WORKSHOP ON ADVANCED
NANOSCALE ELECTRONICS PACKAGING
9:00 – MATERIALS
16:00, June 10, 2015
Kollektorn (A423), MC2,
Kemivägen 9, Gothenburg
This workshop will focus on novel nano-scale materials and devices which will
ultimately lead to new solutions to the heterogeneous integration of
semiconductor devices and microsystems. The workshop invites talks and
presentations that document new developments in materials, processes,
characterization techniques, and facilities for the realization of those new
concepts. The impact on the paradigm shifts, such as more than Moore and
more beyond Moore, in the semiconductor industry with these potential new
applications in the packaging domain will also be discussed.
Time
PRELIMINARY PROGRAM
Event Titles and Speakers
9:00 – 9:30
Workshop Open
- Prof. Johan Liu, Chalmers University of Technology
- Mats Edvinsson, Chair of IEEE Sweden Section
9:30 – 10:00
10:00-10:30
10:30
–
11:00
11:30
–
12:00
12:00
–
13:00
13:00
–
13:30
13:30
–
14:00
14:00
14:30
14:30
–
15:00
15:00
–
15:30
15:30
–
16:00
Inkjet printing of nanoscale metallic and carbon materials.
- Prof. K Suganuma, Osaka University, Japan
Coffee break
Cooling is cool- Examples of thermal management of avionic electronics.
- Dr. Torbjörn Nilsson, Saab
Dr. Toni Mattila, Finland
Lunch, Canyon
Potential use of graphene in electronics and composites.
- Prof. Bill Brox, Chalmers University of Technology
Dr. Sen Mei, SINTEF, Norway
Jetting of nanoscale electronics materials.
- Dr. Gustaf Mårtensson, Mycronic
Coffee break
Functionalization of graphene for electronics applications.
- Prof Zhibin Zhang, Uppsala University
Understanding atomic scale bonding mechanisms between graphene and substrates.
- Prof. Per Hyldgaard, Chalmers University of Technology
Scan the QR code for more information:
Workshop Chair: Prof. Johan Liu, johan.liu@chalmers.se
Coordinator: Di Jiang, di.jiang@chalmers.se
MC2, Bionanosystems Lab