Taiwan Standards Committee
Liaison Report
SEMI Taiwan
April 2014
Venue, Location, Date
SEMI Taiwan Standards Committee
SEMI Taiwan
I&C Committee
Established in
2003
Mission:
Focus on interface
of manufacturing
tools, factory
automation
computers, purpose
of transferring
commands and data
used during the
manufacturing
process.
Venue, Location, Date
EHS Committee
FPD Committee
PV Committee
3DS-IC3DS-IC
Committee
Established in
2005
Established in
2008
Established in
2009
Established in
2011
Mission:
Focus on
Environmental,
Health, and
Safety standards
fulfilling the
technical needs.
New TF to LED
and PV, 2011
April
Mission:
Focus on
standards for
materials and
equipment used
in the
manufacture
and test
methods of
TFT-LCD
Mission:
Focus on
standards for
Cell Appearance
and vibration
Test Method in
the manufacture
and test
methods of PV
industry
Mission:
Focus on
standards for
Testing and
Middle-end
process in the
manufacture and
test methods of
3DS-IC industry
FPD Metrology TC
Venue, Location, Date
Contents
•
•
•
•
•
•
•
Leadership
Current Committee Structure
Meeting Information
New SNARFs & TFOFs
Ballot Results
Upcoming Ballots
Task Force Update
Venue, Location, Date
Leadership of TC
Co-Chair: Tzeng-Yow Lin-CMS/ITRI
Co-Chair: Jia-Ming Liu-TDMDA
Leadership Change of TF
Leader: Fang Hui-Mei (Stepped Down)
Leader: Jed Tai (E INK) New
Venue, Location, Date
<Month> <Year>
<Region> <Committee>
5
FPD Committee Structure and Organization Chart
Liaison
L: YP Lan/ITRI
L:DA Chang/Kingbird
L:RJ Chuang/TDMDA
L:Tony Chiu/CIPO
TWN FPD TC
C: Tzeng-Yow Lin-CMS/ITRI
C: Jia-Ming Liu-TDMDA
LCD Sub-Committee
L:Kerson Wang-i-boson
ACG TF (DISBANDED)
Touch Screen Panel TF
L: Garfield Pan-AUO
L: Y.W. Fang-AUO
L:S.P. Wang-DTC/ITRI
L:S.Y. Chuo-CMS/ITRI
Flexible Display TF
<New>
e-Paper Displays TF
L: Fang Hui-Mei (Prime
View, New leader)
L: Bor-Jiunn Wen-CMS/ITRI
L:WangWen-Tung-ITRI
3D Displays Metrology TF
(DISBANDED)
L: Wen-Chuan Tsai-AUO
L: Bao-Jen Pong-CMS/ITRI
<Month>
<Year>
Venue,
Location,
Date
<Region> <Committee>
L: Kuen Lee-EOL/ITRI
6
Committee Highlights : FPD Organization Chart (New)
Liaison
L: YP Lan/ITRI
L:DA Chang/Kingbird
L:RJ Chuang/TDMDA
L:Tony Chiu/CIPO
TWN FPD TC
C: Tzeng-Yow Lin-CMS/ITRI
C: Jia-Ming Liu-TDMDA
LCD Sub-Committee
L:Kerson Wang-i-boson
Touch Screen Panel TF
e-Paper Displays TF
Flexible Display TF
L: Y.W. Fang-AUO
L: Fang Hui-Mei (Stepped
Down)
L:Wang Wen-Tung-ITRI
L:S.Y. Chuo-CMS/ITRI
L: Jed Tai (E INK) New
L: Bor-Jiunn Wen-CMS/ITRI
<Month>
<Year>
Venue,
Location,
Date
<Region> <Committee>
7
FPD-Metrology Committee Meeting
Information
Committee
Last Meeting
Location
Next Meeting
Location
FPD Committee
Apr. 22, 2014
ITRI
July 22, 2014
ITRI
Venue, Location, Date
<Month> <Year>
<Region> <Committee>
8
New SNARFs and TFOFs
None
Venue, Location, Date
<Month> <Year>
<Region> <Committee>
9
Ballot Results
Document
Document Title
#
5293B Test Method for Positional Accuracy of Touchscreen Panel
5533A
Test Methods for Color Properties of Electronic Paper
Displays
Venue, Location, Date
<Month> <Year>
<Region> <Committee>
Committee
Action
Failed,
re-work
Passed
10
Upcoming Ballots
NA
Venue, Location, Date
<Month> <Year>
<Region> <Committee>
11
FPD Metrology- TF Update
• e-Paper TF : focus on reflectance measurements for
Electronic Paper Displays: Terminology & Measuring
methods, including Incident illumination and measurement
geometry. The draft #5533A Passed for A&R.
• Touch Screed TF: Re-work the draft #5293C for next
Cycle, 2014
• Flexible TF: Working on the SNARF for: New Standard:
Test Methods for Flexibility Properties of Flexible Displays,
but team members still have different opinions on this
SNARF. So, will re-work.
• ACG TF: Disbanded on Jan. 21, 2014
• 3D Display Metrology TF: Disbanded on Jan. 21, 2014
<Month>
<Year>
Venue,
Location,
Date
<Region> <Committee>
12
PV TC
Contents
•
•
•
•
•
•
•
Leadership
Current Committee Structure
Meeting Information
New SNARFs & TFOFs
Ballot Results
Upcoming Ballots
Task Force Update
Leadership
PV Committee
Co-chair: B.N.Chuang-CMS/ITRI
Co-chair: J.S. Chen-TeraSolar
Co-chair: Ray Sung-UL TWN
Leadership Change of TF
TF: PV Wafer Measurement Method
Leader: Dr. Samuine Chen (ITRI/CMS ,New
leader)
<Month> <Year>
<Region> <Committee>
15
PV Committee Structure and Organization
PV Committee
Chart
C:B.N.Chuang-CMS/ITRI
C:J.S. Chen-TeraSolar
C:Ray Sung-UL TWN
PV Package Performance TF
L: C.C.Lin-PV Guider
Organic PV and Dye Sensitized
Solar Cell TF (OPV & DSSC)
L: Bor –Tsuen Wang/National
Pingtung Unviersity
L: Der-Ray Huang/NDHU
L: T.C. Wu – CMS/ITRI
L: T.C. Wu-CMS/ITRI
L: Ivan Chou/Delsolar
L: K.T.Lee-King Design
Building Integrated Photovoltaic
(BIPV) Task Force TF
L: C.C.Lin-PV Guider
PV Wafer Measurement Method TF
L: Der-Ray Huang/NDHU
L: Dr. Samuine Chen/ITRI-CMS
L: T.C. Wu-CMS/ITRI
L: Ivan Chou/Delsolar
L: K.T.Lee/King Design
L: Kuang Han Ke/Gran System
Venue, Location, Date
PV Committee Meeting Information
Committee
Last Meeting
Location
Next Meeting
Location
PV Committee
April 25
ITRI
July 25
ITRI
Venue, Location, Date
New SNARFs & TFOFs
• New PV Reliability Test Method Task Force
Venue, Location, Date
Ballot Results
• None
Venue, Location, Date
Upcoming Ballot
• None
Venue, Location, Date
PV –TF Update
• Package TF: SEMI Draft #5431:New Standards : Test
Method for Performance Criteria of Photovoltaic (PV) Wafer,
Cell, and Module Package in process. Doc 5431 draft may
apply for approval to vote in 2014Q4 in order to simulate and
consider the handling, process and transportation for pallet
cartons of packaged cells indoors and outdoors, this draft will
refer the guidelines of ISTA and SEMI Standards firstly, based
on the specific scenario. Revised PV 38-0912 to add criteria.
• BIPV TF: SEMI Draft # 5560 : New Standard : Classification
of Building Integrated Photovoltaic (BIPV) in progress.
Currently working on the category and terminology.
• Wafer Measurement Method TF: SNARF for wafer crack
detection method or carrier lifetime measurement method.
Venue, Location, Date
PV –TF Update
• DSSC&OPV TF: Documents in work are Doc# 5597Voltage (I-V) Performance Measurement of Dye Sensitized
Solar Cell (DSSC), Doc 5599-Spectrum Response (SR)
Measurement of Dye, ensitized Solar Cell (DSSC), Doc 5598Durability Test Method of Dye Sensitized Solar Cell (DSSC)
No
Title Update (Old)
New Title
Status
#5597
(old) Current-Voltage (I-V) Performance
Measurement of and Dye-Sensitized Solar
Cell (DSSC))
(new) Current-Voltage (I-V) Performance
Measurement of Organic Photovoltaic (OPV)
and Dye-Sensitized Solar Cell (DSSC))
Passed
# 5599
(old) Spectrum Response (SR) Measurement
of Dye Sensitized Solar Cell (DSSC)
(new) Spectrum Response (SR)
Measurement of Organic Photovoltaic (OPV)
and Dye Sensitized Solar Cell (DSSC)
Passed
Venue, Location, Date
3DS IC TC
Venue, Location, Date
Leadership
• Committee Co-chairs
– TK Ku (ITRI)
– Wendy Chen (KYEC)
– YS Lai (ASE)
NAVenue,
3DS-ICLocation,
Committee
Report - August 2011
Date
Contents
•
•
•
•
•
•
•
Leadership
Current Committee Structure
Meeting Information
New SNARFs & TFOFs
Ballot Results
Upcoming Ballots
Task Force Update
Venue, Location, Date
Organization Chart
Taiwan 3DS-IC Committee
Chairs:
• TK KU(ITRI)
• Wendy Chen(KYEC)
• YS Lai(ASE)
Middle-end Process Task
Force
Leaders:
Leaders:
TT Miau (ITRI)
Jerry Yang (SEMATECH)
Roger Huang (ASE)
CC Chen (CMPUG TW)
Ming-Chin Tsai (KYEC)
Erh Ho Chen (ITRI)
NAVenue,
3DS-ICLocation,
Committee
Report - August 2011
Date
Testing Task Force
Committee Meeting Information
Committee
Last Meeting
Location
Next Meeting
Location
3DS IC Committee
Nov. 22, 2013
SEMI
TBC, 2014
SEMI
<Month> <Year>
<Region> <Committee>
27
SNARFs (Standards New Activity Report Form)
Middle end Process TF
NA
Testing TF
Doc. 5485
New Standard: Guide for Incoming/Outgoing Quality Control
and Testing Flow for 3DS-IC Products
SEMI
3DS-IC
Standards
Venue,
Location,
Date Activities - August
2012
3DS IC Testing TF Update
– [5485] New Standards: Guide for Incoming/Outgoing Quality Control
and Testing Flow for 3DS-IC Products
• Summary:
– 1.
Removed one extra AOI typed in 5.1.9
– 2.
Removed 6.2.3 X-ray inspection. à for cost consideration
– 3.
Revised 8.4 SCoS testing flow à added options for CoC and
CoW into the flow.
NAVenue,
3DS-ICLocation,
Committee
Report - August 2011
Date
Published Standards [1/2]
• SEMI 3D6-0913, New Standard: Guide for CMP and
Micro-bump Processes for Frontside Through Silicon Via
(TSV) Integration
– This Guide provides:
• A generic middle-end process flow to define acceptable TSV and
CMP quality criteria as well as to develop methodology and
measuring procedures for micro-bump.
• A criteria and common baselines of the middle-end process for
related upstream and downstream manufacturers in fabricating
3DS-IC products.
SEMI
3DS-IC
Standards
Venue,
Location,
Date Activities
Published Standards [2/2]
• SEMI 3D7-0913, New Standard: Guide for Alignment
Mark for 3DS-IC Process
– Photo alignment mark configuration is the key to ensure
consistent and precise alignment of layers, chips and
wafers.
– This Guide provides:
• the alignment mark strategy for chip to chip, chip to wafer, and
wafer to wafer stacking.
• addresses the universal alignment mark where the outcome will be
a feasible photo alignment standard.
Originated by Taiwan 3DS-IC
Middle End Process TF
SEMI
3DS-IC
Standards
Venue,
Location,
Date Activities
EHS TC
<Month> <Year>
<Region> <Committee>
32
Contents
•
•
•
•
•
•
•
Leadership
Current Committee Structure
Meeting Information
New SNARFs & TFOFs
Ballot Results
Upcoming Ballots
Task Force Update
Leadership of TC
Co-Chair: Shuh-Woei Yu-SAHTECH
Co-Chair: Fang-Ming Hsu-TSMC
<Month> <Year>
<Region> <Committee>
34
EHS Committee Structure and Organization
Chart
TWN EHS TC
FPD Safety Sub-Committee
C: Shuh-Woei Yu-SAHTECH
C: Fang-Ming Hsu-TSMC
L:C.C. Huang -SAHTECH
IC Equipment Safety TF
L: Collin Shen-Mxic
Equipment Safety TF
L: C.C. Huang-SAHTECH
Gas & Chemical Safety TF
L: Benny Chen-AUO
L: Benny Chen-AUO
L:Juo Cho-AUO
L: Heng Li Sue-SAHTECH
L: Alice Lin-CMO
L: Moony Lee-UMC
Seismic TF
L:K.C. Tsai -NCREE
L: J.S. Hwang-NCREE
Environmental Sustainability
TF
L: Tony. C.H. Lu-ITRI
L: C.Y Hung-TSMC
L: D.W. Sun-TSMC
Accreditation Committee
PV Safety TF
LE Safety TF
L: Eddie Wu -Nexpw
L: Eric Lin-Epistar
Under Process
EHS Committee Meeting Information
Committee
EHS Committee:
NA 3DS-IC Committee Report -
Last Meeting
Location
April 1, 2014
SEMI
Next Meeting
Location
September, 2014 (TBD)
SEMI
New SNARF & TFOFs
• None
<Month> <Year>
<Region> <Committee>
37
Ballot Result
• None
<Month> <Year>
<Region> <Committee>
38
Upcoming Ballot
• None
<Month> <Year>
<Region> <Committee>
39
TF Update
•
Overall TF Update by Dr. C. C. Huang/SAHTECH. Dr. Huang updated the current
industry issues in Taiwan such as Occupational Safety and Health Act’s impact on
high-tech equipment safety：
 Equipment and Mechanical appliances impact
 Explosion-proof electrical impact
•
Fire Act impact on high-tech plant
Fire protection system in MO chemical room should be followed (or should follow)
by water reaction and flammable liquid requirements. It is still difficulty on
Cleanroom fire protection.
• SEMI Japan Energy-Saving Cooperation
 Propose technical manual to explain assumption and derivation of
S23 convection factors
 Proposed tank N2 conversion factor
 Agree on Japan’s suggestion to have the common view on the ECF
ranking of N2 and CDA. It affects the equipment energy saving design.
The Committee is going to work on this issue first. Will continue
collecting related information of technical manual.
<Month> <Year>
<Region> <Committee>
40
TF Update
•
SEMI High-Tech Facility Committee Fire Protection task force is proposing the
following issues.
 Cleanroom exhaust system - multi-zone desmoke effectiveness validation
 Cleanroom exhaust system - Subfab desmoke control effectiveness validation
 Sprinkler system-subfab action verified
 Local water mist protection verified
 Very early smoke detection system location under wafer slab evaluation verified
 Establish visualization safety expert system for HPM location
<Month> <Year>
<Region> <Committee>
41
TF Update
•
Action Item:
 Dr. C. C. Huang/SAHTECH to work with Dr. Tsai/NCREE for Seismic Topics and
feedback to SEMI NA and SEMI Japan.
 Co-chairs recommended to form a working group to study the impact of
Occupational Safety and Health Act on high-tech equipment safety. Assigned
Dr. C. C. Huang as working group leader, invited Dr. Po-Wen Wu/UMC, Eric
Lin/Epistar, Jean Yang/Innlux, Yee-Long Yi/AMAT, Representative/Siemens as
team members to work on the said Act. Warmly invite Siemens to join this group
to share EU regulations on risk management of process equipment.
<Month> <Year>
<Region> <Committee>
42
SEMICON Taiwan 2014 Sustainable Manufacturing
Forum
September 03, 2014
SEMICON Taiwan 2014 Sustainable
Manufacturing Forum
Date
Sept. 3, 2014
Time
09:30 – 16:30
Place
TWTC Nangang Exhibition Hall, Taipei, Room 402
Theme
Sustainability of Advanced Technology
Dr. S. W.Yu, Chairman, SAHTECH
General Chairs Mr. F. M. Hsu, Director, Corporate ESH Division,TSMC
Sponsors
TBD
Attendees
Target 150 attendees. (from IC/ FPD/ PV/ LED industry users
and equipment and materials suppliers)
Total 8 topics
Topics interested by User:
Integrated Chemical ESH Management Procurement, process, recycle, waste
abatement and disposal…
Segment
EHS
Resource Conservation – Energy, Water and
Chemicals
E
NH4-N Wastewater Treatment Effectiveness
and System Safety
E
Advanced Exhaust Air Abatement Systems
E
Sustainable Compliance: USA, Europe,
Asia,…
E
Effective Tool Salvage after Major Fire
S
EPI Process H2 Gas Reclamation –
Mechanism and Best Practice
E
Health Promotion Best Practices
H
Topic or Speaker/Company Candidates
2014 Sustainable Manufacturing Forum Agenda
Time: Morning
Description
Time : Afternoon
Description
09:15 -09:30
Registration
13:30 -14:00
Speech
09:30 -09:40
Remarks
14:00 -14:30
Speech
09:40 -10:40
Keynote
14:30 -15:00
Speech
10:40 -11:10
Speech
15:00-15:30
Speech
11:10-11:40
Speech
11:40 -12:10
Speech
15:30-16:30
Panel Discussion
12:10 -13:30
Lunch Break
16:30
Adjourn
Regional Staff
Contact Information
Name
Cher Wu
E-mail
cwu@semi.org
Phone
+886-3-560-1777
Fax
+886-3-560-1555
Office Address
11F-2, No. 1, Taiyuan 1st Street, Zhubei, City, Hsinchu,
County 30265, Taiwan
Other Committees
I&C / EHS / FPD / PV /3DS IC Committee
In charge
Venue, Location, Date