DEK & SIPLACE Press News
DEK & SIPLACE @ APEX
February 24-26, 2015
San Diego, CA
New at the 2015 APEX show:
The new SIPLACE X4i S high-speed platform puts you a step ahead
SIPLACE introduces the world’s fastest placement platform to the U.S. at this year’s
APEX show. The latest generation of SIPLACE’s X-Series achieves an IPC
performance rating of 125,000 cph and a SIPLACE benchmark rating of 150,000 cph.
The SIPLACE X4i S features three placement head variants: the improved version of
the SIPLACE SpeedStar collect-and-place head, the extremely flexible, multi-mode
SIPLACE MultiStar, and the SIPLACE TwinStar for super-precise pick-and-place
placements. The new world speed champion is also one of the most flexible with a
spectrum that ranges from super-small 03015 components to large components with
dimensions of up to 200 x 125 mm. The components are supplied via intelligent, hotpluggable SIPLACE X-feeders that feature a contact-less data and power supply. In
addition to the single conveyor for board sizes of up to 610 x 560 mm, a flexible dual
conveyor with “independent mode” is available. For high-precision applications such
as the production of submodules and embedded PCs, SIPLACE offers the SIPLACE
X4i S micron as a special version with a placement accuracy that has been improved
to +/-20 µm.
“The 2015 APEX show focuses on performance, and the SMT Solutions team of ASM is
taking this literally. With the SIPLACE X4i S we are presenting a placement platform that is
currently the fastest in the world. Based on the SIPLACE benchmark rating, the SIPLACE
X4i S delivers a real-life placement performance of never-before-seen 150,000 cph
(component per hour), and its IPC rating sets a new record of 125,000 cph. At this year’s
show we demonstrate how we combine this enormous performance with high flexibility and
accuracy – via our extensive software suite, our intelligent SIPLACE X-feeders, our wide
range of conveyor options, and our unique multi-mode head, the SIPLACE MultiStar. All of
these features make the SIPLACE X4i S the ideal platform for demanding production
environments with high performance requirements,” says Jeff Timms, who is heading the
Americas SMT Solutions Team of ASM, about the new SIPLACE platform.
As a matter of fact, the new SIPLACE platform is not only fast, but extremely flexible. With
its software, the intelligent SIPLACE X-feeder and the single-and dual-conveyor options,
users can implement and quickly change a wide range of setup and production concepts –
down to random setup and the side-by-side production of different products. And the
placement head portfolio makes quick product changeovers possible without the need for
time-consuming reconfigurations, thanks to the SIPLACE SpeedStar, the SIPLACE MultiStar
and the SIPLACE TwinStar, which cover a component spectrum that is unusually broad for a
high-speed platform.
SIPLACE X4i S micron Platform for high-volume production of submodules
With the SIPLACE X4i S micron, the SMT experts of ASM Assembly Systems focus on the
production of miniaturized submodules in IT and telecommunication applications. It can
place up to 120,000 components per hour with an enhanced accuracy rating of 20 µm at
3 sigma.
With an unprecedented speed of 150,000 cph, ASM Assembly Systems presents the world's fastest
placement platform at this year's APEX Expo: the SIPLACE X4i S.
ASM Press Office, Americas
Mark Ogden
3975 Lakefield Ct Ste 106, Suwanee, GA 30024
Tel. +1.770.797.3189 / E-mail: ogden.mark@asmpt.com
Internet: www.siplace.com / www.dek.com
About The SMT Solutions Segment of ASMPT
With the integration of DEK into ASM Pacific Technology (ASMPT) in July 2014, ASM Assembly
Systems consists of the Printing Solutions Division (DEK) and the Placement Solutions Division
(SIPLACE). ASM Assembly Systems develops and distributes best-in-class DEK printers, stencils and
printing accessories for the SMT, semiconductor and solar markets, as well as best-in-class SIPLACE
SMT placement solutions. Both Divisions leverage the power of ASM’s development capabilities to
deliver significant competitive advantages to customers. By sharing its knowledge and expertise, the
SMT Solutions Segment of ASM provides electronics manufacturing companies worldwide with more
effective process integration technology and optimized workflows.
For more information about DEK Printing Solutions, visit www.dek.com
For more information about SIPLACE Placement Solutions, visit www.siplace.com
ASM Pacific Technology Limited
ASM Pacific Technology (ASMPT) has been listed on the Hong Kong Stock Exchange since 1989.
The ASMPT Group develops systems and solutions for semiconductor production and packaging as
well as surface mount technology applications. The company has plants in Hong Kong, China,
Singapore, Malaysia and Germany.
ASMPT is currently one of the constituent stocks on the Hang Seng HK MidCap Index under the
Hang Seng Composite Index, the Hang Seng Information Technology Industry Index, the Hang Seng
Hong Kong 35 index and the Hang Seng Global Composite Index.
For more information about ASMPT, visit www.asmpacific.com
Please direct reader enquiries to:
ASM Assembly Systems GmbH & Co. KG
ASM Press Office Americas
Mark Ogden
E-mail: ogden.mark@asmpt.com
ASM Assembly Systems
Global ASM Press Office
Susanne Oswald
E-mail: susanne.oswald@asmpt.com
ASM Press Office, Americas
Mark Ogden
3975 Lakefield Ct Ste 106, Suwanee, GA 30024
Tel. +1.770.797.3189 / E-mail: ogden.mark@asmpt.com
Internet: www.siplace.com / www.dek.com