Ideal Diode I-V characteristic ECE 663 Real Diode I-V characteristic ECE 663 Real Diode – Forward Bias (semi-log scale) ECE 663 Real Diode – Reverse Bias ECE 663 What’s wrong with this picture? • Forward Bias – – – – For V < 0.35 volts slope is kT/2q For 0.35V < V < 0.7volts, slope is kT/q For V > 0.7 volts, slope less than kT/q (V~Vbi) I0 ~10-14A from intercept of semi-log plot in FB ECE 663 What’s wrong with this picture? • Reverse Bias – Current ~103 times larger than FB I0 – Reverse current doesn’t saturate – Breakdown – large current above Vbd • Avalanche breakdown • Zener (tunneling) process ECE 663 Reverse Bias Avalanche Breakdown Depletion width larger than mean free path lots of collisions ECE 663 Avalanching • Minority carriers accelerated by electric field in depletion region • The average energy lost per collision goes up as E field (voltage) goes up (v = E ) • At some critical field (Ec), the average energy lost per collision will be enough to “ionize” lattice atoms – knock out more carriers • Those carriers will also be accelerated by E>Ec and make more carriers when they collide, etc……. • Many collisions=huge multiplication in number of carriers= avalanche breakdown ECE 663 Max. Field NAxp = NDxn = WD/(NA-1 + ND-1) Kse0Em = -qNAxp = -qNDxn = -qWD/(NA-1 + ND-1) Vbi = ½|Em|WD Doping Charge Density Electric Field Electrostatic Potential ECE 663 Maximum Field Em = 2qVbi/kse0(NA-1+ND-1) ECE 663 Avalanching Vbi VA Vbi VBR VBR Ec 2 N A ND 2q VBR K S e 0 N A ND N A ND VBR N A ND VBR 1 NB One-sided junctions ECE 663 Experimental Data on VBR VBR 1 NB 0.75 ECE 663 Zener Breakdown - Tunneling Barrier must be thin: depletion is narrow doping on both sides must be large 2K S e 0 N A ND Vbi Vappl W ND N A q Must have empty states to tunnel into Vbi + VBR > EG/q ECE 663 1 2 Zener diode I-V characteristic ECE 663 Reverse bias R-G in the depletion region n qA dx x t thermal R G xn IR G p ECE 663 R-G Current • In depletion region we don’t have low level injection because number of carriers is small and injected carriers is large np ni2 n t thermal p (n n1 ) p ( p p1 ) R G np ni2 qA dx x p (n n1 ) p ( p p1 ) xn IR G p But, in depletion n,p 0 ECE 663 2 x ni qAni 1 qA dx qAWni W p1 n1 2 0 x p n1 n p1 n pn n i i n IR G p p1 1 1 n1 0 p n p n 2 ni ni 2 But 2K e N ND Vbi Vappl W S 0 A ND N A q IR G Vreverse_ bias 1/ 2 0 1 2 Reverse bias current=lifetime measurement ECE 663 Forward Bias R-G ECE 663 Forward Bias R-G current np ni2 qA dx x p (n n1 ) p ( p p1 ) xn IR G p n and p cannot be neglected in the depletion region in FB so the integral is not so easy as in RB. pn nn pn 0 nn 0e qV / kT ni2e qV / kT n1 p1 ni n p 0 ni2 e qV / kT 1 qA dx x 0 (nn pn 2ni ) xn IR G p Estimate value of integral using maximum value of integrand = constant ECE 663 Forward Bias R-G current ni2 e qV / kT 1 qA dx x 0 (nn pn 2ni ) xn IR G p Integrand maximum when n + p is minimum or n = p nn pn ni2e qV / kT nn pn nn pn ni e qV / 2kT x ni2 e qV / kT 1 qA dx qV / 2 kT qV / 2 kT 0 (ni e ni e 2ni ) x n IR G IR G ni e qV / kT 1 W qA 2 0 (e qV / 2kT 1) IR G qAniW qV / 2kT e 2 0 p ECE 663 Ideality factor I I0e qV / kT ECE 663 Forward Bias with High Currents: High Level injection np = ni2eqV/kT n ~ p ≈ nieqV/2kT Use in boundary condition Forward Bias with High Currents: Series Resistance I = I0[eqV/kT-1] I = I0[eq(V-IRs)/kT-1] ECE 663 Real Diode I-V curve summary A. B. C. D. E. Breakdown (VB~1/NB) R-G RB (I~V) R-G FB (slope~q/2kT) High Level Inj.(slope ~ q/2kT) Series Resistance – slope over ECE 663 Narrow Base P-N junction Diode P-side N-side np pn Lp Ln xp xn What happens if the diode is smaller than the minority carrier diffusion length(s)? Diffusion lengths can be 20-30 microns ECE 663 dpn qDp pn 0 qV / kT e 1 J p qDp dx Wn Similarly for Jn qDn n p 0 qV / kT e 1 Jn Wp ECE 663 Total diode current Jtotal qDn np 0 qDp pn 0 qV / kT e Jn J p 1 Wn Wp Compare to result from wide base ideal diode: qDn n p 0 qDp pn 0 qV / kT e J 1 Lp Ln Replace minority carrier diffusion length with diode width Ln Wp Lp Wn ECE 663 Charge control methodology • Analyze by examining injected minority carrier charge: • e.g. electrons injected into p side of FB diode np x x / L qV / kT n p n p n p 0 n p 0 e 1e p n Ln Dn n x • Total negative charge on p-side: xp xp Qtotal negative n p ( x )dx q A ECE 663 Charge control method • Approximate total charge by diffusion length times charge at boundary of QN-depletion regions: Qtotalnegative Ln np0 e qV / kT 1 q A • Non-equilibrium injected electrons with average lifetime of n • Recombination Rate=charge/time=current Ln n p 0 qV / kT In Q / n qA 1 J n A e n Ln n p 0 qV / kT Jn q 1 e n ECE 663 Charge control but Dn n Ln Dn Dn Dn n n n Dn n Ln Dn np 0 qV / kT Jn q 1 e Ln Similarly for holes on the n-side: Dp pn 0 qV / kT e J p q 1 Lp ECE 663 Total current: Dn np 0 Dp pn 0 qV / kT e J Jn J p q 1 Lp Ln • Same result as before but we didn’t have to solve the minority carrier diffusion equations • Stored charge and recombination = current needed to resupply ECE 663