when
using the AD9252. With proper decoupling and smart partitioning of the PC board’s analog, digital, and clock sections,
optimum performance can be easily achieved.
It is required that the exposed paddle on the underside of the
ADC be connected to analog ground (AGND) to achieve the
best electrical and thermal performance of the AD9252. An
exposed continuous copper plane on the PCB should mate to
the AD9252 exposed paddle, Pin 0. The copper plane should
have several vias to achieve the lowest possible resistive thermal
path for heat dissipation to flow through the bottom of the PCB.
These vias should be solder-filled or plugged.
Figure 57. Typical PCB Layout
Rev. E | Page 32 of 52
Data Sheet
AD9252
EVALUATION BOARD
board individually. Use P702 to connect a different supply for
each section. At least one 1.8 V supply is needed for AVDD_DUT
and DRVDD_DUT; however, it is recommended that separate
supplies be used for both analog and digital signals and that each
supply have a current capability of 1 A. To operate the evaluation
board using the VGA option, a separate 5.0 V analog supply
(AVDD_5 V) is needed. To operate the evaluation board using
the SPI and alternate clock options, a separate 3.3 V analog supply
(AVDD_3.3 V) is needed in addition to the other supplies.
The AD9252 evaluation board provides all the support circuitry required to operate the ADC in its various modes and
configurations. The converter can be driven differentially by using
a transformer (default) or an AD8334 driver. The ADC can also be
driven in a single-ended fashion. Separate power pins are provided
to isolate the DUT from the drive circuitry of the AD8334. Each
input configuration can be selected by changing the connections
of various jumpers (see Figure 62 to Figure 66). Figure 58 shows
the typical bench characterization setup used to evaluate the
ac performance of the AD9252. It is critical that the signal sources
used for the analog input and clock have very low phase noise
(<1 ps rms jitter) to realize the optimum performance of the
converter. Proper filtering of the analog input signal to remove
harmonics and lower the integrated or broadband noise at the
input is also necessary to achieve the specified noise performance.
INPUT SIGNALS
When connecting the clock and analog sources to the
evaluation board, use clean signal generators with low phase
noise, such as Rohde & Schwarz SMA or HP8644 signal generators
or the equivalent, as well as a 1 m, shielded, RG-58, 50 Ω coaxial
cable. Enter the desired frequency and amplitude from the ADC
specifications tables. Typically, most Analog Devices, Inc., evaluation boards can accept approximately 2.8 V p-p or 13 dBm
sine wave input for the clock. When connecting the analog
input source, it is recommended to use a multipole, narrow-band,
band-pass filter with 50 Ω terminations. Good choices of such
band-pass filters are available from TTE, Allen Avionics, and
K&L Microwave, Inc. The filter should be connected directly to
the evaluation board if possible.
See Figure 62 to Figure 72 for the complete schematics and
layout diagrams demonstrating the routing and grounding
techniques that should be applied at the system level.
POWER SUPPLIES
This evaluation board has a wall-mountable switching power
supply that provides a 6 V, 2 A maximum output. Connect the
supply to the rated 100 V ac to 240 V ac wall outlet at 47 Hz to
63 Hz. The other end of the supply is a 2.1 mm inner diameter
jack that connects to the PCB at P701. Once on the PC board,
the 6 V supply is fused and conditioned before connecting to
three low dropout linear regulators that supply the proper bias
to each of the various sections on the board.
OUTPUT SIGNALS
The default setup uses the Analog Devices HSC-ADC-FIFO5INTZ to interface with the Analog Devices standard dual-channel
FIFO data capture board (HCS-ADC-EVALCZ). Two of the
eight channels can be evaluated at the same time. For more
information on the channel settings and optional settings of
these boards, visit www.analog.com/FIFO.
When operating the evaluation board in a nondefault condition,
L701 to L704 can be removed to disconnect the switching
power supply. This enables the user to bias each section of the
WALL OUTLET
100V AC TO 240V AC
47Hz TO 63Hz
–
+
–
+
AVDD_3.3V
GND
VCC
GND
3.3V
3.3V
+
GND
AVDD_5V
1.8V
–
DRVDD_DUT
–
INTERPOSER
BOARD
XFMR
INPUT
AD9252
CLK
CH A TO CH H
14-BIT
SERIAL
LVDS
EVALUATION BOARD
SPI
SPI
Figure 58. Evaluation Board Connection
Rev. E | Page 33 of 52
HSC-ADC-EVALCZ
FIFO DATA
CAPTURE
BOARD
USB
CONNECTION
SPI
PC
RUNNING
ADC
ANALYZER
AND SPI
USER
SOFTWARE
SPI
06296-035
ROHDE & SCHWARZ,
SMA,
2V p-p SIGNAL
SYNTHESIZER
BAND-PASS
FILTER
1.8V
+
+
GND
ROHDE & SCHWARZ,
SMA,
2V p-p SIGNAL
SYNTHESIZER
5.0V
–
GND
SWITCHING
POWER
SUPPLY
AVDD_DUT
6V DC
2A MAX
AD9252
Data Sheet
A differential LVPECL clock can also be used to clock the
ADC input using the AD9515 (U401). Populate R406 and
R407 with 0 Ω resistors, and remove R215 and R216 to
disconnect the default clock path inputs. In addition, populate
C205 and C206 with a 0.1 μF capacitor, and remove C409 and
C410 to disconnect the default clock path outputs. The
AD9515 has many pin-strappable options that are set to a
default mode of operation. Consult the AD9515 data sheet
for more information about these and other options.
DEFAULT OPERATION AND JUMPER SELECTION
SETTINGS
The following is a list of the default and optional settings or
modes allowed on the AD9252 Rev. A evaluation board.

Power: Connect the switching power supply that is
provided with the evaluation kit between a rated 100 V ac
to 240 V ac wall outlet at 47 Hz to 63 Hz and P701.

AIN: The evaluation board is set up for a transformercoupled analog input with an optimum 50 Ω impedance
match of 150 MHz of bandwidth (see Figure 59). For more
bandwidth response, the differential capacitor across the
analog inputs can be changed or removed. The common
mode of the analog inputs is developed from the center
tap of the transformer or AVDD_DUT/2.
0
–1

PDWN: To enable the power-down feature, short J301 to
the on position (AVDD) for the PDWN pin.

SCLK/DTP: To enable the digital test pattern on the digital
outputs of the ADC, use J304. If J304 is tied to AVDD during
device power-up, Test Pattern 10 0000 0000 0000 is enabled.
See the SCLK/DTP Pin section for details.

SDIO/ODM: To enable the low power, reduced signal option
(similar to the IEEE 1595.3 reduced range link LVDS output
standard), use J303. If J303 is tied to AVDD during device
power-up, it enables the LVDS outputs in a low power,
reduced signal option from the default ANSI-644 standard.
This option changes the signal swing from 350 mV p-p to
200 mV p-p, reducing the power of the DRVDD supply. See
the SDIO/ODM Pin section for more details.

CSB: To enable processing of the SPI information on the
SDIO and SCLK pins, tie J302 low in the always enable
mode. To ignore the SDIO and SCLK information, tie J302
to AVDD.

Non-SPI Mode: For users who wish to operate the DUT
without using the SPI, simply remove Jumpers J302, J303,
and J304. This disconnects the CSB, SCLK/DTP, and
SDIO/ODM pins from the control bus, allowing the DUT
to operate in its simplest mode. Each of these pins has
internal termination and will float to its respective level.

D + x, D − x: If an alternative data capture method to the
setup shown in Figure 62 is used, optional receiver
terminations, R318 and R320 to R328, can be installed next
to the high speed backplane connector.
–3dB CUTOFF = 186MHz
–2
–3
AMPLITUDE (dBFS)
In addition, an on-board oscillator is available on the OSC401
and can act as the primary clock source. The setup is quick
and involves installing R403 with a 0 Ω resistor and setting
the enable jumper (J401) to the on position. If the user wishes
to employ a different oscillator, two oscillator footprint options
are available (OSC401) to check the ADC performance.
–4
–5
–6
–7
–8
–9
–10
–11
–12
–14
0
50
100
150
200
250
300
350
400
450
500
FREQUENCY (MHz)
06296-036
–13
Figure 59. Evaluation Board Full-Power Bandwidth

VREF: VREF is set to 1.0 V by tying the SENSE pin to
ground, R317. This causes the ADC to operate in 2.0 V p-p
full-scale range. A separate external reference option using
the ADR510 is also included on the evaluation board.
Populate R312 and R313, and remove C307. Proper use of
the VREF options is noted in the Voltage Reference
section.

RBIAS: RBIAS has a default setting of 10 kΩ (R301) to
ground and is used to set the ADC core bias current.

Clock: The default clock input circuitry is derived from a
simple transformer-coupled circuit using a high bandwidth
1:1 impedance ratio transformer (T401) that adds a very
low amount of jitter to the clock path. The clock input is
50 Ω terminated and ac-coupled to handle single-ended
sine wave types of inputs. The transformer converts the
single-ended input to a differential signal that is clipped
before entering the ADC clock inputs.
Rev. E | Page 34 of 52
Data Sheet
AD9252
To configure the analog input to drive the VGA instead of the
default transformer option, the following components need to
be removed and/or changed.
•
•
•
Remove R102, R115, R128, R141, R161, R162, R163, R164,
R202, R208, R218, R225, R234, R241, R252, R259, T101,
T102, T103, T104, T201, T202, T203, and T204 in the
default analog input path.
Remove L507, L508, L511, L512, L515, L516, L519, L520,
L607, L608, L611, L612, L615, L616, L619, and L620 on the
AD8334 analog outputs.
•
Populate L507, L508, L511, L512, L515, L516, L519, L520,
L607, L608, L611, L612, L615, L616, L619, and L620 with
680 nH inductors.
•
Populate C543, C547, C551, C555, C643, C647, C651, and
C655 with a 68 pF capacitor.
680nH
Figure 60. Example Filter Configured for16 MHz, Two-Pole Low-Pass Filter
0
Populate R101, R114, R127, R140, R201, R217, R233, and
R251 with 0 Ω resistors in the analog input path.
Populate R152, R153, R154, R155, R156, R157, R158, R159,
R215, R216, R229, R230, R247, R248, R263, R264, C103,
C105, C110, C112, C117, C119, C124, C126, C203, C205,
C210, C212, C217, C219, C224, and C226 with 10 kΩ
resistors to provide an input common-mode level to the
ADC analog inputs.
Remove R515, R520, R527, R532, R615, R620, R627, and
R632 on the AD8334 analog outputs.
•
Remove R512, R524, R612, and R624 to set the AD8334
mode and AD8334 HILO pin low. Some applications may
require this to be different. Consult the AD8334 data sheet
for more information on these functions.
fSAMPLE = 50MSPS
AIN = 3.5MHz
AD8334 = MAX GAIN SETTING
–20
Populate R105, R113, R118, R124, R131, R137, R151, R160,
R205, R213, R221, R222, R237, R238, R255, and R256 with
0 Ω resistors in the ADC analog input path to connect the
VGA outputs.
•
68pF
680nH
AMPLITUDE (dBFS)
•
•
–40
–60
–80
–100
–120
0
2.5
5.0
7.5
10.0
12.5
15.0
FREQUENCY (MHz)
17.5
20.0
22.5
25.0
06296-084
The following is a brief description of the alternative analog
input drive configuration using the AD8334 dual VGA. If this
drive option is in use, some components may need to be populated,
in which case all the necessary components are listed in Table 17.
For more details on the AD8334 dual VGA, including how it works
and its optional pin settings, consult the AD8334 data sheet.
In this example, a 16 MHz, two-pole low-pass filter was applied
to the AD8334 outputs. The following components need to be
removed and/or changed:
06296-083
ALTERNATIVE ANALOG INPUT DRIVE
CONFIGURATION
Figure 61. AD9252 FFT Example Results Using
16 MHz, Two-Pole Low-Pass Filter Applied to the AD8334 Outputs
(Analog Input Signal = −1.03 dBFS, SNR = 60.2 dBc, SFDR = 66.23 dBc)
In this configuration, L505 to L520 and L605 to L620 are populated
with 0 Ω resistors to allow signal connection and use of a filter if
additional requirements are necessary.
Rev. E | Page 35 of 52
Rev. E | Page 36 of 52
Channel A
P101
Figure 62. Evaluation Board Schematic, DUT Analog Inputs
VGA Input
Connection
R115
64.9Ω
R114
0Ω−DNP
INH2
R102
64.9Ω
R101
0Ω−DNP
DNP: DO NOT POPULATE.
Ain
P103
Channel B
Ain
INH1
VGA Input
Connection
Ain
DNP
P104
Ain
0Ω
R117
R103
0Ω
C109
0.1µF
C108
0.1µF
AVDD_DUT
R116
0Ω
FB104
10Ω
E102
R125
1KΩ
R126
1kΩ
1
R113
3
2
C114
0.1µF
0Ω−DNP
R124
4
5
6
R118
0Ω−DNP
C107
0.1µF
0Ω−DNP
4
5
6
R105
0Ω−DNP
T101
1 T102
3
2
1
CM2
CH_B
CM2
CH_B
CM1
CH_A
CM1
CH_A
R112
1kΩ
1
R111
1kΩ
E101
C102
0.1µF
C101
0.1µF
AVDD_DUT
FB101
10Ω
R104
0Ω
C113
DNP
R120
DNP
CM2
C106
DNP
R107
DNP
CM1
R119
DNP
R106
DNP
R162
499Ω
FB106
10Ω
FB105
10Ω
FB103
10Ω
R161
499Ω
FB102
10Ω
R122
33Ω
R121
33Ω
R110
33Ω
R108
33Ω
C110
DNP
C103
DNP
R156
DNP
R109
1kΩ
R157
DNP
R123
1kΩ
AVDD_DUT
C112
DNP
C111
2.2pF
R153
DNP
AVDD_DUT
AVDD_DUT
C105
DNP
C104
2.2pF
R152
DNP
AVDD_DUT
VIN_B
VIN_B
VIN_A
VIN_A
Ain
Channel D
P107
Ain
INH4
Channel C
P105
R141
64.9Ω
R140
0Ω−DNP
VGA Input
Connection
R128
64.9Ω
R127
0Ω−DNP
VGA Input
Connection
INH3
Ain
P106
DNP
DNP
P108
Ain
R142
0Ω
R129
0Ω
1
CM3
CH_C
CM3
CH_C
E104
C123
0.1µF
C122
0.1µF
R149
1kΩ
R150
1kΩ
1
1
3
2
1
3
2
R137
T104
4
5
6
R151
0Ω−DNP
C121
0.1µF
0Ω−DNP
4
5
6
R131
0Ω−DNP
T103
C128
0.1µF
R160
CH_D
CM4 0Ω−DNP
CM4
CH_D
R138
1kΩ R139
1kΩ
E103
C116
0.1µF
C115
0.1µF
AVDD_DUT
R143
0Ω
FB110
10Ω
AVDD_DUT
FB107
10Ω
R130
0Ω
C127
DNP
R145
DNP
CM4
C120
DNP
R133
DNP
CM3
R144
DNP
R132
DNP
FB109
10Ω
FB111
10Ω
FB112
10Ω
R164
499Ω
R163
499Ω
FB108
10Ω
R147
33Ω
C124
DNP
R146
33Ω
R136
33Ω
C117
DNP
R134
33Ω
R159
DNP
VIN_D
R148
1kΩ
VIN_D
R155
DNP
AVDD_DUT
C126
DNP
VIN_C
R158
DNP
AVDD_DUT
C125
2.2pF
VIN_C
R135
1kΩ
AVDD_DUT
C119
DNP
C118
2.2pF
R154
DNP
AVDD_DUT
06296-072
DNP
P102
AD9252
Data Sheet
Rev. E | Page 37 of 52
Figure 63. Evaluation Board Schematic, DUT Analog Inputs (Continued)
R218
64.9Ω
R217
0Ω−DNP
DNP
P204
Ain
Ain
VGA Input
Connection
INH6
R202
64.9Ω
R201
0Ω−DNP
DNP: DO NOT POPULATE.
Ain
P203
Channel F
P201
Channel E
Ain
VGA Input
Connection
INH5
R203
0Ω
E202
C209
0.1µF
R232
1kΩ
1kΩ
R231
1
CH_F
CM6
C208
0.1µF CH_F
AVDD_DUT
R219
0Ω
R220
0Ω
FB204
10Ω
1
R205
0Ω−DNP
4
3
3
2
0.1µF
C214
CM6
0Ω−DNP
4
R222
5
1 T202 6
R221
0Ω−DNP
0.1µF
C207
R213
0Ω−DNP
5
2
1 T201 6
CH_E
CM5
CM5
CH_E
R211
1kΩ
R212
1kΩ
C202
0.1µF
C201
0.1µF
E201
AVDD_DUT
FB201
10Ω
R204
0Ω
C213
DNP
R224
DNP
CM6
C206
DNP
R207
DNP
CM5
R223
DNP
R206
DNP
FB206
10Ω
R225
499Ω
FB205
10Ω
FB203
10Ω
R208
499Ω
FB202
10Ω
R227
33Ω
C210
DNP
R226
33Ω
R210
33Ω
R209
33Ω
DNP
C203
R215
DNP
R214
1kΩ
VIN_E
VIN_E
VIN_F
R229
DNP
VIN_F
R228
1kΩ
AVDD_DUT
C212
DNP
C211
2.2pF
R230
DNP
AVDD_DUT
AVDD_DUT
C205
DNP
C204
2.2pF
R216
DNP
AVDD_DUT
Ain
P207
Channel H
Ain
P205
Channel G
R252
64.9Ω
R251
0Ω−DNP
VGA Input
Connection
INH8
R234
64.9kΩ
R235
0Ω
DNP
P206
DNP
P208
Ain
Ain
R233
0Ω−DNP
VGA Input
Connection
INH7
1
E204
R266
1kΩ
R265
1kΩ
1
CH_H
CM8
C222
0.1µF CH_H
C223
0.1µF
3
2
1
6
5
R255
0Ω−DNP
0.1µF
C221
0Ω−DNP
4
R238
T203
R237
0Ω−DNP
R256
5
4
0.1µF
C228
0Ω−DNP
CM8
3
2
1 T204 6
CM7
CH_G
CM7
CH_G
R249
1kΩ
R250
1kΩ
E203
C216
0.1µF
C215
0.1µF
AVDD_DUT
R253
0Ω
R254
0Ω
FB210
10Ω
AVDD_DUT
FB207
10Ω
R236
0Ω
C227
DNP
R258
DNP
CM8
C220
DNP
R240
DNP
CM7
R257
DNP
R239
DNP
FB209
10Ω
FB212
10Ω
R259
499Ω
FB211
10Ω
R241
499Ω
FB208
10Ω
R261
33Ω
C224
DNP
R260
33Ω
R245
33Ω
C217
DNP
R242
33Ω
VIN_G
R247
DNP
VIN_G
R246
1kΩ
VIN_H
R263
DNP
VIN_H
R262
1kΩ
AVDD_DUT
C226
DNP
C225
2.2pF
R264
DNP
AVDD_DUT
AVDD_DUT
C219
DNP
C218
2.2pF
R248
DNP
AVDD_DUT
06296-073
DNP
P202
Data Sheet
AD9252
Rev. E | Page 38 of 52
16
AVDD
D+H
D−H
DRVDD
DRGND
D+C
VIN+D
D−C
D+D
RBIAS
D−D
FCO+
FCO−
DCO+
AVDD
DCO−
D+E
VIN+E
D−E
VIN−E
D+F
AVDD
VIN−F
D+G
D−F
VIN+F
D−G
30
28
29
27
26
25
24
22
23
21
20
18
CHC
CHB
CHD
CHC
CHD
FCO
FCO
Figure 64. Evaluation Board Schematic, DUT, VREF, and Digital Output Interface
R308
470kΩ
VIN−D
CHB
C305
0.1µF
VOUT
AVDD
32
ADR510ARTZ
1.0V
D−B
31
TRIM/NC
D+B
R310
10kΩ
R309
4.99kΩ
R311
DNP
R313
DNP
C307
1µF
R312
DNP
VREF_DUT
Remove C214 when
using external Vref
C306
0.1µF
Reference Circuitry
CHA
CHA
DRVDD_DUT
GND
AVDD_DUT
1kΩ
R305
100kΩ
OPTIONAL
EXT REF
33
34
35
36
37
38
39
R306
100kΩ
U302
VIN−C
AVDD_DUT
D−A
D+A
DRVDD
DRGND
AVDD
SCLK/DTP
SDIO/ODM
R319
1
J301
J302
J303
R317
0Ω
R31
DNP
R315
DNP
R314
DNP
3
3
3
3
VREF = 1V
CHH
CHG
CHF
CHE
CHD
CHC
CHB
CHA
FCO
DCO
SDO_CHB
CSB4_CHB
CSB3_CHB
SDI_CHB
SCLK_CHB
VSENSE_DUT
NC
DTP Enable
ODM Enable
ALWAYS ENABLE SPI
PDWN ENABLE
VREF = 0.5V(1 + R219/R220)
VREF = External
VREF = 0.5V
J304
Vref Select
SCLK_DTP
1
1
SDIO_ODM
CSB_DUT
1
R304
DNP
R307
10kΩ
DNP: DO NOT POPULATE.
CHH
15
14
13
U301
40
AVDD_DUT
R303
100kΩ
AVDD_DUT
R302
DNP
CHH
DRVDD_DUT
GND
AVDD_DUT
AVDD
CLK+
CSB
41
42
VIN_A
VIN_A
AVDD_DUT
VIN_B
VIN_B
AVDD_DUT
2
12
11
10
VIN+C
CLK
CLK−
PDWN
AVDD
43
44
45
46
47
48
2
AVDD_DUT
9
REFB
CLK
REFT
AD9252BCPZ-50
VREF
AVDD
SENSE
8
AVDD
VIN+A
VIN−A
AVDD
VIN−B
VIN+B
AVDD
2
AVDD_DUT
SLUG
7
0
AVDD_DUT
64
VIN+H
VIN_F
63
6
VIN_F
61
VIN_H
AVDD_DUT
62
AVDD
VIN_E
60
VIN−H
VIN_E
59
5
58
VIN_H
57
AVDD_DUT
AVDD_DUT
56
VIN−G
VREF_DUT
55
3
54
4
VSENSE_DUT
53
VIN_G
VIN_D
52
VIN+G
VIN_D
51
2
R301
10kΩ
50
VIN_G
AVDD_DUT
49
AVDD
C304
0.1µF
VIN_C
1
C303
4.7µF
Reference
Decoupling
VIN_C
AVDD_DUT
C302
0.1µF
C301
0.1µF
1
21
2
22
3
23
4
24
5
25
6
26
7
27
8
28
9
29
10
30
31
51
32
52
33
53
34
54
35
55
36
56
37
57
38
58
39
59
40
60
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
C1
C2
C3
C4
C5
C6
C7
C8
C9
C10
P301
Digital Outputs
GNDAB1
GNDAB2
GNDAB3
GNDAB4
GNDAB5
GNDAB6
GNDAB7
GNDAB8
GNDAB9
GNDAB10
GNDCD1
GNDCD2
GNDCD3
GNDCD4
GNDCD5
GNDCD6
GNDCD7
GNDCD8
GNDCD9
GNDCD10
B1
B2
B3
B4
B5
B6
B7
B8
B9
B10
D1
D2
D3
D4
D5
D6
D7
D8
D9
D10
11
12
13
14
15
16
17
18
19
20
41
42
43
44
45
46
47
48
49
50
DNP
DNP
R328
DNP
R327
DNP
R326
DNP
R325
DNP
R324
DNP
R323
DNP
R322
DNP
R321
DNP
R320
R318
SDO_CHA
CSB2_CHA
CSB1_CHA
SDI_CHA
SCLK_CHA
CHH
CHG
CHF
CHE
CHD
CHC
CHB
CHA
FCO
DCO
R318,R320−R328
Optional Output
Terminations
AD9252
Data Sheet
2
AVDD_DUT
CW
GND
DCO
DCO
CHE
CHF
CHE
19
CHF
17
CHG
CHG
06296-074
Figure 65. Evaluation Board Schematic, Clock Circuitry
Rev. E | Page 39 of 52
DNP: DO NOT POPULATE.
0Ω
1
6
C411
0.1µF
R418
0Ω
7
S6
HSMS-2812-TR1G
CR401
S7
10
R405
0Ω
9
S8
11
5
4
8
S9
S5
12
2
VREF
3
S10
S10
S9
S4
S1
S2
14
R416
1
SIGNAL=DNC;27,28
SIGNAL=AVDD_3.3V;4,17,20,21,24,26,29,30
S8
T401
E401
GND_PAD
AD9515BCPZ
S7
15
0Ω
R415
R417
0Ω
SYNCB
CLKB
CLK
U401
S6
13
C403
0.1µF
OPT_CLK
R413
10kΩ
5
3
2
AVDD_3.3V
S5
16
Enc
R404
49.9Ω
C402
0.1µF
R407
0Ω R412
DNP DNP
R411
49.9Ω
DNP
R414
4.12kΩ
S4
DNP
P402
P401
OPT_CLK
OPT_CLK
R406
0Ω
DNP
R410
10kΩ
S3
S3
Clock Circuit
Enc
CRYSTAL_3
7
1
R409
DNP
RSET
R403
0Ω
DNP
GND
R402
10kΩ
OPT_CLK
DISABLE OSC401
R408
DNP
VS
OUT
5
3
1
J401
ENABLE OSC401
OUT1B
OUT1
OUT0B
OUT0
S0
C410
0.1µF
0.1µF
C409
18
19
22
23
R420
240Ω
CLK
R423
100Ω
R421
240Ω
R422
100Ω
C408
0.1µF
DNP
DNP
C407
0.1µF
DNP
0.1µF
C406
DNP
0.1µF
C405
CLK
CLIP SINE OUT (DEFAULT)
OPTIONAL CLOCK DRIVE CIRCUIT
GND
8
OE
OUT GND
VCC
OE
3
32
10
VCC
2
1
12
14
Optional Clock
Oscillator
OSC401
AVDD_3.3V
31
Input
Encode
AVDD_3.3V
R401
10kΩ
S2
25
3
S1
2
C401
0.1µF
33
S0
1
AVDD_3.3V
CLK
R446
DNP
LVDS OUTPUT
CLK
LVPECL OUTPUT
C 412
0.1µF
C413
0.1µF
AVDD_3.3V
S5
AVDD_3.3V
S4
AVDD_3.3V
S3
AVDD_3.3V
S2
AVDD_3.3V
S1
AVDD_3.3V
S0
AVDD_3.3V
C 414
0.1µF
DNP
0Ω
0Ω
0Ω
0Ω
0Ω
0Ω
C 415
0.1µF
R434
DNP
R432
DNP
R430
DNP
R428
DNP
R426
DNP
R424
C416
0.1µF
R435
R433
R431
R429
R427
R425
0Ω
0Ω
0Ω
0Ω
0Ω
0Ω
C417
0.1µF
C 418
0.1µF
S10
AVDD_3.3V
S9
AVDD_3.3V
S8
AVDD_3.3V
S7
AVDD_3.3V
S6
AVDD_3.3V
DNP
R444
DNP
R442
DNP
R440
DNP
R438
R436
0Ω
0Ω
0Ω
0Ω
0Ω
AD9515 Pin−strap settings
R437
R445
R443
R441
R439
DNP
0Ω
0Ω
0Ω
0Ω
0Ω
Data Sheet
AD9252
6
06296-075
1
CW
C515
0.018µF
L502
120nH
GND
VG12
Variable Gain Circuit
(0−1.0V DC)
External
Variable Gain Drive
Rev. E | Page 40 of 52
R508
274Ω
INH1
C524
0.1µF
16
15
INH3
LMD3
VIN4
LOP4
VIP4
LON4
COM4X
LMD1
LMD4
INH1
INH4
COM1
COM4
COM3
L501
120nH
0.1µF
C513
27
26
24
23
19
18
R509
274Ω
VG12
VG34
External
Variable Gain Drive
Figure 66. Evaluation Board Schematic, Optional DUT Analog Input Drive
C532
0.1µF
VPS4
25
VG34
AVDD_5V
22
17
C527
0.018µF
HILO Pin=LO=+/− 50mV
HILO Pin=H=+/− 75mV
DNP
10kΩ
R510
COM34
VOH4
VOL4
VPS34
VOL3
VOH3
AVDD_5V
31
Rclamp Pin
GAIN34
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
C540
0.1µF
CH_D
AVDD_5V
C542
DNP
R514
187Ω
R515
374Ω
R516
DNP
L505
0Ω
AVDD_5V
C541
0.1µF
L506
0Ω
187Ω
C550
DNP
R530
187Ω
R526
187Ω
C552
0.1µF
L517
0Ω
R525
C549
0.1µF
L514
0Ω
187Ω
R527
374Ω
R528
DNP
L513
0Ω
R532
374Ω
R533
DNP
L518
0Ω
C554
DNP
187Ω
R531
C553
0.1µF
CH_A
L520
0Ω
C555
DNP
C551
DNP
L519
0Ω
CH_A
R534
DNP
L516
0Ω
CH_B
R529
DNP
L515
0Ω
CH_B
C548
0.1µF
AVDD_5V
R519
C545
0.1µF
R518
R520
374Ω
R521
DNP
L510
0Ω
C546
DNP
187Ω
C544
0.1µF
L509
0Ω
CH_C
L512
0Ω
C547
DNP
L507
0Ω
C543
DNP
L511
0Ω
CH_C
Populate L505−L520 with 0Ω
resistors or design your own filter.
R522
DNP
L508
0Ω
CH_D
R517
DNP
MODE Pin
Positive Gain Slope = 0−1.0V
Negitive Gain Slope = 2.25−5.0V
C535
10µF
C531
1000pF
CLMP34
C530
0.1µF
HILO
0.1µF
VCM4
EN12
C529
EN34
C528
0.1µF
COM3X
LON3
LOP3
VIP3
NC
C534
0.1µF
R512
10kΩ
VG34
Variable Gain Circuit
(0−1.0V DC)
DNP: DO NOT POPULATE.
R507
274Ω
14
13
12
11
COM34
NC
MODE
COM12
VOH2
VOL2
VPS12
VOL1
VOH1
48
47
C533
10µF
R536
39kΩ
R535
10kΩ
C523
VIN3
CLMP12
VCM3
2
0.1µF
C501
EXT VG
C503
22pF
0.1µF
COM2
VPS3
COM1X
9
LON1
10
VIP1
AD8334ACPZ-REEL
LOP1
VPS2
VIN1
AVDD_5V
64
VPS1
AVDD_5V
62
VIN2
63
VIP2
C505
0.1µF
GAIN12
8
61
7
60
6
59
LOP2
58
LON2
57
5
56
4
55
INH2
C518
AVDD_5V
COM12
C511
0.1µF
JP502
AVDD_5V
54
0.1µF
VG12
COM2X
53
3
52
VCM1
LMD2
51
VCM2
INH2
49
2
50
1
U501
0.1µF
C506
Rclamp Pin
HILO Pin=LO=+/− 50mV
HILO Pin=H=+/− 75mV
AVDD_5V
R504
10kΩ
R524
10kΩ
0.1µF
C522
C538
0.1µF
C537
0.1µF
C504
0.1µF
DNP
10kΩ
R506
C509
0.1µF
INH3
INH4
C508
0.1µF
R505
10kΩ
R502
39kΩ
R501
10kΩ
C507
1000pF
Power Down Enable
(0−1V=Disable Power)
AVDD_5V
C510
10µF
R513
187Ω
1
2
EXT VG
C512
10µF
06296-076
JP501
AD9252
Data Sheet
R523
10kΩ
C536
0.1µF
R511
10kΩ
30
29
28
21
20
C526
22pF
L504
120nH
0.1µF
C525
R503
274Ω
C502
0.018µF
C521
0.018µF
C514
22pF
C520
22pF
L503
120nH
0.1µF
C519
GND
CW
AVDD_5V
1
2
EXT VG
JP601
CW
GND
VG56
EXT VG
L602
120nH
Variable Gain Circuit
(0−1.0V DC)
External
Variable Gain Drive
Rev. E | Page 41 of 52
R608
274Ω
INH5
C624
0.1µF
16
15
INH3
LMD3
COM3X
30
61
LMD1
LMD4
INH1
INH4
62
COM1
L601
120nH
0.1µF
C613
AVDD_5V
31
GAIN34
VPS4
VIN4
25
LOP4
VIP4
24
COM4
20
19
R609
274Ω
18
17
GND
VG78
VG56
External
Variable Gain Drive
Figure 67. Evaluation Board Schematic, Optional DUT Analog Input Drive (Continued)
C632
0.1µF
COM34
VOH4
VOL4
VPS34
VOL3
32
26
27
VG78
AVDD_5V
LON4
23
COM3
C627
0.018µF
C631
1000pF
CLMP12
VCM3
Rclamp Pin
HILO Pin=LO=+/− 50mV
HILO Pin=H=+/− 75mV
DNP
10kΩ
R610
53
C630
0.1µF
52
0.1µF
HILO
C629
EN12
C628
0.1µF
VCM4
48
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
C634
0.1µF
C635
10µF
R612
10kΩ
VG78
Variable Gain Circuit
(0−1.0V DC)
DNP: DO NOT POPULATE.
C615
0.018µF
LON3
LOP3
VOH3
COM34
NC
MODE
COM12
VOH2
VOL2
VPS12
VOL1
VOH1
C633
10µF
R635
39kΩ
R634
10kΩ
R607
274Ω
14
13
60
0.1µF
COM1X
VIP3
59
VIN3
VIP1
12
LOP1
11
LON1
10
58
C623
57
VPS3
VIN1
9
56
AVDD_5V
VPS1
AD8334ACPZ-REEL
55
VPS2
VIN2
VIP2
GAIN12
8
7
54
AVDD_5V
6
51
EN34
2
0.1µF
C601
LOP2
50
1
C603
22pF
5
COM2
INH6
C618
64
0.1µF
63
LON2
C605
0.1µF
COM2X
AVDD_5V
4
VG56
3
VCM1
COM12
VCM2
LMD2
49
JP602
AVDD_5V
10kΩ
INH2
C609
0.1µF
2
AVDD_5V
R604
1
U601
R605
10kΩ
0.1µF
C606
Rclamp Pin
HILO Pin=LO=+/− 50mV
HILO Pin=H=+/− 75mV
AVDD_5V
AVDD_5V
AVDD_5V
CH_H
C642
DNP
R614
187Ω
R615
374Ω
R618
187Ω
R620
374Ω
C645
0.1µF
L610
0Ω
C646
DNP
C640
0.1µF
C644
0.1µF
L609
0Ω
R621
DNP
C641
0.1µF
L606
0Ω
R616
DNP
L605
0Ω
L612
0Ω
C647
DNP
C643
DNP
L607
0Ω
CH_G
R625
187Ω
AVDD_5V
R623
10kΩ
R624
10kΩ
R619
187Ω
C648
0.1µF
CH_F
C650
DNP
R626
187Ω
R627
374Ω
R628
DNP
L613
0Ω
C649
0.1µF
L614
0Ω
R630
187Ω
C652
0.1µF
L617
0Ω
R631
187Ω
R632
374Ω
R633
DNP
L618
0Ω
C654
DNP
C653
0.1µF
CH_E
L620
0Ω
C655
DNP
C651
DNP
L619
0Ω
CH_E
R636
DNP
L616
0Ω
CH_F
R629
DNP
L615
0Ω
Populate L605−L620 with 0Ω
resistors or design your own filter.
R622
DNP
L611
0Ω
CH_G
R617
DNP
L608
0Ω
CH_H
Positive Gain Slope = 0−1.0V
Negative Gain Slope = 2.25−5.0V
MODE Pin
R613
187Ω
0.1µF
C622
C617
0.1µF
C616
0.1µF
C604
0.1µF
DNP
10kΩ
R606
C612
10µF
INH7
INH8
C608
0.1µF
C610
10µF
R602
39kΩ
R601
10kΩ
C607
1000pF
Power Down Enable
(0−1V=Disable Power)
Data Sheet
AD9252
C611
0.1µF
C636
0.1µF
NC
29
R611
10kΩ
CLMP34
28
COM4X
22
21
C626
22pF
L604
120nH
R603
274Ω
0.1µF
C625
C602
0.018µF
C621
0.018µF
C614
22pF
C620
22pF
L603
120nH
0.1µF
C619
CW
AVDD_5V
06296-077
2
OPTIONAL GREEN
GP0
7
8
MCLR/GP3
9
10
Rev. E | Page 42 of 52
Figure 68. Evaluation Board Schematic, Power Supply Inputs and SPI Interface Circuitry
1
GND
1
2
OUT
OUT 4
C717
1µF
L706
10µH
C715
1µF
L705
10µH
DUT_DRVDD
DUT_AVDD
R715
10kΩ
C721
1µF
PWR_IN
C719
1µF
PWR_IN
R714
10kΩ
3
IN
IN
U703
2 GND
3 A2
1 A1
Y1 6
ADP3339AKCZ−5-RL7
2
OUT
4
OUT
2
OUT
4
OUT
Y2 4
VCC 5
ADP3339AKCZ−3.3-RL
U705
U706
3
5
VCC
Y2 4
Y1 6
NC7WZ16P6X_NL
U702
GND
DNP: DO NOT POPULATE.
ADP3339AKCZ−1.8-RL
U704
ADP3339AKCZ−1.8-RL
GND
C716
1µF
GP1
6
1
IN
5
2
OUT
4
OUT
PICVCC
4
3
GP0
2
3
GND
PWR_IN
MCLR/GP3
1
C714
1µF
GP1
IN
J702
R711
10kΩ
GND
3 A2
2
1 A1
NC7WZ07P6X_NL R712
1kΩ
C722
1µF
L708
10µH
C720
1µF
L707
10µH
CSB_DUT
AVDD_DUT
SCLK_DTP
AVDD_DUT
AVDD_DUT
R713
1kΩ
SDIO_ODM
0.1µF
U707
PICVCC
ISP
E701
1
R705
0Ω−DNP
C703
0.1µF
3
CR701
C702
PWR_IN
R702
261Ω
0Ω−DNP
AVDD_5V
5V_AVDD
AVDD_3.3V
C744
0.1µF
C730
0.1µF
C723
0.1µF
7.5V POWER
CON005
2.5MM JACK
3.3V_AVDD
AVDD_DUT
AVDD_DUT
R710
1kΩ
P701
1
2
C740
0.1µF
F701
Optional Power
Input
P702
DNP
1
P1
2
P2
3
P3
4
P4
5
P5
6
P6
7
P7
8
P8
C704
10µF
C747
0.1µF
C733
0.1µF
C726
0.1µF
C741
0.1µF
DRVDD_DUT
C746
0.1µF
C732
0.1µF
C725
0.1µF
D701
S2A-TP
C742
0.1µF
C748
0.1µF
C734
0.1µF
C727
0.1µF
C743
0.1µF
AVDD_5V
C735
0.1µF
DUT_DRVDD
DUT_AVDD
5V_AVDD
3.3V_AVDD
NANOSMDC110F-2
Decoupling Capacitors
C745
0.1µF
C731
0.1µF
C724
0.1µF
3
Power Supply Input
6V, 2A max
C749
0.1µF
L704
10µH
L702
10µH
L701
10µH
C750
0.1µF
2
3
FER701
L703
10µH
1
4
C751
0.1µF
C711
10µF
C707
10µF
C705
10µF
C709
10µF
PWR_IN
R716
261Ω
+5.0V
C752
0.1µF
C712
0.1µF
C753
0.1µF
DRVDD_DUT+1.8V
C708
0.1µF
AVDD_DUT +1.8V
C706
0.1µF
AVDD_5V
C710
0.1µF
AVDD_3.3V +3.3V
SK33-TP
D702
GREEN
PIC PROGRAMMING HEADER
RESET/ RE
PROGRAM
GP2 5
4
MCLR/GP3
PIC12F629-I/SNG
0Ω
4
0Ω
R706
2
R704
R707
CSB1_CHA
3
R703
0Ω−DNP
SCLK_CHA
S701
8
0Ω
GP0 7
GP1 6
VSS
0Ω
R708
1
U701
R709
VDD
2 GP5
3 GP4
1
AVDD_3.3V
REMOVE WHEN USING OR PROGRAMMING PIC (U402)
CR702
R701
4.7kΩ
3
SDI_CHA
0.1µF
J701
AVDD_5V
SDO_CHA
C701
1
AVDD_3.3V
SPI CIRCUITRY FROM FIFO
06296-078
+5V = PROGRAMMING = AVDD_5V
+3.3V = NORMAL OPERATION = AVDD_3.3V
AD9252
Data Sheet
1
AD9252
06296-079
Data Sheet
Figure 69. Evaluation Board Layout, Primary Side
Rev. E | Page 43 of 52
Data Sheet
06296-080
AD9252
Figure 70. Evaluation Board Layout, Ground Plane
Rev. E | Page 44 of 52
AD9252
06296-081
Data Sheet
Figure 71. Evaluation Board Layout, Power Plane
Rev. E | Page 45 of 52
Data Sheet
06296-082
AD9252
Figure 72. Evaluation Board Layout, Secondary Side (Mirrored Image)
Rev. E | Page 46 of 52
Data Sheet
AD9252
Table 17. Evaluation Board Bill of Materials (BOM) 1
Item
1
2
Qty
per
Board
1
118
3
8
4
8
5
1
6
4
7
8
Reference
Designator
AD9252LFCSP_REVA
C101, C102, C107,
C108, C109, C114,
C115, C116, C121,
C122, C123, C128,
C201, C202, C207,
C208, C209, C214,
C215, C216, C221,
C222, C223, C228,
C301, C302, C304,
C305, C306, C401,
C402, C403, C409,
C410, C411, C412,
C413, C414, C415,
C416, C417, C418,
C501, C504, C505,
C506, C508, C509,
C511, C513, C518,
C519, C522, C523,
C524, C525, C528,
C529, C530, C532,
C534, C536, C537,
C538, C601, C604,
C605, C606, C608,
C609, C611, C613,
C616, C617, C618,
C619, C622, C623,
C624, C625, C628,
C629, C630, C632,
C634, C636, C701,
C702, C703, C706,
C708, C710, C712,
C723, C724, C725,
C726, C727, C730,
C731, C732, C733,
C734, C735, C740,
C741, C742, C743,
C744, C745, C746,
C747, C748, C749,
C750, C751, C752,
C753
C104, C111, C118,
C125, C204, C211,
C218, C225
C510, C512, C533,
C535, C610, C612,
C633, C635
C303
C507, C531, C607,
C631
C502, C515, C521,
C527, C602, C615,
C621, C627
Device
PCB
Capacitor
Package
PCB
402
Value
PCB
0.1 μF, ceramic, X5R,
10 V, 10% tol
Manufacturer
Manufacturer
Part Number
Murata
GRM155R71C104KA88D
Capacitor
402
2.2 pF, ceramic, COG,
0.25 pF tol, 50 V
Murata
GRM1555C1H2R20CZ01D
Capacitor
805
10 μF, 6.3 V ±10%,
ceramic, X5R
Murata
GRM219R60J106KE19D
Capacitor
603
Murata
GRM188R60J475KE19D
Capacitor
402
Murata
GRM155R71H102KA01D
Capacitor
402
4.7 μF, ceramic, X5R,
6.3 V, 10% tol
1000 pF, ceramic, X7R,
25 V, 10% tol
0.018 μF, ceramic, X7R,
16 V, 10% tol
AVX
0402YC183KAT2A
Rev. E | Page 47 of 52
AD9252
Item
8
Qty
per
Board
8
9
1
10
9
11
16
12
4
13
Data Sheet
Reference
Designator
C503, C514, C520,
C526, C603, C614,
C620, C626
C704
Device
Capacitor
Package
402
Value
22 pF, ceramic, NPO,
5% tol, 50 V
Manufacturer
Murata
Manufacturer
Part Number
GRM1555C1H220JZ01D
Capacitor
1206
ROHM Co., Ltd.
TCA1C106M8R
Capacitor
603
10 μF, tantalum,
16 V, 20% tol
1 μF, ceramic, X5R,
6.3 V, 10% tol
Murata
GRM188R61C105KA93D
Capacitor
805
0.1 μF, ceramic, X7R,
50 V, 10% tol
Murata
GRM21BR71H104KA01L
10 μF, ceramic, X5R,
6.3 V, 20% tol
30 V, 20 mA, dual
Schottky
Green, 4 V, 5 m candela
3 A, 30 V, SMC
Murata
GRM188R60J106ME47D
Avago
Technologies
Panasonic
Micro
Commercial Co.
Micro
Commercial Co.
Tyco/Raychem
HSMS-2812-TR1G
NANOSMDC110F-2
Murata
DLW5BSN191SQ2L
Murata
BLM18BA100SN1D
Samtec
TSW-102-07-G-S
Samtec
TSW-103-07-G-S
Samtec
TSW-105-08-G-D
Murata
BLM31PG500SN1L
Murata
LQG15HNR12J02D
Capacitor
603
1
C307, C714, C715,
C716, C717, C719,
C720, C721, C722
C540, C541, C544,
C545, C548, C549,
C552, C553, C640,
C641, C644, C645,
C648, C649, C652,
C653
C705, C707, C709,
C711
CR401
Diode
SOT-23
14
15
2
1
CR701, CR702
D702
LED
Diode
16
1
D701
Diode
17
1
F701
Fuse
603
DO214AB
DO214AA
1210
18
1
FER701
Choke coil
2020
19
24
Ferrite bead
603
20
4
Connector
2-pin
21
6
Connector
3-pin
23
1
FB101, FB102,
FB103, FB104,
FB105, FB106,
FB107, FB108,
FB109, FB110,
FB111, FB112,
FB201, FB202,
FB203, FB204,
FB205, FB206,
FB207, FB208,
FB209, FB210,
FB211, FB212
JP501, JP502,
JP601, JP602
J301, J302, J303,
J304, J401, J701
J702
Connector
10-pin
24
8
Ferrite bead
1210
25
8
L701, L702, L703,
L704, L705, L706,
L707, L708
L501, L502, L503,
L504, L601, L602,
L603, L604
Inductor
402
5 A, 50 V, SMC
6.0 V, 2.2 A trip-current
resettable fuse
10 μH, 5 A, 50 V, 190 Ω
@ 100 MHz
10 Ω, test frequency
100 MHz, 25% tol,
500 mA
100 mil header jumper,
2-pin
100 mil header jumper,
3-pin
100 mil header, male,
2 × 5 double row
straight
10 μH, bead core 3.2 ×
2.5 × 1.6 SMD, 2 A
120 nH, test freq
100 MHz, 5% tol,
150 mA
Rev. E | Page 48 of 52
LNJ314G8TRA
SK33-TP
S2A-TP
Data Sheet
Item
26
Qty
per
Board
32
27
1
28
9
29
Reference
Designator
L505, L506, L507,
L508, L509, L510,
L511, L512, L513,
L514, L515, L516,
L517, L518, L519,
L520, L605, L606,
L607, L608, L609,
L610, L611, L612,
L613, L614, L615,
L616, L617, L618,
L619, L620
OSC401
AD9252
Manufacturer
Part Number
NRC04Z0TRF
Device
Resistor
Package
805
Value
0 Ω, 1/8 W, 5% tol
Manufacturer
NIC
Components
Corp.
Oscillator
SMT
Valpey Fisher
VFAC3-BHL-50MHz
Connector
SMA
Johnson
Components
142-0701-851
1
P101, P103, P105,
P107, P201, P203,
P205, P207, P401
P301
Clock oscillator,
50.00 MHz, 3.3 V,
±5% duty cycle
Side-mount SMA for
0.063" board thickness
Connector
HEADER
Tyco
6469169-1
30
1
P701
Connector
Switchcraft
RAPC722X
31
21
Resistor
NIC
Components
Corp.
NRC04J103TRF
32
18
Resistor
402
0 Ω, 1/16 W, 5% tol
NIC
Components
Corp.
NRC04Z0TRF
33
8
Resistor
402
64.9 Ω, 1/16 W, 1% tol
8
Resistor
603
0 Ω, 1/10 W, 5% tol
35
28
Resistor
402
1 kΩ, 1/16 W, 1% tol
NIC
Components
Corp.
NIC
Components
Corp.
NIC
Components
Corp.
NRC04F64R9TRF
34
36
16
R301, R307, R401,
R402, R410, R413,
R504, R505, R511,
R512, R523, R524,
R604, R605, R611,
R612, R623, R624,
R711, R714, R715
R103, R117, R129,
R142, R203, R219,
R235, R253, R317,
R405, R415, R416,
R417, R418, R706,
R707, R708, R709
R102, R115, R128,
R141, R202, R218,
R234, R252
R104, R116, R130,
R143, R204, R220,
R236, R254
R109, R111, R112,
R123, R125, R126,
R135, R138, R139,
R148, R149, R150,
R211, R212, R214,
R228, R231, R232,
R246, R249, R250,
R262, R265, R266,
R319, R710, R712,
R713
R108, R110, R121,
R122, R134, R136,
R146, R147, R209,
R210, R226, R227,
R242, R245, R260,
R261
0.1",
PCMT
402
1469169-1, right angle
2-pair, 25 mm, header
assembly
RAPC722, power
supply connector
10 kΩ, 1/16 W, 5% tol
Resistor
402
33 Ω, 1/16 W, 5% tol
Rev. E | Page 49 of 52
NIC
Components
Corp.
NRC06Z0TRF
NRC04F1001TRF
NRC04J330TRF
AD9252
Data Sheet
Item
37
Qty
per
Board
8
38
3
Reference
Designator
R161, R162, R163,
R164, R208, R225,
R241, R259
R303, R305, R306
39
1
40
41
Device
Resistor
Package
402
Value
499 Ω, 1/16 W, 1% tol
Resistor
402
100 kΩ, 1/16 W, 1% tol
R414
Resistor
402
4.12 kΩ, 1/16W, 1% tol
1
1
R404
R309
Resistor
Resistor
402
402
49.9 Ω, 1/16 W, 0.5% tol
4.99 kΩ, 1/16 W, 5% tol
42
5
R310, R501, R535,
R601, R634
Potentiometer
3-lead
43
1
R308
Resistor
402
10 kΩ, Cermet trimmer
potentiometer, 18-turn
top adjust, 10%, 1/2 W
470 kΩ, 1/16 W, 5% tol
44
4
R502, R536, R602,
R635
Resistor
402
39 kΩ, 1/16 W, 5% tol
45
16
Resistor
402
187 Ω, 1/16 W, 1% tol
46
8
Resistor
402
374 Ω, 1/16 W, 1% tol
47
8
Resistor
402
274 Ω, 1/16 W, 1% tol
48
11
Resistor
201
0 Ω, 1/20 W, 5% tol
49
1
R513, R514, R518,
R519, R525, R526,
R530, R531, R613,
R614, R618, R619,
R625, R626, R630,
R631
R515, R520, R527,
R532, R615, R620,
R627, R632
R503, R507, R508,
R509, R603, R607,
R608, R609
R425, R427, R429,
R431, R433, R435,
R436, R439, R441,
R443, R445
R701
Resistor
402
4.7 kΩ, 1/16 W, 1% tol
50
1
R702
Resistor
402
261 Ω, 1/16 W, 1% tol
51
1
R716
Resistor
603
261 Ω, 1/16 W, 1% tol
52
2
R420, R421
Resistor
402
240 Ω, 1/16 W, 5% tol
53
2
R422, R423
Resistor
402
100 Ω, 1/16 W, 1% tol
54
1
S701
Switch
SMD
Light Touch,
100 GE, 5 mm
Rev. E | Page 50 of 52
Manufacturer
NIC
Components
Corp.
NIC
Components
Corp.
NIC
Components
Corp.
Susumu
NIC
Components
Corp.
Copal
Electronics
Corp.
NIC
Components
Corp.
NIC
Components
Corp.
NIC
Components
Corp.
NIC
Components
Corp.
NIC
Components
Corp.
NIC
Components
Corp.
NIC
Components
Corp.
NIC
Components
Corp.
NIC
Components
Corp.
NIC
Components
Corp.
NIC
Components
Corp.
Panasonic
Manufacturer
Part Number
NRC04F4990TRF
NRC04F1003TRF
NRC04F4121TRF
RR0510R-49R9-D
NRC04F4991TRF
CT94EW103
NRC04J474TRF
NRC04J393TRF
NRC04F1870TRF
NRC04F3740TRF
NRC04F2740TRF
NRC02Z0TRF
NRC04J472TRF
NRC04F2610TRF
NRC06F261OTRF
NRC04J241TRF
NRC04F1000TRF
EVQPLDA15
Data Sheet
Item
55
Qty
per
Board
9
56
2
Reference
Designator
T101, T102, T103,
T104, T201, T202,
T203, T204, T401
U704, U707
57
2
58
59
60
AD9252
Device
Transformer
Package
CD542
IC
SOT-223
U501, U601
IC
CP-64-3
1
1
1
U706
U705
U301
IC
IC
IC
SOT-223
SOT-223
CP-64-3
61
1
U302
IC
SOT-23
62
1
U401
IC
63
1
U702
IC
64
1
U703
IC
65
1
U701
IC
LFCSP
CP-32-2
SC70,
MAA06A
SC70,
MAA06A
8-SOIC
1
Value
ADT1-1WT+,
1:1 impedance ratio
transformer
ADP3339AKC-1.8-RL,
1.5 A, 1.8 V LDO
regulator
AD8334ACPZ-REEL,
ultralow noise
precision dual VGA
ADP3339AKC-5-RL7
ADP3339AKC-3.3-RL
AD9252BCPZ-50, octal,
14-bit, 50 MSPS serial
LVDS 1.8 V ADC
ADR510ARTZ, 1.0 V,
precision low noise
shunt voltage
reference
AD9515BCPZ, 1.6 GHz
clock distribution IC
NC7WZ07P6X_NL,
UHS dual buffer
NC7WZ16P6X_NL,
UHS dual buffer
Flash prog
mem 1k × 14,
RAM size 64 × 8,
20 MHz speed, PIC12F
controller series
This BOM is RoHS compliant.
Rev. E | Page 51 of 52
Manufacturer
Mini-Circuits
Manufacturer
Part Number
ADT1-1WT+
Analog Devices
ADP3339AKCZ-1.8-RL
Analog Devices
AD8334ACPZ-REEL
Analog Devices
Analog Devices
Analog Devices
ADP3339AKCZ-5-RL7
ADP3339AKCZ-3.3-RL
AD9252BCPZ-50
Analog Devices
ADR510ARTZ
Analog Devices
AD9515BCPZ
Fairchild
NC7WZ07P6X_NL
Fairchild
NC7WZ16P6X_NL
Microchip
PIC12F629-I/SNG
AD9252
Data Sheet
OUTLINE DIMENSIONS
0.60 MAX
9.00
BSC SQ
0.60
MAX
48
64 1
49
PIN 1
INDICATOR
PIN 1
INDICATOR
0.50
BSC
0.50
0.40
0.30
0.05 MAX
0.02 NOM
SEATING
PLANE
0.30
0.23
0.18
0.22 MIN
7.50
REF
0.80 MAX
0.65 TYP
12° MAX
16
17
33
32
TOP VIEW
1.00
0.85
0.80
7.55
7.50 SQ
7.45
EXPOSED PAD
(BOTTOM VIEW)
0.20 REF
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COMPLIANT TO JEDEC STANDARDS MO-220-VMMD-4
02-23-2010-B
8.75
BSC SQ
Figure 73. 64-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
9 mm × 9 mm Body, Very Thin Quad
(CP-64-6)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
AD9252ABCPZ-50
AD9252ABCPZRL7-50
AD9252-50EBZ
1
2
Notes
2
Temperature
Range
−40°C to +85°C
−40°C to +85°C
Package Description
64-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
64-Lead Lead Frame Chip Scale Package [LFCSP_VQ] 7” Tape and Reel
Evaluation Board
Z = RoHS Compliant Part.
Interposer board (HSC-ADC-FIFO5-INTZ) is required to connect to HSC-ADC-EVALCZ data capture board.
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registered trademarks are the property of their respective owners.
D06296-0-12/11(E)
Rev. E | Page 52 of 52
Package
Option
CP-64-6
CP-64-6