CIRTEK ELECTRONICS
CORPORATION
Company Presentation
Outline
Company overview and organization
Services and CEC BOM
Product Portfolio and Special Capabilities
Company strengths
Plans and programs
Package Technology Roadmap
Final Test, Finishing and FAREL
2
Cirtek Electronics Corporation
4/13/2015
Outline
Company overview and organization
Services and CEC BOM
Product Portfolio and Special Capabilities
Company strengths
Plans and programs
Package Technology Roadmap
Final Test, Finishing and FAREL
3
Cirtek Electronics Corporation
4/13/2015
4
Cirtek Electronics Corporation
4/13/2015
Company overview
Company Structure
Cirtek Holdings
Philippines Corporation
Cirtek Electronics Corporation
(“CEC”)
Primary purpose is to engage as an
independent subcontractor for
semiconductor assembly, test and
packaging services
Cirtek Electronics International
Corporation (“CEIC”)
A BVI company which provides
marketing, logistical and
administrative support, including
collection to CEC.
5
Cirtek Electronics Corporation
4/13/2015
Company overview
History
 Established in 1984 as independent
Subcontract Assembly & Test Provider
 Accredited by International Quality
institutions
CIRTEK has grown to provide world
class turnkey solutions that include
services from package design
development, wafer probe, wafer
back grinding, assembly packaging and
final testing of semiconductor devices
up to drop shipments to Customer's
end users.
Competitive pricing and easily
adaptable to customers needs
CIRTEK TODAY
25 years experience outsourced
assembly & testing solution provider
High quality products, while providing
production flexibility
Competitive pricing and adaptable to
customers’ needs.
Profitable despite several economic
downturns, debt free company
Growing client base composed of
companies located around the world
6
Cirtek Electronics Corporation
4/13/2015
Company overview
Cirtek assembles and tests semiconductor devices at
its manufacturing complex located on a 20,000
square meter property in Biñan, Laguna.
Its manufacturing facility is composed of two buildings,
with a total floor area of 14,100 square meters.
1800SQM of clean room environment @ Class 10K. We
offer general line and captive line assembly models
A Philippine Economic Zone Authority (PEZA)
registered company as an ecozone export enterprise
at the Laguna Technopark for the manufacture of
standard integrated circuits, discrete, hybrid and
potential new packages.
7
Cirtek Electronics Corporation
4/13/2015
Company overview
Business Strategies
1
Partnership with Customer to grow
business together
To develop partnership with its existing and potential
customers to provide world class quality solutions
through management expertise focused on specific
applications to meet customers specification, high
reliability and multi chips products.
Captive Line Development
To offer dedicated or captive line models for assembly and
test services in order to efficiently produce the customer’s
mature and stable products through shared investment
Technology Development
To continuously focus on Innovations and re-Engineering
in its production and assembly techniques and capabilities,
and to co-develop new technologies with customers
Mergers and Acquisitions
To actively seek strategic investments opportunities such
as, alliances, joint ventures, and/or acquisitions that will
be consistent with the Company’s overall business
strategies
2
3
4
8
Cirtek Electronics Corporation
4/13/2015
Organizational Structure
PRESIDENT & CEO
Jerry Liu
QA DIRECTOR
Luz Veril
VP- Global Business
Development
Norman Chang
EXECUTIVE VP/ GEN
MANAGER
Jorge Aguilar
CFO
Tony Buyawe
HUMAN RESOURCE
DIRECTOR
Milet Cruzada
QA / FAREL SECTION
MANAGER
Zeny Puedan
QC/QA SEC.MANAGER
Jacqueline Blancaflor
ACCOUNTING
MANAGER
Susan Lumba
MULTICHIPS BUS. MANAGER
MeAnn Canoza
SENIOR DIRECTOR
SALES & MKTG-CS
Antonio Callueng
VP FOR ENG’G &
PURCH, IND’L MGMT,
Raul Santiano
DEVELOPMENT ENG’G.
Raymond Tecson
FINAL TEST MANAGER
Walter Alegarme
FINAL TEST SUPERVISOR
Manny Olandria
CUST SERVICE TEAM
SUSTAINING ENG’G
Chona Morales
PROBE TEST
SUPERVISOR
Roderich Ignacio
MULTI DIE TEST
SUPERVISOR
Rey Reyes
IC BUS. MANAGER
Miles Besana
DISCRETE BUS. MANAGER
Medy Chua
QFN /DFN BUS. MANAGER
Wilson Padre
NEW PRODUCT BUS.
MANAGER
Rosendo Cerezo
HERMETICS BUS. MANAGER
Laarni Arnesto
9
Cirtek Electronics Corporation
4/13/2015
Outline
Company overview and organization
Services and CEC BOM
Product Portfolio and Special Capabilities
Company strengths
Plans and programs
Package Technology Roadmap
Final Test, Finishing and FAREL
10
Cirtek Electronics Corporation
4/13/2015
Cirtek Services
Sort + Assy + Test + Drop shipment

Wafer backgrinding
(8” maximum diameter / 4 mils thick capability)

Wafer mapping
(8” maximum diameter / ASCII format)

Wafer probing
(6” & 8” wafer diameter)

Die sales inspection
(Commercial / Military / Medical level of inspection)

Full assembly
(Refer to package portfolio)

Marking
(ink / laser)

Final test
(Refer to test capabilities)

Tape and reel
(SOT, 150 / 300 mil SOIC, QFN / DFN)

Tape and Ammo
(TO-92 straight / spread leads)

Drop shipment
(To any point as required)

Ship to Stock
Serve as your HUB/Distribution center
11
Cirtek Electronics Corporation
4/13/2015
Build of Materials
Cirtek Standard Materials
Leadframe
• Stamped LF
Copper A194
PPF -NiPdAu
DA Epoxy
Gold Wire ( Mils)
Molding Compound
• 84-1LMI/SR4
0.80, 0.90, 1.0 mils
• Sumitomo – G600, G770
• 8900- NC
1.2, 1.3, 1.5, 2.0 mils
• Hitachi 9220HF10
• 8600 • Etched LF
Copper Wire ( Mils)
• 2600AT - HT
1.0 , 1.65, 2.0
• QMI 529HLV
Aluminum Wire ( Mils)
• Plating – Spot Ag
• Configuration:
• NittoG300LC
• Sumitomo 6710/6600
• Cookson3200LS
• CRM 1076NS
1.25, 5.0, 10
• Toshiba KE955WY-white
• Eutectic DA
Copper Clip Attach
Plating – 100% Tin
Matrix
HDLF
Single/Dual
• Solder paste
• Sn5Pb95
• Sn10Pb90
Cirtek Electronics Corporation
Plating –SnPB (85/15)
4/13/2015
Outline
Company overview and organization
Services and CEC BOM
Product Portfolio and Special Capabilities
Company strengths
Plans and programs
Package Technology Roadmap
Final Test, Finishing and FAREL
13
Cirtek Electronics Corporation
4/13/2015
Product Portfolio
QFN/DFN Packages
QFN Body Size
• 2.00 x
• 3.00 x
• 3.00 x
• 3.50 x
• 4.00 x
• 5.00 x
• 7.00 x
• 8.00 x
2.00 / 08L
3.00 / 08L
3.00 / 16L
3.50 / 20L
4.00 / 24L
5.00 / 28L
7.00 / 32L
8.00 / 52L
DFN Body Size
Small Body Size
•
•
•
•
•
•
0.50 x 0.25 x 0.30 / 02L
1.00 x 0.60 x 0.46 / 02L
1.10 x 1.60 x 0.46/ 02L
1.27 x 0.76 x 0.76/ 02L
2.20 X 1.78 x 0.76/ 02L
2.50 X 1.70 x 0.76/ 03L
• Customer Specific
• 6.00 X 6.00 x 0.90/ 02L
•
•
•
•
•
•
•
•
2.90
1.70
2.00
2.50
3.00
3.30
3.00
4.00
x
x
x
x
x
x
x
x
1.80 / 04L
1.35 / 08L
2.00 / 08L
1.35 / 12L
1.35 / 12L
1.35 / 16L
3.00 / 10L
1.60 / 16L
14
Cirtek Holdings Philippines Corporation
4/13/2015
Product Portfolio
SOIC Packages
150 Mils Body Packages
08L- Stand
300 Mils Body Packages
TSOC 6L– 150 x 150 x 55 mils
18L
20L
16L Standard – Clip Attach
14L - Stand
24/28L
16L - Stand
Exposed Pad Version
08L- 150 Mils
16L – 300 Mils
16L – QSOP
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Cirtek Electronics Corporation
4/13/2015
Product Portfolio
Plastic Dual In Line Package
300 Mils Body Package
08L
14L
600 Mils Body Package
18L
Single In Package
8L, 9L
20L
24/28L
16L
Cirtek Electronics Corporation
4/13/2015
Product Portfolio
SOT Packages
SOT 23 Packages
03L
05L
06L
SOT Packages
SOT223
TO 92 Packages
TO 92 -Stand
SOT 143
SOT89
TO 92 - Flat
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Cirtek Electronics Corporation
4/13/2015
Product Portfolio
Hermetic Packages
Metal Can ( TO 3- TO 5)
Small Metal Cans
T-Hole Oscillator
Hybrid Assembly
SMT/COB Assy
Build of Materials
Materials
 Customer Specific
 Consignment
 Flexible Arrangement
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Cirtek Electronics Corporation
4/13/2015
Other Special Assembly Capabilities
Multichip on Standard Package
Multi die on standard 150 mil
2 die up to 32 die, Custom LF
design by Cirtek (SOIC) package
Standard silicon die attach
cylindrical crystal through
resistance welding LF design
by Cirtek 300 mil (SOIC) Pack.
Cylindrical Crystal
Control IC
Die to Die Bonding
Multi die embedded ceramic
crystal Mounted die in PCB
• NC and conductive epoxy
• Transfer over mold process
• 300 mil (SOIC) package
Copper Clip attach on SOIC/QFN
ESD and Power Devices
Copper clip
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Cirtek Electronics Corporation
4/13/2015
Hermetic Module Assembly
Metal lid
Non-hermetically sealed using conductive epoxy
PCB
Passive component attached with solder
GaAs dice attached with conductive epoxy
Gold wire
20
Cirtek Electronics Corporation
4/13/2015
Prescaler-Static divider Module Assembly
1
1
3
LEGEND:
1
1
2
CHIP CAPACITOR
1
1
2
CHIP RESISTOR
3
PRESCALER DIE
21
Cirtek Electronics Corporation
4/13/2015
Outline
Company overview and organization
Services and CEC BOM
Product Portfolio and Special Capabilities
Company strengths
Plans and programs
Package Technology Roadmap
Final Test, Finishing and FAREL
22
Cirtek Electronics Corporation
4/13/2015
Company strengths
1
Certified to the latest quality standards
2
Solid management team and expertise
3
Ability to adapt to customers’ needs
4
Full turnkey solutions
5
Growing customer base of diverse clients
6
Strong brand name and proven track record
7
A PEZA-registered entity
23
Cirtek Electronics Corporation
4/13/2015
Company strengths
1
World Class Quality standards

Cirtek’s manufacturing practices are designed to be compliant with
industry requirements and to exceed customer’s expectation.

Manufacturing applies latest quality system standards, which include ISO
9001, ISO 14001, QS-9000/TS-16949, BABT and DSCC, as well as certified
facility by UL
24
Cirtek Electronics Corporation
4/13/2015
Quality Management System map
Internal Quality Auditing – MOP
Customer Service - COP
Management
Review
QA /IQA
Inspection
Warehousing
Billing
9
Sales and
Marketing
1
Process
Design and
Dev’t
2
Production
Planning
Control
3
Process
Control
Inst / Doc’n
4
Assembly
Mfg
FA-REL
6
Final Test
7
Customers Satisfaction
Customers Requirements
Purchasing
10
Delivery
8
5
Calibration
Maintenance
Support Process
Facilities
Process
Engineering
MIS
Training
HR
EMS
Main Process
MOP
COP
Product Realization
NOTE:
Support process that has no arrows meaning
it will support the whole organization.
25
Cirtek Electronics Corporation
4/13/2015
Continual Improvement Process
Cirtek Quality Management System
CUSTOMERS
SATISFACTION
CUSTOMERS
REQUIREMENTS
Information
Input
Output
26
Cirtek Electronics Corporation
4/13/2015
Outstanding Quality System
QUALITY MILESTONE IN SYSTEM AUDITS PERFORMED BY CUSTOMERS AND
INDEPENDENT AUDITORS
ACCREDITTED AS QUALIFIED SUPPLIER BY OEM’s
CUSTOMER/END USER
SPONSOR
YEAR QUALIFIED
APPLICATION
HUAWEI – CHINA
SEMTECH INC
2009
POWER SUPPLY - CE
PANASONIC MOBILE COMM–JAPAN
ANALOG DEVICES INC
2009
REPEATER/BASE STATION
CANON INC - JAPAN
SEMTECH INC
2008
ELECTRONIC DEVICES
GE HEALTH CARE
SUNPOWER
2007
CT SCANNER
MICRONAS AUTOMOTIVE
MICRONAS
2007
HAL SENSOR
PANASONIC ELECTRONIC-JAPAN
SEMTECH INC
2006
FLAT SCREEN TV
HUAWEI – CHINA
DALLAS-MAXIM
2006
ENTERPRISE/OFFICES
IBM-JAPAN
DALLAS-MAXIM
2006
DATA NETWORKING
INTERNATIONAL RECTIFIER
IR DIVISION
2006
POWER SUPPLY / CHARGERS
ST MICROLECTRONICS
ST MICRO
2006
MOBILE APPLICATION
CMD
CMD
2006
MOBILE APPLICATION
EMERSON (ASTEC)
SILICON LINK
2005
POWER SUPPLY - CE
MEDTRONICS
MICROSEMI
2003
MEDICAL IMPLANTABLE
GENNUM
GENNUM-CANADA
2002
HEARING AID
27
Cirtek Electronics Corporation
4/13/2015
Company strengths
2
Solid Management Team and Expertise

Management team is composed of highly
experienced individuals from various
semiconductor and OSAT companies.

The Cirtek Team has over 150 years of combined
management and engineering package design
expertise specific to semiconductor industry.

Lean organization and prudent decision making.

Focused and goal oriented.
28
Cirtek Electronics Corporation
4/13/2015
Company strengths
3
Ability to adapt to customer’s needs

Technical abilities which provide customers a full range of turnkey solutions
Customer requirements

Customer satisfaction as evidenced by
the awards received from several
customers
 World class quality standards
 Excellence in manufacturing
 Clean room (Class 10K) facility and
practice 5S (Japanese) Discipline
 On-time Delivery
 Competitive pricing
 Flexibility / Responsiveness
29
Cirtek Electronics Corporation
4/13/2015
Company strengths
4
Full Turnkey Solution

Provide vertically integrated manufacturing solutions to its customers.
Package Design &
Development
Higher productivity / efficiency
Assembly &
Packaging
+
Lower cost
Test, Pack & drop ship
to end Customers
+
Faster time to market
30
Cirtek Electronics Corporation
4/13/2015
Company strengths
5


Growing customer base of diverse clients
A growing portfolio of customers. CHPI currently has 42 customers around
the world
The Company’s customers are located in various countries, with the bulk
of revenues contributed by customers located in Europe and the USA
% Contribution to revenues per region
USA
Europe
Asia
31
Cirtek Electronics Corporation
4/13/2015
Company strengths
6
25 Years Proven Track Record



Continuous production growth and generating employment.
Financially strong.
Delivering profit and dividend every year.
Cirtek Historical Profit & Loss 2008 - 2011
50,000
In 000US$
40,000
SALES (CAGR - 9.2%)
30,000
GROSS PROFIT (CAGR - 20%)
20,000
EBITDA (CAGR - 7.2%)
NET INCOME (CAGR - 35.1%)
10,000
2008
2009
2010
2011
32
Cirtek Electronics Corporation
4/13/2015
Company strengths
7
A PEZA-registered entity

As a PEZA*-registered entity, the Company enjoys certain incentives like
tax holidays, duty free importation of materials and reduced power rate
vis-a-vis non-registered entities which enables it to price its products
competitively.
Tax incentives
Entitlement to 5% gross
income tax (GIT) incentive.
Secure new 4 year income tax
holiday (ITH) for new projects
+
Ecozone
power rate
Reduction of 12.5%
to 13.5% on power
cost
Ability to price
products
competitively
Company savings
* The Philippine Economic Zone Authority (PEZA) is an attached agency to the Department of Trade and Industry tasked to promote investments,
extend assistance, register, grant incentives to and facilitate the business operations of investors in export-oriented manufacturing and service
facilities located inside selected areas throughout the country
33
Cirtek Electronics Corporation
4/13/2015
Outline
Company overview and organization
Services and CEC BOM
Product Portfolio and Special Capabilities
Company strengths
Plans and programs
Package Technology Roadmap
Final Test, Finishing and FAREL
34
Cirtek Electronics Corporation
4/13/2015
Plans and Programs
1
Expansion of
Manufacturing
facility and Capacity
This will enable us to support
400 Million units of
additional new business from
existing and potential
customers.
2
Innovation and ReEngineering
Sustaining cost reduction
program, higher quality
product and stable process
through automation and reengineering. To develop new
packages through innovation
to maximize yield and satisfy
or exceed customer
expectation.
3
Completion of current
projects and programs
with customers
Concluding and enabling Cirtek
to realize new potential
business in the pipe line worth
US$11.8 Million by 2012 and
to expand product portfolio.
New Potential business:
 Power MOSFET QFN
 Open cavity moisture /
pressure sensor for
automotive
Opto Couplers
 Exposed Cavity Power
Amplifier – HSOP
 Current protection devices
35
Cirtek Electronics Corporation
4/13/2015
Outline
Company overview and organization
Product offerings, Services and CEC BOM
Product Portfolio and Special Capabilities
Company strengths
Plans and programs
Package Technology Roadmap
Final Test, Finishing and FAREL
36
Cirtek Electronics Corporation
4/13/2015
Package and Technology Roadmap
 Package Development Roadmap
 PCB / LGA
/ SIP
 FLAT TO92
 SMT-COB
 FLIP CHIP
ASSY
 STD TO92
 0.5X0.25X0.30
DFN PACKAGE
 HYBRID ASSY
 CERAMIC ASSY
 SMT
 METAL CAN
 1.2X0.76X0.76
DFN PACKAGE
 JEDEC
STD QFN /
DFN
 1.0X0.5X0.48
DFN PACKAGE
 COL / CLEAR
PACKAGE DFN
 SOD323
 PDIP
2005
 POWER QFN
USING CU CLIP
 WLCSP
 LED ASSY
 SOT23
 SOT23
 SOT143
 AIR CAVITY
QFN / DFN
 SOT89
 SOT223
 TSOC
 TO272
 MSOP
 SOIC NB
 SOIC WB
 SOIC W/ CRYSTAL
 16 QSOP
 SOIC EPAD
2007
 OPEN CAVITY
SENSOR
 HSOP / DSO
2009
2011
2013
2014
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Cirtek Electronics Corporation
4/13/2015
Package and Technology Roadmap
 Cost Reduction / Development Roadmap
 Technology
 Copper wirebond
(90% lower than Au)
 BSOB bonding
 Stacked Die attach
 AuSn Eutectic die attach
 AuAg wirebond
(20% lower than Au)
 Ribbon bonding
 Soft solder / Eutectic Die attach
 Low loop profile
 Die attach film
 Auto Clip attach
( 3% lower Au cost)
 Material
 Korean Cu wire supplier
(21% lower cost)
 Brass / steel leadframe
(10% lower than Cu)
 High Density Leadframe
 Matrix Leadframe
 Chinese leadframe supplier
(20% lower cost)
(12% productivity improvement)
 Ultra High Density Leadframe
( High Volume)
 MGP / automold conversion
(14% lower cost)
 Mold compound selection GE300LC2
(21.8% lower cost)
 Ag plating thickness reduction
(5% lower cost)
2005
2007
2009
2011
2012
2013
38
Cirtek Electronics Corporation
4/13/2015
Outline
Company overview and organization
Services and CEC BOM
Product Portfolio and Special Capabilities
Company strengths
Plans and programs
Package Technology Roadmap
Final Test, Finishing and FAREL
39
Cirtek Electronics Corporation
4/13/2015
40
Cirtek Electronics Corporation
4/13/2015
Final Test Summary
 WAFER PROBE CAPABILITIES

Wafer Prober




EG1034 – 4” and 5”
EG2001 – 6”
EG2080 – 8”
Ink/Inkless less Process

ASCII format
41
Cirtek Electronics Corporation
4/13/2015
Final Test Summary
 TEST CAPABILITIES

Mixed signal device


Discrete device


FAIRCHILD SENTRY, SIEMENS S725
OPTO relay device


HP RACK & STACK, HP84000
Digital /Asic device


KEITHLEY, GENESIS
RF / IF device


TESEC 881-TT, FROTHINGHAM CV3000B
Linear device


CREDENCE ASL-1000, EAGLE ETS 500D, LTX
TESEC, HIPOT
Protection device

TESEC, KEITHLEY
 MULTI BIN/POST TEST MARKING
SOT 89, 223
 TO92

42
Cirtek Electronics Corporation
4/13/2015
Final Test Summary
 TEST / TAPE & REEL CAPABILITIES

Integrated test and TNR handlers
SRM S248 – SOT
 SRM XD16 – SOT
 SRM S12 – SOT
 VECTOR T20 – SOT
 QMT 1500 – SOT
 SRM 248XS – TDFN
 ASM FT2030 FLEXIPACK – SOIC
 SRM 244XS – SOIC
 ISMECA –NX16 – DFN ( 0402)


Test handlers (SOIC/PDIP)
MCT 3608/5100
 MT 8305/8588/8704
 AETRIUM 2020 DTS


TNR handlers (SOIC)
G6 Visdynamics
 Systemation TO 485 with 3D vision
 STI 8028 / ST 60

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Cirtek Electronics Corporation
4/13/2015
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Cirtek Electronics Corporation
4/13/2015
Failure Analysis Capability

Internal / external inspection


X-RAY


ENVIRO SYSTEM chamber
Temperature cycle


TEXTRONICS curve tracer
85% / 85oC moisture soak


NAPCO 8110-TD test chamber
Open / short test


DECAP AS2000
Autoclave


SOFTEX 100
Decapsulation


High / low power microscope
ENVIRO SYSTEM chamber
Polisher / grinder (cross sectioning)

SBT–MODEL 900
45
Cirtek Electronics Corporation
4/13/2015
Reliability Test Capability

Die shear


Bond strength


MIL STD 883-2003-7 / JESD22-B102D
 8 hrs steam aging @ 100oC
Temperature cycle


MIL STD 883-2015
 3 mins soaking time using IPA @ 30 strokes
Solderability test


MIL STD 883-2011
Mark permanency test


MIL STD 883-2013
MIL STD 883E-1010.7 /JESD22-104B
 10 cycles minimum @ 10 minutes / cycle
 Low temp @ -65oC (+0, -10oC)
 High temp @ 150oC (+15oC / -0oC) +150oC (+15,-0oC)
Stability bake

MIL STD 883-1008.2
 6 hrs @ 175oC
46
Cirtek Electronics Corporation
4/13/2015
Reliability Test Capability

High temp storage


Auto clave


JEDEC 22A 102-C
 15 PSI for 96 hrs @ 121oC
Fine leak


JESD22-A103B
 500 hrs min @ 150oC
MIL STD 750D 1071.6 / Test Condition D
 30 secs soaking time @ 125oC
Moisture soak

IPC / JEDEC J-STD-020C
 168 hrs soaking time @ 85% RH / 85oC temp
47
Cirtek Electronics Corporation
4/13/2015
WHY CIRTEK as ASSSEMBLY & TEST
SUBCONTRACT PARTNER?
QUALITY FIRST
MIND SET
STABLE COMPANY
→ Philosophy - Long
Term Relationship
PROVEN TRACK
RECORD
GROWING
COMPANY
→ Strategy –
Partnership for
Business Growth
FLEXIBLE &
RESPONSIVE
→ World Class Quality
-External
manufacturing of
Customer
●Abundance of
skilled workers
●Very low turn
over rate
●Educated
workforce
↗ Cost
competitive
↗Continue to
Innovate and reengineer to add
value to
production and
cost
48
Cirtek Electronics Corporation
4/13/2015
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Cirtek Electronics Corporation
4/13/2015