Adhesion Testing of Printed Metallic Inks on Various
Substrates
Steven Wu1, Dr. John Moosbrugger2
Department of Mechanical Engineering, Clarkson University
Direct writing of electrically conductive films for electrical and electronic applications can be
accomplished in several ways. Among these, inkjet printing is a mature technology with advantages in
some applications. Using inks consisting of silver nanoparticle dispersions, it is possible to print directly
onto any number of substrates and sinter the particles. This can be done at a lower temperature than for
processes using conventional silver particles so that devices on flexible polymer substrates can be
manufactured. This results in greater product versatility; RFID tags and sensors can fit in spaces as small
as the human bloodstream for example.
Because of significant differences of nanometric properties from bulk materials, it is critical to
determine how nanoparticles will behave. Adhesion to a substrate is important to ensure conductive tracks
do not decohere. This project attempts to develop a method for accurate quantitative measurement of the
peel force to determine adhesive properties. Using a tensile tester, the strain rate can be held constant and
the load required to peel a tape bonded to the film analyzed.
Initial tests were conducted to investigate consistency of results produced and to develop the final
test design. Tests were run with silver ink painted and sintered onto glass slides. Although there are not
yet conclusive results, the load profiles show promising adhesion and the method appears capable of
quantifying adhesion properties.
_____________________________________________________________________________________
1
Steven Wu, Sophomore, Mechanical Engineering, Interdisciplinary Engineering and Management,
Honors Program
2
Mentor: Dr. John Moosbrugger, Department of Mechanical and Aeronautical Engineering, Clarkson
University