AP 5301 / 8301
Instrumental Methods of Analysis
Course Coordinator: Prof. Paul K. Chu
Electronic mail: paul.chu@cityu.edu.hk
Tel: 34427724 Fax: 34420542
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Reference Books
• Encyclopedia of Materials Characterization, C. Richard Brundle,
Charles A. Evans, Jr., and Shaun Wilson (Editors), ButterworthHeinemann (1992)
• X-Ray Microanalysis in the Electron Microscopy (4th Edition), J. A.
Chandler, North Holland (1987)
• Methods of Surface Analysis: Techniques and Applications, J. M. E.
Walls (Editor), Cambridge University Press (1990)
• Secondary Ion Mass Spectrometry, Benninghoven, Rudenauer, and
Werner, John Wiley & Sons (1987)
• Surface Analytical Techniques, J. C. Riviere, Oxford University Press
(1990)
• Modern Techniques of Surface Science, D. P. Woodruff and T. A.
Delchar, Cambridge University Press (1994)
• Analysis of Microelectronic Material Devices, M. Grasserbauer and H.
W. Werner (Editors), John Wiley & Sons (1991)
• Scanning Electron Microscopy and X-Ray Analysis (3rd Edition), J.
Goldstein, D. Newbury, D. Joy, C. Lyman, P. Echlin, E. Lifshin, L.
Sawyer, and J. Michael, Kluwer (2003)
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CourseOBJECTIVES
Objectives
COURSE
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Basic understanding of materials characterization
techniques
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Emphasis on applications
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Classification of Techniques
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Microscopy and related techniques
Surface characterization techniques
Elemental / chemical depth profiling techniques
Non-destructive testing
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Microscopy and Related Techniques
• Light Microscopy
• Scanning Electron Microscopy (SEM) / Energy
Dispersive X-Ray Spectroscopy (EDS) /
Wavelength Dispersive X-Ray Spectroscopy
(WDS) / X-ray Diffraction (XRD) / X-Ray
Fluorescence (XRF)
• Transmission electron microscopy (TEM) /
Scanning Transmission Electron Microscopy
(STEM) / Electron Diffraction (ED)
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Surface Characterization Techniques
• Auger Electron Spectroscopy (AES)
• X-ray Photoelectron Spectroscopy (XPS) or
Electron Spectroscopy for Chemical Analysis
(ESCA)
• Scanning Probe Microscopy (SPM) – Scanning
Tunneling Microscopy (STM), Atomic Force
Microscopy (AFM), …
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Depth Profiling Techniques
• Auger depth profiling
• XPS depth profiling
• Secondary Ion Mass Spectrometry (SIMS)
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Non-Destructive Testing Techniques
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Radiographic and Neutron Radiographic Tests
Electromagnetic & Magnetic Particle Tests
Sonic, Electrical, Mechanical, and Visual Tests
Photoelasticity Test
Liquid Penetrant Tests
Leak Tests
Acoustic Emission Tests
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Principles of Analytical Techniques
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Product Yield Enhancement
• Understand via modeling and simulation which
parameters can improve product yield
• Systematically identify these parameters within
the process
• Control and reduce / eliminate these parameters by
identifying their root cause
• Process monitor these parameters to measure the
success of contamination control efforts
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Surface Contaminant Identification
• Particles – Optical Microscopy, SEM/EDS, AES,
XPS, SPM
• Residues – SEM/EDS, AES, XPS, SIMS
• Stains, discoloration, hazes – SPM, SEM, XPS,
AES, SEM/EDS
• General surface contamination – XPS, AES,
SEM/EDS, SIMS
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Haze on Silicon Surface (SPM)
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TiN Grains (SPM)
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Imaging of Hard Disk (SPM)
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Residues on Integrated Circuits (SEM)
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Integrated Circuit (SEM)
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Hard Disk Defects (AES)
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Si Wafer Surface Contamination (XPS)
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Depth Profiling
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Gate Oxide Breakdown (SIMS)
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