Wisconsin Center for Applied Microelectronics
1550 Engineering Drive
Madison, WI 53706
Phone: 608/262-6877
Fax: 608/265-2614
Samco UV-Ozone Stripper/Cleaner
Process Description:
The wafer surface cleaning is a critical step in microfabrication. The surface should be free of particles, organic
contamination, metal contamination, surface micro-roughness,
and native oxide. There are many methods and procedures
for cleaning wafers which include wet with chemicals, plasma,
CO2, UV and ultrasonic. The process of wafer cleaning is a
changing technology as more studies are conducted in
surface terminations, kinetics and reactions.
Equipment Description:
The SAMCO unit combines ultraviolet light, high concentration ozone and controlled heating for
cleaning and stripping. This plasma method has several applications such as cleaning organic
contamination and improving wafer wet-ability. The oxygen has a flow range of 0–1.0 liter per min.
When the ozone generator is engaged and oxygen flow rate is 0.5 l/min, the ozone concentration is
approximately 6-7 g/m3. There is an optional UV lamp in the lid that generates UV bands at 185 and
254nm. The substrate heater has a maximum temperature of 300ºC. The automatic processing uses
nitrogen as the chamber purge gas.
Gases Available
Nitrogen
Oxygen
Approved Materials for use in this equipment:
Check the APPROVED MATERIALS for this equipment on http://mywebscape.wisc.edu under WCAM in the
group directories.
Date last modified: 2/12/2016
Date created: 3/27/2009
Content by: Rebecca Bauer