Experience in machining precision
accelerator components
Looking back and ahead
VDL Enabling Technologies Group
Company Confidential
Company Confidential
Contents
 Company introduction
 Looking back and ahead
 Cost study
 Ambitions for CLIC
 Summary
2
Company Confidential
VDL Groep




Sub contracting
 mechatronic systems
module assembly
 part and sheet metal
 Surface treatments
 plastic processing
 other specialties

Bus group
Finished products
touring cars
 public transport bus
 mini and midi busses
 Chassis modules
 second hand trade

Established in 19 countries
85 operating companies
> 10,000 employees, privately owned
Turnover 1.8 billion (2013)
medical equipment
 process installations
 consumer products
 production automation
 various products
 packaging equipment
Car assembly

Company Confidential

NedCar
VDL ETG: our company DNA
COMPETENCES
Vacuum
Handling
Positioning
R&D support
Prototyping
Complex mechanical parts
Modules
Volume production
Supply Chain Management support
Fully integrated systems
Value Engineering
PRODUCTS
Sustaining & After sales support
QLTC Management
PROCESSES
4
Company Confidential
VDL ETG Core Technology Markets
Semiconductor Capital
Equipment
Turn Key Projects
Analytical Equipment
Led Manufacturing
Equipment
Medical Equipment
Solar Production
Equipment
Science & Technology
 Is a technology driver for our main stream business
 Benefits from our expertise in manufacturing and assembly for series manufacturing
 Focus of employing core technologies to :
Free Electron lasers and CLIC
Optical modules for instruments.
Company Confidential
VDL ETG Added Values for S&T
 Time to market
• Co-development & rapid proto typing
• Increased complexity requires higher level outsourcing
CLIC (future): from cell over bonding to (ultimately) complete module
EUV light source : from idea to product in 1 year
 Industrialization
• Early customer involvement - cost control & risk reduction
• Co / Redesign for manufacturability
Second Harmonic Output Cavity
Redesign for manufacturability, assembly and tuning with a cost
optimization by reduction of the nr of parts from 21 to 12 and the nr of
brazing steps from 3 to 2
Company Confidential
Mirror base module for ELT : weight reduction of 100 kg
per module (1000 modules needed)
Examples of best practices
 X-band structures for CLIC
 PETS
 HP loads
 ….
 BOC Pulse compressor
 J-Couplers for SwissFEL
 SwissFEL structures
 RF Gun
 CCL Accelerating Structures
 Matisse mirrors for the VLT
 RF Hybrid Blocks (163–211GHz) for ALMA Telescopes
 Breadboard with optics for TMA nano satellite
 Mount for the Sentinel 5 Spectrometer
Company Confidential
Plans for the future - Strengthening our capabilities
 Parts manufacturing
 Industrializing machining process
 Integrating quality control
 Assembly & test
 Strengthening our capabilities on
• E-beam welding
• Etching
• Out baking
 Building up experience on
• H2 bonding
• RF testing
Capability reinforcement needs to be done with (international) partners in
academia and industry.
Company Confidential
Plans for the future - Targeting new markets for X-band
 Using X-band normal conducting accelerators opens new perspective on
market drivers
 Increased field strengths / gradients
 Ability to scale down
 Cost of ownership
• Reliability (using C&S-band frequencies and parts with X-band specifications)
• Life Time (using C&S band frequencies and parts with X-band specifications)
• Infrastructure (less energy & no cryogenic infrastructure required)
 Plan to address the potential markets
 Intensifying the relationship with our technology partners and capitalizing our
common knowledge and (future) experiences in X-band
 Identifying accelerator applications
 Building up expertise teams on commercial applications for X-band
Company Confidential
Applications divided into particle type
Accelerators
Proton
Electron
Low energy application
(large market)
Material treatment
(existing / growing market)
Tumor treatment
)
Tumor treatment
(small but growing market)
(proof-of-concept)
Materials Research
Material treatment
(small market)
(growing market)
Materials and
biological research
Proton beam
lithography
Fundamental research
(growing market)
(ideas)
Light source
lithography
Fundamental research
(ideas)
(niche market)
Generating radiation
Free Electron Laser
Collision with target to
generate X-Ray
wide range of wavelengths
(existing and large market)
(growing market)
E-beam Welding
X-ray imaging
(growing market)
(large market)
Other elements
SEM/ TEM
Tumor treatment
(existing market)
(large market)
Fundamental research
Sterilization
Defense (USA)
(niche market)
(existing / growing market)
(ideas)
(niche market)
Potential for compact
accelerator
Security
Fundamental research
(proof of concept)
(niche market)
Company Confidential
Applications : Proton therapy
 First commercial linear accelerator application for VDL ETG
 LIGHT (Linac for Image Guided Hadron Therapy) developed by ADAM
 VDL ETG is partner to manufacture., build and test the CCL Accelerating modules
 First module delivered for high power test (Low power RF and bead pull test done @ VDL)
 VDL ETG was responsible for
 Manufacturing redesign
 Parts manufacturing
 Assembly and brazing
Company Confidential
Applications : ART*LIGHT
Synchrotron research for
art and archaeology
Varnishes on musical
instruments
Bones
Painting alterations
Courtesy of the Mary Rose Trust.
Conservation wreck
of warship
Glasses decoration
Company Confidential
Applications : ART*LIGHT
Synchrotrons...
 High brilliance
BUT:  Accessibility
 High energy x-rays
 Beam time
 Coherent
 Available space
 Variable energy
 Beam intensity
 Elemental, molecular & structural
characterization
 Imaging with micron resolution
 The most powerful non-destructive
diagnostic tool
Company Confidential
Applications : ART*LIGHT A Dutch Tabletop Synchrotron for Conservation Research
Compton Back Scattering source
A compact synchrotron-like light source inside the museum!
4m
ART*LIGHT will change the way we look at art
Company Confidential
Looking back
 Long standing supplier of CLIC prototype parts (since 1989)
circa 1994
2008
 Evolution of requirements
• 30 mm disks
• circular iris
• no waveguides
1990’s
• 80 mm disks
• elliptical iris
• closed waveguides
2000’s
Company Confidential
• Higher demands on surface
finish and flatness due to shift
from brazing to bonding
• Open waveguides
2010’s
Looking back
VDL ETG is involved in CLIC for
 Technology push for machining capabilities
 Business potential in CLIC and related applications
CLIAPSI
Company Confidential
SwissFEL
Looking back – and ahead
VDL ETG is involved in CLIC for
 Technology push for machining capabilities
 Business potential in CLIC and related applications
Company Confidential
SwissFEL
and AVO
Cost study
Based on the experienced gained in the small series production a
study was carried out focused on:
 Engineering design: cost driving areas and proposals for a significant saving;
 Tolerances, Ra, flatness: identification of the areas where a relaxation of the requirements
would lead to a cost saving;
 Technologies: final machining is the costly operation; which specification could allow switching
from Ultra Precision to High Precision machining.
Pre
machining
• Sawing
• Turning
• Pre-milling
• Drilling tuning holes
• Measurement
• Annealing
End
machining
• Fly cutting
• End milling
• Turning side waveguides
• Turning opposite side
• Metrology
• Cleaning & inspection
18
Standard manufacturing flow
Company Confidential
Cost study – breakdown per manufacturing step
Item
Tooling
6.9%
Stage
Operation
Turning tool - Turning PT
Mill - Milling PT
Diamond mill - Milling UPT
Diamond tool - Turning UPT
Manufacturing step
Work preparation PT / HPT
Programming PT / HPT
Sawing
Pre machining Turning PT
12.7%
Drilling
Milling PT
Annealing
Metrology PT - HPT
Work preparation UPT
Programming UPT
Flycutting
End machining Milling UPT
79.7%
Turning UPT
Cleaning
Metrology UPT
Cost
0.6%
0.5%
3.4%
2.4%
Cost
1.2%
1.4%
0.6%
2.7%
1.9%
2.8%
0.5%
1.5%
1.2%
2.2%
3.5%
35.4%
27.3%
1.1%
9.0%
19
Company Confidential
Cost study – Cost down 2011  2013
 Cost level down from 100% to 86% (2011 to 2013)
Actions taken for :
 Use of adapted tooling in pre-machining
 Pallet machining & 2 different zones for diamond milling
 Reduction of end metrology by on machine measurements
 Highest cost remain in end machining
 Diamond milling
 Diamond turning
 End metrology
(35% of 2013 cost level)
(27% of 2013 cost level)
(9% of 2013 cost level)
20
Company Confidential
Cost study – Cost reductions
 Current cost drivers are identified – some changes are already implemented
 2 zones (profile accuracy of 4 μm in zone A and 20 μm in zone B)
 Reduction of the nr end measurements
 Possible cost reductions
 Increase of series size as large(r) series will significantly reduce manufacturing costs
 Remaining at UPT-machining
• Design change from corner radii (rr) from 0.5 mm to 2.5 mm
• Relaxation of surface finish on
o side walls of wave guide
o bonding face(s)
o Iris
• Dedicated UPT machines
 Switch to HPT-machining
21
Company Confidential
Cost study – Cost reductions  dedicated UPT-machine
Parts to be machined based upon CLEX-structure
Investigation was started with LT Ultra following 2 different approaches :
 Single disk UPT machine




All machining operations done in one setup
Small strokes  high accelerations  short manufacturing times
1 disk per manufacturing step  frequent handling (operator or robot)
Automation possible ?
 Multiple disk UPT machine





All machining operations on multiple discs in one setup
Larger moving masses  lower accelerations  longer machining times
Multiple disks per machining step  less handling
Complex machine (multiple C-axes)
Can be based up on current milling machine (already capable of disc
machining / part metrology and pallet machining implemented)
Company Confidential
22
Cost study – Cost reductions  Switch to HPT-machining
Main differences between UPT and HPT machining are:
 Higher feed rates at HPT machining  RPM of milling spindles is currently the limiting factor
 Higher power and torque of axes allow higher material removal rates  can introduce stresses and
sub surface damages (max 10 % of cutting depth)
 Better lubrication using spray lubrication in stead of mist  risk for contamination of parts
 HPT machining is an industrial technology with a higher level of automation  can be developed /
further optimized for UPT machining
 Machine prices are comparable, perhaps even higher for HPT machines
CLIC
Matrix build based upon profile accuracy of RFzones (iris and waveguides) and surface finish.
 significant tolerance relaxations needed
 Without significant relaxations on both
tolerances and RF-specifications HPTmachining will have no advantages to
UPT-machining
Company Confidential
23
Ambitions : from CLIC Disc to 2 Beam Module for CLIC
CLIC-disc
• O₂-free Copper
• Ultra Precision
Accelerator Structure
• H₂ - bonding
• Ultra Clean
RF-unit
• E-beam welding
• Testing
2Beam Module
• Tenderable TPD
• Final Assy & Test
CLIC
24
Company Confidential
Summary
 As VLD ETG we gained a lot of experience over the last decades
 Are at a standstill with a risk of expertise loss
 Gaps are (partially) filled with CLIC-related projects
 Cost reductions are realistic (and identified) but require :
 Higher volumes and the related dedicated equipment
 A specification relaxation (if possible)
 We are ready for volume production and higher level assembly
CERN : We want you to challenge us.
25
Company Confidential
Enabling your success in business...
Company
Confidential
Company Confidential