a
FEATURES
Complete Dual Matching ADCs
Low Power Dissipation: 215 mW (+3 V Supply)
Single Supply: 2.7 V to 5.5 V
Differential Nonlinearity Error: 0.4 LSB
On-Chip Analog Input Buffers
On-Chip Reference
Signal-to-Noise Ratio: 57.8 dB
Over Nine Effective Bits
Spurious-Free Dynamic Range: –73 dB
No Missing Codes Guaranteed
28-Lead SSOP
Dual Channel, 20 MHz 10-Bit
Resolution CMOS ADC
AD9201
FUNCTIONAL BLOCK DIAGRAM
AVDD
IINA
"I" ADC
IINB
IREFB
IREFT
QREFB
QREFT
AVSS
CLOCK
I
REGISTER
AD9201
SLEEP
SELECT
ASYNCHRONOUS
MULTIPLEXER
VREF
QINA
DVSS
REFERENCE
BUFFER
THREESTATE
OUTPUT
BUFFER
DATA
10 BITS
1V
REFSENSE
QINB
DVDD
"Q" ADC
Q
REGISTER
CHIP
SELECT
PRODUCT DESCRIPTION
PRODUCT HIGHLIGHTS
The AD9201 is a complete dual channel, 20 MSPS, 10-bit
CMOS ADC. The AD9201 is optimized specifically for applications where close matching between two ADCs is required (e.g.,
I/Q channels in communications applications). The 20 MHz
sampling rate and wide input bandwidth will cover both narrowband and spread-spectrum channels. The AD9201 integrates two
10-bit, 20 MSPS ADCs, two input buffer amplifiers, an internal
voltage reference and multiplexed digital output buffers.
1. Dual 10-Bit, 20 MSPS ADCs
A pair of high performance 20 MSPS ADCs that are optimized for spurious free dynamic performance are provided for
encoding of I and Q or diversity channel information.
Each ADC incorporates a simultaneous sampling sample-andhold amplifier at its input. The analog inputs are buffered; no
external input buffer op amp will be required in most applications. The ADCs are implemented using a multistage pipeline
architecture that offers accurate performance and guarantees no
missing codes. The outputs of the ADCs are ported to a multiplexed digital output buffer.
3. On-Chip Voltage Reference
The AD9201 includes an on-chip compensated bandgap
voltage reference pin programmable for 1 V or 2 V.
The AD9201 is manufactured on an advanced low cost CMOS
process, operates from a single supply from 2.7 V to 5.5 V, and
consumes 215 mW of power (on 3 V supply). The AD9201 input
structure accepts either single-ended or differential signals,
providing excellent dynamic performance up to and beyond
its 10 MHz Nyquist input frequencies.
2. Low Power
Complete CMOS Dual ADC function consumes a low
215 mW on a single supply (on 3 V supply). The AD9201
operates on supply voltages from 2.7 V to 5.5 V.
4. On-chip analog input buffers eliminate the need for external
op amps in most applications.
5. Single 10-Bit Digital Output Bus
The AD9201 ADC outputs are interleaved onto a single
output bus saving board space and digital pin count.
6. Small Package
The AD9201 offers the complete integrated function in a
compact 28-lead SSOP package.
7. Product Family
The AD9201 dual ADC is pin compatible with a dual 8-bit
ADC (AD9281) and has a companion dual DAC product,
the AD9761 dual DAC.
REV. D
Information furnished by Analog Devices is believed to be accurate and
reliable. However, no responsibility is assumed by Analog Devices for its
use, nor for any infringements of patents or other rights of third parties
which may result from its use. No license is granted by implication or
otherwise under any patent or patent rights of Analog Devices.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781/329-4700
World Wide Web Site: http://www.analog.com
Fax: 781/326-8703
© Analog Devices, Inc., 1999
AD9201–SPECIFICATIONS
Parameter
Symbol
(AVDD = +3 V, DVDD = +3 V, FSAMPLE = 20 MSPS, VREF = 2 V, INB = 0.5 V, TMIN to TMAX,
internal ref, differential input signal, unless otherwise noted)
Min
RESOLUTION
Typ
Max
10
CONVERSION RATE
FS
DC ACCURACY
Differential Nonlinearity
Integral Nonlinearity
Differential Nonlinearity (SE)
Integral Nonlinearity (SE)
Zero-Scale Error, Offset Error
Full-Scale Error, Gain Error
Gain Match
Offset Match
ANALOG INPUT
Input Voltage Range
Input Capacitance
Aperture Delay
Aperture Uncertainty (Jitter)
Aperture Delay Match
Input Bandwidth (–3 dB)
Small Signal (–20 dB)
Full Power (0 dB)
± 0.4
1.2
± 0.5
± 1.5
± 1.5
± 3.5
± 0.5
±5
DNL
INL
DNL
INL
EZS
EFS
AIN
CIN
tAP
tAJ
–0.5
Units
Condition
Bits
20
MHz
±1
± 2.5
± 3.8
± 5.4
LSB
LSB
LSB
LSB
% FS
% FS
LSB
LSB
2
4
2
2
AVDD/2
V
pF
ns
ps
ps
240
245
MHz
MHz
1
± 10
2
± 15
V
mV
V
mV
mV
mV
REFT = 1 V, REFB = 0 V
REFT = 1 V, REFB = 0 V
BW
INTERNAL REFERENCE
Output Voltage (1 V Mode)
Output Voltage Tolerance (1 V Mode)
Output Voltage (2 V Mode)
Output Voltage Tolerance (2 V Mode)
Load Regulation (1 V Mode)
Load Regulation (2 V Mode)
POWER SUPPLY
Operating Voltage
VREF
VREF
± 15
AVDD
DRVDD
IAVDD
IDRVDD
PD
Supply Current
Power Consumption
Power-Down
Power Supply Rejection
2.7
2.7
PSR
3
3
71.6
0.1
215
15.5
0.8
± 28
5.5
5.5
245
1.3
V
V
mA
mA
mW
mW
% FS
REFSENSE = VREF
REFSENSE = GND
1 mA Load Current
1 mA Load Current
AVDD – DVDD ≤ 2.3 V
AVDD = 3 V
AVDD = DVDD = 3 V
STBY = AVDD, Clock = AVSS
1
DYNAMIC PERFORMANCE
Signal-to-Noise and Distortion
f = 3.58 MHz
f = 10 MHz
Signal-to-Noise
f = 3.58 MHz
f = 10 MHz
Total Harmonic Distortion
f = 3.58 MHz
f = 10 MHz
Spurious Free Dynamic Range
f = 3.58 MHz
f = 10 MHz
Two-Tone Intermodulation Distortion2
Differential Phase
Differential Gain
Crosstalk Rejection
SINAD
55.6
57.3
55.8
dB
dB
55.9
57.8
56.2
dB
dB
SNR
THD
–69
–66.3
–63.3
dB
dB
SFDR
–66
IMD
DP
DG
–73
–70.5
–62
0.1
0.05
68
–2–
dB
dB
dB
Degree
%
dB
f = 44.49 MHz and 45.52 MHz
NTSC 40 IRE Mod Ramp
FS = 14.3 MHz
REV. D
AD9201
Parameter
Symbol
Min
Typ
Max
Units
Condition
3
DYNAMIC PERFORMANCE (SE)
Signal-to-Noise and Distortion
f = 3.58 MHz
Signal-to-Noise
f = 3.58 MHz
Total Harmonic Distortion
f = 3.58 MHz
Spurious Free Dynamic Range
f = 3.58 MHz
SINAD
52.3
dB
55.5
dB
–55
dB
–58
dB
SNR
THD
SFDR
DIGITAL INPUTS
High Input Voltage
Low Input Voltage
DC Leakage Current
Input Capacitance
VIH
VIL
IIN
CIN
LOGIC OUTPUT (with DVDD = 3 V)
High Level Output Voltage
(IOH = 50 µA)
Low Level Output Voltage
(IOL = 1.5 mA)
LOGIC OUTPUT (with DVDD = 5 V)
High Level Output Voltage
(IOH = 50 µA)
Low Level Output Voltage
(IOL = 1.5 mA)
Data Valid Delay
MUX Select Delay
Data Enable Delay
Data High-Z Delay
CLOCKING
Clock Pulsewidth High
Clock Pulsewidth Low
Pipeline Latency
2.4
V
V
µA
pF
0.3
±6
2
VOH
2.88
V
VOL
0.095
V
VOH
4.5
V
VOL
tOD
tMD
tED
0.4
11
7
13
V
ns
ns
ns
tDHZ
13
ns
3.0
ns
ns
Cycles
tCH
tCL
22.5
22.5
CL = 20 pF. Output Level to
90% of Final Value
NOTES
1
AIN differential 2 V p-p, REFT = 1.5 V, REFB = –0.5 V.
2
IMD referred to larger of two input signals.
3
SE is single ended input, REFT = 1.5 V, REFB = –0.5 V.
Specifications subject to change without notice.
tOD
CLOCK
INPUT
ADC SAMPLE
#1
SELECT
INPUT
ADC SAMPLE
#2
ADC SAMPLE
#3
SAMPLE #1-3
Q CHANNEL
OUTPUT
I CHANNEL
OUTPUT ENABLED
SAMPLE #1
Q CHANNEL
OUTPUT
SAMPLE #1-2
Q CHANNEL
OUTPUT
SAMPLE #1-1
I CHANNEL
OUTPUT
Figure 1. ADC Timing
REV. D
ADC SAMPLE
#5
t MD
Q CHANNEL
OUTPUT ENABLED
SAMPLE #1-1
Q CHANNEL
OUTPUT
DATA
OUTPUT
ADC SAMPLE
#4
–3–
SAMPLE #1
I CHANNEL
OUTPUT
SAMPLE #2
Q CHANNEL
OUTPUT
AD9201
ABSOLUTE MAXIMUM RATINGS*
With
Respect
to
Parameter
AVDD
AVSS
DVDD
DVSS
AVSS
DVSS
AVDD
DVDD
CLK
AVSS
Digital Outputs
DVSS
AINA, AINB
AVSS
VREF
AVSS
REFSENSE
AVSS
REFT, REFB
AVSS
Junction Temperature
Storage Temperature
Lead Temperature
10 sec
PIN FUNCTION DESCRIPTIONS
Pin
Min
Max
Units
–0.3
–0.3
–0.3
–6.5
–0.3
–0.3
–1.0
–0.3
–0.3
–0.3
+6.5
+6.5
+0.3
+6.5
AVDD + 0.3
DVDD + 0.3
AVDD + 0.3
AVDD + 0.3
AVDD + 0.3
AVDD + 0.3
+150
+150
V
V
V
V
V
V
V
V
V
V
°C
°C
+300
°C
–65
*Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to absolute maximum ratings
for extended periods may effect device reliability.
ORDERING GUIDE
Model
AD9201ARS
AD9201-EVAL
Temperature
Range
Package
Description
Package
Options*
–40°C to +85°C
28-Lead SSOP
RS-28
Evaluation Board
*RS = Shrink Small Outline.
PIN CONFIGURATION
DVSS
CHIP-SELECT
DVDD
INA-Q
(LSB) D0
INB-Q
D2
AD9201
D3
TOP VIEW
(Not to Scale)
Description
1
2
3
4
5
6
7
8
9
10
11
12
DVSS
DVDD
D0
D1
D2
D3
D4
D5
D6
D7
D8
D9
Digital Ground
Digital Supply
Bit 0 (LSB)
Bit 1
Bit 2
Bit 3
Bit 4
Bit 5
Bit 6
Bit 7
Bit 8
Bit 9 (MSB)
13
14
15
SELECT
CLOCK
SLEEP
Hi I Channel Out, Lo Q Channel Out
Clock
Hi Power Down, Lo Normal Operation
16
17
18
19
20
21
22
23
24
25
26
27
28
INA-I
INB-I
REFT-I
REFB-I
AVSS
REFSENSE
VREF
AVDD
REFB-Q
REFT-Q
INB-Q
INA-Q
CHIP-SELECT
I Channel, A Input
I Channel, B Input
Top Reference Decoupling, I Channel
Bottom Reference Decoupling, I Channel
Analog Ground
Reference Select
Internal Reference Output
Analog Supply
Bottom Reference Decoupling, Q Channel
Top Reference Decoupling, Q Channel
Q Channel, B Input
Q Channel, A Input
Hi-High Impedance, Lo-Normal Operation
REFB-Q
DEFINITIONS OF SPECIFICATIONS
AVDD
INTEGRAL NONLINEARITY (INL)
VREF
Integral nonlinearity refers to the deviation of each individual
code from a line drawn from “zero” through “full scale.” The
point used as “zero” occurs 1/2 LSB before the first code transition. “Full scale” is defined as a level 1 1/2 LSBs beyond the
last code transition. The deviation is measured from the center
of each particular code to the true straight line.
D5
REFSENSE
D6
AVSS
D7
REFB-I
D8
REFT-I
(MSB) D9
INB-I
SELECT
INA-I
CLOCK
Name
REFT-Q
D1
D4
No.
DIFFERENTIAL NONLINEARITY (DNL, NO MISSING
CODES)
SLEEP
An ideal ADC exhibits code transitions that are exactly 1 LSB
apart. DNL is the deviation from this ideal value. It is often
specified in terms of the resolution for which no missing codes
(NMC) are guaranteed.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD9201 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
–4–
WARNING!
ESD SENSITIVE DEVICE
REV. D
AD9201
AVDD
DRVDD
AVDD
AVDD
AVDD
AVDD
DRVSS
AVSS
AVSS
DRVSS
AVSS
AVSS
a. D0–D9, OTR
AVSS
b. Three-State, Standby
c. CLK
AVDD
AVDD
AVDD
AVDD
AVDD
IN
REFBS
AVSS
AVDD
AVSS
REFBF
AVSS
AVSS
AVSS
AVSS
d. INA, INB
e. Reference
f. REFSENSE
g. VREF
Figure 2. Equivalent Circuits
OFFSET ERROR
The first transition should occur at a level 1 LSB above “zero.”
Offset is defined as the deviation of the actual first code transition from that point.
scale. Gain error is the deviation of the actual difference between first and last code transitions and the ideal difference
between the first and last code transitions.
GAIN MATCH
The change in gain error between I and Q channels.
OFFSET MATCH
The change in offset error between I and Q channels.
PIPELINE DELAY (LATENCY)
EFFECTIVE NUMBER OF BITS (ENOB)
For a sine wave, SINAD can be expressed in terms of the number of bits. Using the following formula,
N = (SINAD – 1.76)/6.02
The number of clock cycles between conversion initiation and
the associated output data being made available. New output
data is provided every rising clock edge.
MUX SELECT DELAY
It is possible to get a measure of performance expressed as N,
the effective number of bits.
The delay between the change in SELECT pin data level and
valid data on output pins.
Thus, effective number of bits for a device for sine wave inputs
at a given input frequency can be calculated directly from its
measured SINAD.
POWER SUPPLY REJECTION
TOTAL HARMONIC DISTORTION (THD)
THD is the ratio of the rms sum of the first six harmonic components to the rms value of the measured input signal and
is expressed as a percentage or in decibels.
The specification shows the maximum change in full scale from
the value with the supply at the minimum limit to the value with
the supply at its maximum limit.
APERTURE JITTER
Aperture jitter is the variation in aperture delay for successive
samples and is manifested as noise on the input to the A/D.
SIGNAL-TO-NOISE RATIO (SNR)
SNR is the ratio of the rms value of the measured input signal to
the rms sum of all other spectral components below the Nyquist
frequency, excluding the first six harmonics and dc. The value
for SNR is expressed in decibels.
APERTURE DELAY
SPURIOUS FREE DYNAMIC RANGE (SFDR)
SIGNAL-TO-NOISE AND DISTORTION (S/N+D, SINAD)
RATIO
The difference in dB between the rms amplitude of the input
signal and the peak spurious signal.
GAIN ERROR
The first code transition should occur for an analog value 1 LSB
above nominal negative full scale. The last transition should
occur for an analog value 1 LSB below the nominal positive full
REV. D
Aperture delay is a measure of the Sample-and-Hold Amplifier
(SHA) performance and is measured from the rising edge of the
clock input to when the input signal is held for conversion.
S/N+D is the ratio of the rms value of the measured input signal
to the rms sum of all other spectral components below the
Nyquist frequency, including harmonics but excluding dc.
The value for S/N+D is expressed in decibels.
–5–
AD9201–Typical Characteristic Curves
1.5
65
1.0
60
–0.5dB
0.5
55
–6dB
SNR – dB
INL
(AVDD = +3 V, DVDD = +3 V, FS = 20 MHz (50% duty cycle), 2 V input span from –0.5 V to
+1.5 V, 2 V internal reference unless otherwise noted)
0
50
–0.5
45
–1.0
40
–1.5
0
128
256
384
512
640
CODE OFFSET
768
896
–20dB
35
1.00E+05
1024
1.00E+06
1.00E+07
INPUT FREQUENCY – Hz
1.00E+08
Figure 6. SNR vs. Input Frequency
Figure 3. Typical INL (1 V Internal Reference)
1
65
60
–0.5dB
0.5
SINAD – dB
DNL
55
0
–6dB
50
45
–0.5
–20dB
40
–1.0
0
128
256
384
512
640
CODE OFFSET
768
896
35
1.00E+05
1024
1.00E+08
Figure 7. SINAD vs. Input Frequency
1.00
–30
0.80
–35
0.60
–40
0.40
–45
0.20
–50
THD – dB
IB – nA
Figure 4. Typical DNL (1 V Internal Reference)
1.00E+06
1.00E+07
INPUT FREQUENCY – Hz
0.00
–0.20
–20dB
–55
–6dB
–60
–0.40
–65
–0.60
–70
–0.80
–75
–0.5dB
–1.00
–1.0
–0.5
0
0.5
1.0
INPUT VOLTAGE – V
1.5
–80
1.00E+05
2.0
1.00E+06
1.00E+07
INPUT FREQUENCY – Hz
1.00E+08
Figure 8. THD vs. Input Frequency
Figure 5. Input Bias Current vs. Input Voltage
–6–
REV. D
AD9201
–75
1.20E+07
–70
1.00E+07
10000000
HITS
THD – dB
8.00E+06
–65
6.00E+06
–60
4.00E+06
–55
2.00E+06
255100
–50
1.00E+06
1.00E+07
CLOCK FREQUENCY – Hz
0.00E+00
1.00E+08
Figure 9. THD vs. Clock Frequency (fIN = 1 MHz)
N–1
150400
N
CODE
N+1
Figure 12. Grounded Input Histogram
1.012
0
–3
1.011
–6
–9
AMPLITUDE – dB
VREF – V
1.010
1.009
1.008
–12
–15
–18
–21
–24
1.007
–27
1.006
–40
0
–20
20
40
60
TEMPERATURE – 8C
80
–30
1.00E+06
100
Figure 10. Voltage Reference Error vs. Temperature
1.00E+09
Figure 13. Full Power Bandwidth
220
60
–0.5dB
215
55
210
–6.0dB
205
SNR – dB
POWER CONSUMPTION – mW
1.00E+07
1.00E+08
INPUT FREQUENCY – Hz
200
195
50
45
190
40
185
180
0
2
4
8
6
10
12
14
CLOCK FREQUENCY – MHz
16
18
35
1.00E+05
20
Figure 11. Power Consumption vs. Clock Frequency
REV. D
–20.0dB
1.00E+07
1.00E+06
INPUT FREQUENCY – Hz
1.00E+08
Figure 14. SNR vs. Input Frequency (Single Ended)
–7–
AD9201
The AD9201 also includes an on-chip bandgap reference and
reference buffer. The reference buffer shifts the ground-referred
reference to levels more suitable for use by the internal circuits
of the converter. Both converters share the same reference and
reference buffer. This scheme provides for the best possible gain
match between the converters while simultaneously minimizing
the channel-to-channel crosstalk. (See Figure 16.)
10
0
FUND
–10
–20
I CHANNEL
–30
–40
–50
–60
–70
2ND
3RD
–80
5TH
4TH
9TH
6TH
Each A/D converter has its own output latch, which updates on
the rising edge of the input clock. A logic multiplexer, controlled through the SELECT pin, determines which channel is
passed to the digital output pins. The output drivers have their
own supply (DVDD), allowing the part to be interfaced to a
variety of logic families. The outputs can be placed in a high
impedance state using the CHIP SELECT pin.
7TH
8TH
–90
–100
–110
–120
0.0E+0 1.0E+6 2.0E+6 3.0E+6 4.0E+6 5.0E+6 6.0E+6 7.0E+6 8.0E+6 9.0E+6 10.0E+6
10
0
The AD9201 has great flexibility in its supply voltage. The
analog and digital supplies may be operated from 2.7 V to 5.5 V,
independently of one another.
FUND
–10
Q CHANNEL
–20
–30
ANALOG INPUT
–40
Figure 16 shows an equivalent circuit structure for the analog
input of one of the A/D converters. PMOS source-followers
buffer the analog input pins from the charge kickback problems
normally associated with switched capacitor ADC input structures. This produces a very high input impedance on the part,
allowing it to be effectively driven from high impedance sources.
This means that the AD9201 could even be driven directly by a
passive antialias filter.
–50
–60
–70
–80
2ND
4TH
3RD
5TH
6TH
7TH 8TH
9TH
–90
–100
–110
–120
0.0E+0 1.0E+6 2.0E+6 3.0E+6 4.0E+6 5.0E+6 6.0E+6 7.0E+6 8.0E+6 9.0E+6 10.0E+6
Figure 15. Simultaneous Operation of I and Q Channels
(Differential Input)
IINA
BUFFER
THEORY OF OPERATION
OUTPUT
WORD
ADC
CORE
SHA
The AD9201 integrates two A/D converters, two analog input
buffers, an internal reference and reference buffer, and an output multiplexer. For clarity, this data sheet refers to the two
converters as “I” and “Q.” The two A/D converters simultaneously sample their respective inputs on the rising edge of the
input clock. The two converters distribute the conversion operation over several smaller A/D subblocks, refining the conversion
with progressively higher accuracy as it passes the result from
stage to stage. As a consequence of the distributed conversion,
each converter requires a small fraction of the 1023 comparators
used in a traditional flash-type 10-bit ADC. A sample-and-hold
function within each of the stages permits the first stage to operate on a new input sample while the following stages continue to
process previous samples. This results in a “pipeline processing”
latency of three clock periods between when an input sample is
taken and when the corresponding ADC output is updated into
the output registers.
+FS
LIMIT
IINB
–FS
LIMIT
BUFFER
+FS LIMIT =
VREF +VREF/2
–FS LIMIT =
VREF –VREF/2
VREF
Figure 16. Equivalent Circuit for AD9201 Analog Inputs
The source followers inside the buffers also provide a level-shift
function of approximately 1 V, allowing the AD9201 to accept
inputs at or below ground. One consequence of this structure is
that distortion will result if the analog input approaches the
positive supply. For optimum high frequency distortion performance, the analog input signal should be centered according
to Figure 29.
The capacitance load of the analog input Pin is 4 pF to the
analog supplies (AVSS, AVDD).
The AD9201 integrates input buffer amplifiers to drive the
analog inputs of the converters. In most applications, these
input amplifiers eliminate the need for external op amps for the
input signals. The input structure is fully differential, but the
SHA common-mode response has been designed to allow the
converter to readily accommodate either single-ended or differential input signals. This differential structure makes the part
capable of accommodating a wide range of input signals.
Full-scale setpoints may be calculated according to the following
algorithm (VREF may be internally or externally generated):
–FS = (VREF – VREF/2)
+FS = (VREF + VREF/2)
VSPAN = VREF
–8–
REV. D
AD9201
The AD9201 can accommodate a variety of input spans between 1 V and 2 V. For spans of less than 1 V, expect a proportionate degradation in SNR . Use of a 2 V span will provide the
best noise performance. 1 V spans will provide lower distortion
when using a 3 V analog supply. Users wishing to run with
larger full-scales are encouraged to use a 5 V analog supply
(AVDD).
Single-Ended Inputs: For single-ended input signals, the
signal is applied to one input pin and the other input pin is tied
to a midscale voltage. This midscale voltage defines the center
of the full-scale span for the input signal.
EXAMPLE: For a single-ended input range from 0 V to 1 V
applied to IINA, we would configure the converter for a 1 V
reference (See Figure 17) and apply 0.5 V to IINB.
1V
0V
0.1mF
INPUT
MIDSCALE
VOLTAGE
= 0.5V
IINA
I OR QREFT
IINB
I OR QREFB
0.1mF
10mF
AC Coupled Inputs
If the signal of interest has no dc component, ac coupling can be
easily used to define an optimum bias point. Figure 18 illustrates one recommended configuration. The voltage chosen for
the dc bias point (in this case the 1 V reference) is applied to
both IINA and IINB pins through 1 kΩ resistors (R1 and R2).
IINA is coupled to the input signal through Capacitor C1, while
IINB is decoupled to ground through Capacitor C2 and C3.
Transformer Coupled Inputs
Another option for input ac coupling is to use a transformer.
This not only provides dc rejection, but also allows truly differential drive of the AD9201’s analog inputs, which will provide
the optimal distortion performance. Figure 19 shows a recommended transformer input drive configuration. Resistors R1 and
R2 define the termination impedance of the transformer coupling.
The center tap of the transformer secondary is tied to the common-mode reference, establishing the dc bias point for the analog inputs.
10mF
0.1mF
0.1mF
AD9201
5kV
5kV
VREF
REFSENSE
QINA
IINB
QINB
R2
AD9201
COMMON
MODE
VOLTAGE
0.1mF
I OR QREFT
0.1mF
10mF
0.1mF
IINA
R1
10mF
VREF
I OR QREFB
0.1mF
10mF
0.1mF
REFSENSE
Figure 17. Example Configuration for 0 V–1 V SingleEnded Input Signal
Note that since the inputs are high impedance, this reference
level can easily be generated with an external resistive divider
with large resistance values (to minimize power dissipation). A
decoupling capacitor is recommended on this input to minimize
the high frequency noise-coupling onto this pin. Decoupling
should occur close to the ADC.
Differential Inputs
Use of differential input signals can provide greater flexibility in
input ranges and bias points, as well as offering improvements in
distortion performance, particularly for high frequency input
signals. Users with differential input signals will probably want
to take advantage of the differential input structure.
Figure 19. Example Configuration for Transformer
Coupled Inputs
Crosstalk: The internal layout of the AD9201, as well as its
pinout, was configured to minimize the crosstalk between the
two input signals. Users wishing to minimize high frequency
crosstalk should take care to provide the best possible decoupling
for input pins (see Figure 20). R and C values will make a pole
dependant on antialiasing requirements. Decoupling is also
required on reference pins and power supplies (see Figure 21).
IINA
QINA
AD9201
IINB
1.5V
QINB
0.1mF
ANALOG
INPUT
C1
C2
1.0mF
REFT
0.5V
IINA
R1
1kV
C3
0.1mF
0.1mF
Figure 20. Input Loading
10mF
REFB
IINB
0.1mF
V ANALOG
V DIGITAL
AD9201
AVDD
VREF
10mF
REFSENSE
0.1mF
DVDD
AD9201
0.1mF
10mF
0.1mF
10mF
I OR QREFT
Figure 18. Example Configuration for 0.5 V–1.5 V ac
Coupled Single-Ended Inputs
0.1mF
I OR QREFB
0.1mF
Figure 21. Reference and Power Supply Decoupling
REV. D
–9–
AD9201
REFERENCE AND REFERENCE BUFFER
The reference and buffer circuitry on the AD9201 is configured
for maximum convenience and flexibility. An illustration of the
equivalent reference circuit is show in Figure 26. The user can
select from five different reference modes through appropriate
pin-strapping (see Table I below). These pin strapping options
cause the internal circuitry to reconfigure itself for the appropriate operating mode.
Externally Set Voltage Mode (Figure 24)—this mode uses
the on-chip reference, but scales the exact reference level though
the use of an external resistor divider network. VREF is wired to
the top of the network, with the REFSENSE wired to the tap
point in the resistor divider. The reference level (and input full
scale) will be equal to 1 V × (R1 + R2)/R1. This method can be
used for voltage levels from 0.7 V to 2.5 V.
1mF
Table I. Table of Modes
0.1mF
Mode
Input Span
REFSENSE Pin Figure
1V
2V
Programmable
External
1V
2V
1 + (R1/R2)
= External Ref
VREF
AGND
See Figure
AVDD
1V
+
VREF
+–
–
22
23
24
25
R2
R1
1V
0V
0V
IINA
QINA
IINB
QINB
0.1mF
AD9201
External Reference Mode (Figure 25)—in this mode, the onchip reference is disabled, and an external reference is applied to
the VREF pin. This mode is achieved by tying the REFSENSE
pin to AVDD.
1V
AD9201
1V
0V
10mF
0.1mF
I OR QREFT
0.1mF
0.1mF
5kV
1V
EXT
REFERENCE
10mF
2V
2V
0V
0V
5kV
0.1mF
5kV
AD9201
VREF
AD9201
0.1mF
I OR QREFT
0.1mF
AVDD
2 V Mode (Figure 23)—provides a 2 V reference and 2 V input
full scale. Recommended for noise sensitive applications on 5 V
supplies. The part is placed in 2 V reference mode by grounding
(shorting to AVSS) the REFSENSE pin.
QINB
QINB
0.1mF
10mF
I OR QREFB
Figure 22. 0 V to 1 V Input
IINB
IINB
VREF
10mF
0.1mF
QINA
QINA
0.1mF
I OR QREFB
IINA
IINA
5kV
VREF
REFSENSE
10mF
0.1mF
0V
1V
10mF
I OR QREFB
Figure 24. Programmable Reference
0.1mF
5kV
10mF
I OR QREFT
VREF = 1 + R2
R1
5kV
10mF
0.1mF
AVSS
1 V Mode (Figure 22)—provides a 1 V reference and 1 V input
full scale. Recommended for applications wishing to optimize
high frequency performance, or any circuit on a supply voltage
of less than 4 V. The part is placed in this mode by shorting the
REFSENSE pin to the VREF pin.
1V
REFSENSE
REFSENSE
0.1mF
Figure 25. External Reference
Reference Buffer—The reference buffer structure takes the
voltage on the VREF pin and level-shifts and buffers it for use
by various subblocks within the two A/D converters. The two
converters share the same reference buffer amplifier to maintain
the best possible gain match between the two converters. In the
interests of minimizing high frequency crosstalk, the buffered
references for the two converters are separately decoupled on
the IREFB, IREFT, QREFB and QREFT pins, as illustrated in
Figure 26.
0.1mF
I OR QREFT
10mF
0.1mF
0.1mF
10mF
I OR QREFB
REFSENSE
0.1mF
Figure 23. 0 V to 2 V Input
–10–
REV. D
AD9201
VREF
ADC
CORE
0.1mF
10mF
22V
QREFT
IREFT
0.1mF
0.1mF
0.1mF
6
50V
1V
IREFB
0.1mF
QREFB
0.1mF
0.33mF
24V
16
22V
2
10pF
1kV
0.1mF
0.01mF
VREF
10mF
17
ADC
3
10mF
10pF
1kV
AD8051
1kV
10kV
REFSENSE
Figure 27.
10kV
INTERNAL
CONTROL
LOGIC
10
FUND
0
AVSS
AD9201
–10
–20
Figure 26. Reference Buffer Equivalent Circuit and External Decoupling Recommendation
–30
–40
For best results in both noise suppression and robustness
against crosstalk, the 4 capacitor buffer decoupling arrangement
shown in Figure 26 is recommended. This decoupling should
feature chip capacitors located close to the converter IC. The
capacitors are connected to either IREFT/IREFB or QREFT/
QREFB. A connection to both sides is not required.
–50
2ND
3RD
–60
–70
4TH
7TH
6TH
8TH
–80
5TH
–90
–100
–110
DRIVING THE AD9201
–120
0.0E+0
Figure 27 illustrates the use of an AD8051 to drive the AD9201.
Even though the AD8051 is specified with 3 V and 5 V power,
the best results are obtained at ± 5 V power. The ADC input
span is 2 V.
REV. D
2.0E+6
4.0E+6
6.0E+6
8.0E+6
10.0E+6
1.0E+6
3.0E+6
5.0E+6
7.0E+6
9.0E+6
Figure 28. AD8051/AD9201 Performance
–11–
AD9201
COMMON-MODE PERFORMANCE
Inspection of the curves will yield the following conclusions:
Attention to the common-mode point of the analog input voltage can improve the performance of the AD9201. Figure 29
illustrates THD as a function of common-mode voltage (center
point of the analog input span) and power supply.
1. An AD9201 running with AVDD = 5 V is the easiest to
drive.
2. Differential inputs are the most insensitive to common-mode
voltage.
3. An AD9201 powered by AVDD = 3 V and a single ended
input, should have a 1 V span with a common-mode voltage
of 0.75 V.
–10
–30
2V SPAN
–35
–20
2V SPAN
–40
–30
–50
THD – dB
THD – dB
–45
–55
–60
–40
–50
1V SPAN
1V SPAN
–65
–60
–70
–70
–75
–80
–0.5
0
0.5
1.0
COMMON-MODE LEVEL – V
–80
–0.5
1.5
a. Differential Input, 3 V Supplies
0
1.5
0.5
1.0
COMMON-MODE LEVEL – V
c. Single-Ended Input, 3 V Supplies
–30
–10
–35
–20
–40
2V SPAN
–30
–50
THD – dB
THD – dB
–45
2V SPAN
–55
–60
–65
–70
–40
–50
–60
1V SPAN
–80
–0.5
1V SPAN
–70
–75
0
1.5
0.5
1.0
COMMON-MODE LEVEL – V
2.0
–80
–0.5
2.5
b. Differential Input, 5 V Supplies
0
1.5
0.5
1.0
COMMON-MODE LEVEL – V
2.0
2.5
d. Single-Ended Input, 5 V Supplies
Figure 29. THD vs. CML Input Span and Power Supply (Analog Input = 1 MHz)
–12–
REV. D
AD9201
DIGITAL INPUTS AND OUTPUTS
SELECT
Each of the AD9201 digital control inputs, CHIP SELECT,
CLOCK, SELECT and SLEEP are referenced to AVDD and
AVSS. Switching thresholds will be AVDD/2.
When the select pin is held LOW, the output word will present
the “Q” level. When the select pin is held HIGH, the “I” level
will be presented to the output word (see Figure 1).
The format of the digital output is straight binary. A low power
mode feature is provided such that for STBY = HIGH and the
clock disabled, the static power of the AD9201 will drop below
22 mW.
The AD9201’s select and clock pins may be driven by a common signal source. The data will change in 5 ns to 11 ns after
the edges of the input pulse. The user must make sure the interface latches have sufficient hold time for the AD9201’s delays
(see Figure 30).
CLOCK INPUT
The AD9201 clock input is internally buffered with an inverter
powered from the AVDD pin. This feature allows the AD9201
to accommodate either +5 V or +3.3 V CMOS logic input signal swings with the input threshold for the CLK pin nominally
at AVDD/2.
The pipelined architecture of the AD9201 operates on both
rising and falling edges of the input clock. To minimize duty
cycle variations the logic family recommended to drive the clock
input is high speed or advanced CMOS (HC/HCT, AC/ACT)
logic. CMOS logic provides both symmetrical voltage threshold
levels and sufficient rise and fall times to support 20 MSPS
operation. Running the part at slightly faster clock rates may be
possible, although at reduced performance levels. Conversely,
some slight performance improvements might be realized by
clocking the AD9201 at slower clock rates.
The power dissipated by the output buffers is largely proportional to the clock frequency; running at reduced clock rates
provides a reduction in power consumption.
DIGITAL OUTPUTS
Each of the on-chip buffers for the AD9201 output bits (D0–D9)
is powered from the DVDD supply pin, separate from AVDD.
The output drivers are sized to handle a variety of logic families
while minimizing the amount of glitch energy generated. In all
cases, a fan-out of one is recommended to keep the capacitive
load on the output data bits below the specified 20 pF level.
For DVDD = 5 V, the AD9201 output signal swing is compatible with both high speed CMOS and TTL logic families. For
TTL, the AD9201 on-chip, output drivers were designed to
support several of the high speed TTL families (F, AS, S). For
applications where the clock rate is below 20 MSPS, other TTL
families may be appropriate. For interfacing with lower voltage
CMOS logic, the AD9201 sustains 20 MSPS operation with
DVDD = 3 V. In all cases, check your logic family data sheets
for compatibility with the AD9201’s Specification table.
CLOCK
CLOCK
SOURCE
I
PROCESSING
I LATCH
SELECT
CLK
DATA
DATA
OUT
DATA
Q
PROCESSING
Q LATCH
CLOCK
Figure 30. Typical De-Mux Connection
APPLICATIONS
USING THE AD9201 FOR QAM DEMODULATION
QAM is one of the most widely used digital modulation schemes
in digital communication systems. This modulation technique
can be found in both FDMA as well as spread spectrum (i.e.,
CDMA) based systems. A QAM signal is a carrier frequency
which is both modulated in amplitude (i.e., AM modulation)
and in phase (i.e., PM modulation). At the transmitter, it can
be generated by independently modulating two carriers of identical frequency but with a 90° phase difference. This results in
an inphase (I) carrier component and a quadrature (Q) carrier
component at a 90° phase shift with respect to the I component.
The I and Q components are then summed to provide a QAM
signal at the specified carrier or IF frequency. Figure 31 shows
a typical analog implementation of a QAM modulator using a
dual 10-bit DAC with 2× interpolation, the AD9761. A QAM
signal can also be synthesized in the digital domain thus requiring a single DAC to reconstruct the QAM signal. The AD9853
is an example of a complete (i.e., DAC included) digital QAM
modulator.
IOUT
DSP
OR
ASIC
A 2 ns reduction in output delays can be achieved by limiting
the logic load to 5 pF per output line.
10
AD9761
CARRIER
FREQUENCY
0
90
TO
MIXER
QOUT
THREE-STATE OUTPUTS
NYQUIST
FILTERS
The digital outputs of the AD9201 can be placed in a high
impedance state by setting the CHIP SELECT pin to HIGH.
This feature is provided to facilitate in-circuit testing or evaluation.
REV. D
QUADRATURE
MODULATOR
Figure 31. Typical Analog QAM Modulator Architecture
–13–
AD9201
At the receiver, the demodulation of a QAM signal back into its
separate I and Q components is essentially the modulation process explain above but in the reverse order. A common and
traditional implementation of a QAM demodulator is shown in
Figure 32. In this example, the demodulation is performed in
the analog domain using a dual, matched ADC and a quadrature demodulator to recover and digitize the I and Q baseband
signals. The quadrature demodulator is typically a single IC
containing two mixers and the appropriate circuitry to generate
the necessary 90° phase shift between the I and Q mixers’ local
oscillators. Before being digitized by the ADCs, the mixed
down baseband I and Q signals are filtered using matched analog filters. These filters, often referred to as Nyquist or PulseShaping filters, remove images-from the mixing process and any
out-of-band. The characteristics of the matching Nyquist filters
are well defined to provide optimum signal-to-noise (SNR)
performance while minimizing intersymbol interference. The
ADC’s are typically simultaneously sampling their respective
inputs at the QAM symbol rate or, most often, at a multiple of it
if a digital filter follows the ADC. Oversampling and the use of
digital filtering eases the implementation and complexity of the
analog filter. It also allows for enhanced digital processing for
both carrier and symbol recovery and tuning purposes. The use
of a dual ADC such as the AD9201 ensures excellent gain,
offset, and phase matching between the I and Q channels.
These characteristics result in both a reduction of electromagnetic interference (EMI) and an overall improvement in
performance.
It is important to design a layout that prevents noise from coupling onto the input signal. Digital signals should not be run in
parallel with the input signal traces and should be routed away
from the input circuitry. Separate analog and digital grounds
should be joined together directly under the AD9201 in a solid
ground plane. The power and ground return currents must be
carefully managed. A general rule of thumb for mixed signal
layouts dictates that the return currents from digital circuitry
should not pass through critical analog circuitry.
Transients between AVSS and DVSS will seriously degrade
performance of the ADC.
If the user cannot tie analog ground and digital ground together
at the ADC, he should consider the configuration in Figure 33.
AVDD
A
I
ADC
DSP
OR
ASIC
D
DIGITAL
LOGIC
ICs
CSTRAY
ANALOG
CIRCUITS
DIGITAL
CIRCUITS
B
A
A
CARRIER
FREQUENCY
LO
90°C
NYQUIST
FILTERS
IA
FROM
PREVIOUS
STAGE
QUADRATURE
DEMODULATOR
Figure 32. Typical Analog QAM Demodulator
GROUNDING AND LAYOUT RULES
As is the case for any high performance device, proper grounding and layout techniques are essential in achieving optimal
performance. The analog and digital grounds on the AD9201
have been separated to optimize the management of return
currents in a system. Grounds should be connected near the
ADC. It is recommended that a printed circuit board (PCB) of
at least four layers, employing a ground plane and power planes,
be used with the AD9201. The use of ground and power planes
offers distinct advantages:
CSTRAY
ID
AVSS
Q
ADC
DUAL MATCHED
ADC
A
ADC
IC
VIN
A
= ANALOG
D
= DIGITAL
LOGIC
SUPPLY
DVDD
A
GND
DVSS
DV
A
D
Figure 33. Ground and Power Consideration
Another input and ground technique is shown in Figure 34. A
separate ground plane has been split for RF or hard to manage
signals. These signals can be routed to the ADC differentially or
single ended (i.e., both can either be connected to the driver or
RF ground). The ADC will perform well with several hundred
mV of noise or signals between the RF and ADC analog ground.
RF
GROUND
ANALOG
GROUND
DIGITAL
GROUND
LOGIC
ADC
1. The minimization of the loop area encompassed by a signal
and its return path.
AIN
DATA
BIN
2. The minimization of the impedance associated with ground
and power paths.
-
3. The inherent distributed capacitor formed by the power plane,
PCB insulation and ground plane.
Figure 34. RF Ground Scheme
–14–
REV. D
AD9201
EVALUATION BOARD
The AD9201 evaluation board is shipped “ready to run.”
Power and signal generators should be connected as shown in
Figure 35. Then the user can observe the performance of the Q
channel. If the user wants to observe the I channel, then he
should install a jumper at JP22 Pins 1 and 2. If the user wants to
toggle between I and Q channels, then a CMOS level pulse train
should be applied to the “strobe” jack after appropriate jumper
connections.
+3V
AGND
SYNTHESIZER
20MHz
2Vp-p
SYNTHESIZER
1MHz
1Vp-p
ANTIALIAS
FILTER
+3V
+5V
AVDD DGND1 DVDD DGND2 DRVDD
CLOCK
AD9201
P1
Q IN
Figure 35. Evaluation Board Connections
REV. D
–15–
DSP
EQUIPMENT
AD9201
– 9201EB –
+C5
C54
C4
R50
R51
C14
C50
C51
C20
C22
REV
C29
C55
C35
+C36
C24
R52
R53
C52
C14
C17
C23
C27
C53
(NOT TO SCALE)
Figure 36. Evaluation Board Solder-Side Silkscreen
(NOT TO SCALE)
Figure 37. Evaluation Board Component-Side Layout
–16–
REV. D
AD9201
(NOT TO SCALE)
Figure 38. Evaluation Board Ground Plane Layout
(NOT TO SCALE)
Figure 39. Evaluation Board Solder-Side Layout
REV. D
–17–
AD9201
J1
AGND
CLOCK
DGND1
DGND2 DBVDD
BJ6
BJ5
J6
C42
AVDD
+
L2
R38
L3
C38
R39
C41
JP22
R37
JP13
C33
R33
R31
T1
R1
JP3
JP21
R4
R11
R32
JP15
JP17
P1
R2
RN1
V1
C15
+
JP20
R40
R35
C13
V2
TP5
+
JP6
+
C11
R6
C8
R7
R9
R8
V4
R14
R12
R10
C10
L5
C30
C19
C9
R24 JP4
C21
D1
Q_IN
R17
C12
R30
C32 V6
R18
R16
DGND
TP6
AGND
C6
RN2
JP5
C24 +
R34
C2
+
C25
JP14
R23
JP19
TP7
4
JP12JP11
C31
+
+ C46
C47
C7
TP1
C34
L4
C48
TP4
4
TP2
C37
C44
V8
C1 JP2 JP1 JP7
C3
J3
JP9
JP10 T2
TP3
C45
JP16
+ C43
R36
R13
J4
DVDD
BJ3
BJ4
C40
BJ1
BJ2
J5
AVDD
DBVDD
AGND
STROBE
C49 +
I_IN
V3
(NOT TO SCALE)
Figure 40. Evaluation Board Component-Side Silkscreen
(NOT TO SCALE)
Figure 41. Evaluation Board Power Plane Layout
–18–
REV. D
REV. D
R2
R-S 50V
CH1IN
1
–19–
Figure 42. Evaluation Board
J4
BNC
AVDD
C32
0.1mF
R35
R-S 1V
R24
R-S 22V
R10
R-S 10V
R40
R-S 100V
JUMPER
TP5
CON1
T2
TRANSFORMER CT
4
3
2
6
1
P S
JP12
JP11
C37
10_6V3
NOT TO SCALE
JP10
R34
R-S 50V
U6
AD822
+ 8
C21
CAP_NP
R17
15kV
AVDD
C11
10_6V3
C12
0.1kV
U3
R7
15kV
AD822
+ 8
C8
CAP_NP
C3
10_6V3
JUMPER
C34
0.1mF
C31
10_6V3
R16
5kV
HDR3 3
CHOIN 2
1
R30
1.5kV
R23
POT_10kV
ADJ_REF
R12
1.5kV
R9
POT_10kV
ADJ_REF
TP3
CON1
DIODE_ZENER
D1
R8
5.49kV
AVDD
MIDSCALE_I
JP2
2 INB-1
C36
10_6V3
DCINO
R_VREF
R51
10V
C15
CAP_P
R50
10V
AVDD
STROBE
C47
CAP_NP
R53
10V
C55
1000pF
TP6
CON1
3
HDR3
1 JP6
2
R52
10V
C25
CAP_P
C27
0.1mF
AVDD
C45
CAP_NP
18
17
16
15
C53
10pF
C52
10pF
28
27
26
C26
CAP_NP 25
24
23
22
21
20
C16
CAP_NP 19
C51
10pF
C50
10pF
R11
1kV
3 JP21
2
1
HDR3
C48
CAP_NP
U4
DUTCLK
DVSS
DVDD
AD9201
CHIP-SELECT
INA-Q
D0
D1
REFT-Q
INB-Q
D2
D3
D4
REFB-Q
AVDD
VREF
D5
D6
D7
D8
D9
SELECT
TESTCHIP
REFSENSE
AVSS
REFB-1
REFT-1
INB-1
INA-1
R13
1kV
3
4
5
6
7
8
9
C29
CAP_NP
D0
D1
D2
D3
D4
D5
D6
10 D7
D8
11 D4
12 D9
13
14
3 JP22
2
1
HDR3
DUTCLK
AVDD
DRVDD
DGND
DVDD
SLEEP
L4
DRVDD
FERRITE BEAD
DRVDD
C44
CAP_NP
L3
DVDD
FERRITE BEAD
DVDD
1 JP4
R14
2
R-S TBDV
3
C23
0.1mF
R18
R-S TBDV
C17
0.1mF
C14
0.1mF
C54
1000pF
HDR3
INA-Q
3 JP14
INB-Q
1
2
4 HDR4
C35
0.1mF
C24
10_10V
JP9
JUMPER
AVDD
C20
0.1kV
R_VREF
3
4
1 JP13
INA-1
C46
10_10V
DPWRIN
C43
10_10V
DPWRIN
C22
0.1kV
C5
10_6V3
JUMPER
JP5
JP7
JUMPER
VREF
C4
0.1V
CON1
TP2
R_VREF
BJ6
1
BANA
BJ5
1
BANA
BJ4
BANA 1
BJ3
BANA 1
DCIN1
AGND
AVDD
C19
10_10V
R1
JUMPER TP1 JUMPER
R-S TBDV
C1 0.1mF
CON1
R4
R-S 100V
JP2
P S
1
C42
CAP_NP GND
3
C41
CAP_NP
AVDD
L2
FERRITE BEAD
AVDD VCC
T1
TRANSFORMER
CT
4
3
2
6
1
R6
5kV
HDR3
JP3
2
R37
R-S 49.9V
STROBE
C40
10_10V
J3 MIDSCALE_IN
J1
BNC
BJ2
1
BANA
J5
BNC
BJ1 1
BANA
APWRIN
14
D4
J6
BNC
R38
R-S
50V
ADC_CLK
R32
POT_2kV
C30
CAP_NP
13
22
23
R33
500V
C33
0.1mF
R31
500V
C49
10_10V
T/R
11
2
1
HDR3
U8A
2
3
U8B
DRVDD
C10
0.1mF
4
U8C
6
74AHC14DW
5
C38
0.1mF
AVDD
R39
R-S 50V
TP7
CON1
74AHC14DW 74AHC14DW
1
HDR3
1 JP20
3
2
BD3
BD4
BD2
9
10
BD1
8
BD0
BCLK0
HDR3
1 JP17
2
3
7
6
3
4
5
GND3 12
GND2
1 JP15
2
3
C13
0.1mF
A
A
A
A
VCCA
74LVXC4245
GND1
OE
NC1
VCCB
D4
D3
D2
D1
A
A
B
D0
A
A
HDR3
1 JP19
2
3
DRVDD
C6
0.1mF
DRVDD
BD9
BD8
7
BD7
6
BD6
BD5
5
4
3
GND2 11
GND3 12
B
B
U2
DVDD
DRVDD
AVDD
C9
0.1mF
16
D3
24
17
D2
20
21
20
19
C7
0.1mF
A
A
A
A
9
8
A 10
1
VCCA
T/R 2
74LVXC4245
13 GND1
18
L5
FERRITE_BEAD
DVDD
D[0...9]
DUTDATA
[0...9]
B
VCCB
23 NC1
22 OE
24
14
D1
D0
DRVDD
C2
0.1mF
CLK0
DVDD
D9
18 B
17 B
D8
B
B
A
B
19
20
D6
A
A
B
B
U1
D7
21
D5
15
16
U8F
12
U8E
10
U8D
8
P1
DUTCLK
TP4
CON1
1 JP16
R36 CLK0
2
3
R-S TBDV
HDR3
74AHC14DW
9
74AHC14DW
11
74AHC14DW
13
14
1
RN1B
13
2
RN1C
13 31
30
11 4
2
29
9 28
12
3
3
RN1D
7 6
4
11
26
RN1E
24
5
22
5 CLK
10
8
RN1F OUT
1 10
9
6
12
RN2A
33 20
25
1
14
18
RN2B
23 27
2
13
16
RN2C
21 32
14
3
12
34
RN2D
19 33
4
11
40
RN2E
17 39
5
36
10
38
RN2F
15 37
6
9
CON40
RN1A
RESISTOR
7PACK
AD9201
AD9201
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
28-Lead Shrink Small Outline Package (SSOP)
(RS-28)
15
1
14
0.311 (7.9)
0.301 (7.64)
0.212 (5.38)
0.205 (5.21)
28
C3116d–0–8/99
0.407 (10.34)
0.397 (10.08)
0.07 (1.79)
0.066 (1.67)
0.008 (0.203) 0.0256
(0.65)
0.002 (0.050) BSC
0.015 (0.38)
0.010 (0.25)
SEATING 0.009 (0.229)
PLANE
0.005 (0.127)
8°
0°
0.03 (0.762)
0.022 (0.558)
PRINTED IN U.S.A.
0.078 (1.98) PIN 1
0.068 (1.73)
–20–
REV. D