DSP and ARM MPU:
Differentiating your real-time
processing design
Sept 2010
TI Confidential – Under NDA
1
Embedded processing portfolio
TI Embedded Processors
Microcontrollers (MCUs)
16-bit ultralow power
MCUs
32-bit
real-time
MCUs
MSP430™
C2000™
Delfino™
Piccolo™
ARM®-Based Processors
32-bit ARM®
MCUs
32-bit ARM®
MPUs
Digital Signal Processors (DSPs)
DSP
DSP+ARM®
Multi-core
DSPs
Ultra
Low power
DSPs
C6000™
C5000™
ARM® Cortex™-M3
ARM® Cortex™-A8
& ARM9
C6000™
C6000 + ARM®
DaVinci™
300 MHz to >1Ghz
+ Accelerator
Floating/fixed point
24,000
MMACS
Up to 300 MHz
+ Accelerator
®
Stellaris
Sitara™
Video processors
Up to
25 MHz
40 MHz to
300 MHz
Up to
80 MHz
Value line to
500 MHz
Perf. Line to 1GHz
Flash
1 KB to 256 KB
Flash, RAM
16 KB to 512 KB
Cache
RAM, ROM
USB, ENET,
PCIe, SATA, SPI,
McBSP, McASP
Up to 320 KB RAM
Up to 128 KB ROM
PWM, ADC,
CAN, SPI, I2C
Cache,
RAM, ROM
USB2.0, OTG,
CAN, PCIe,
EMAC, LPDDR1
Cache
RAM, ROM
Analog I/O, ADC
LCD, USB
Flash
64 KB to 256 KB
USB, ENET
MAC+PHY, CAN,
ADC, PWM, SPI
SRIO, EMAC
DMA, PCIe
USB, ADC
McBSP, SPI, I2C
Measurement,
sensing, general
purpose
Motor control,
digital power,
lighting, ren. energy
Motion control,
HMI, industrial
automation
Industrial computing,
POS & portable
data terminals
Video, audio, voice,
security,conferencing
Telecom test & meas,
media gateways,
base stations
Audio, voice,
medical,
biometrics
$0.25 to $9.00
$1.50 to $20.00
$1.00 to $8.00
$5.00 to $20.00
$5.00 to $200.00
$40 to $200.00
$3.00 to $10.00
Software & Dev. Tools
MPUs – Microprocessors
Embedded processing portfolio
TI Embedded Processors
Microcontrollers (MCUs)
16-bit ultralow power
MCUs
32-bit
real-time
MCUs
MSP430™
C2000™
Delfino™
Piccolo™
ARM®-Based Processors
32-bit ARM®
MCUs
32-bit ARM®
MPUs
Digital Signal Processors (DSPs)
DSP
DSP+ARM®
Multi-core
DSPs
Ultra
Low power
DSPs
C6000™
C5000™
ARM® Cortex™-M3
ARM® Cortex™-A8
& ARM9
C6000™
C6000 + ARM®
DaVinci™
300 MHz to >1Ghz
+ Accelerator
Floating/fixed point
24,000
MMACS
Up to 300 MHz
+ Accelerator
®
Stellaris
Sitara™
Video processors
Up to
25 MHz
40 MHz to
300 MHz
Up to
80 MHz
Value line to
500 MHz
Perf. Line to 1GHz
Flash
1 KB to 256 KB
Flash, RAM
16 KB to 512 KB
Cache
RAM, ROM
USB, ENET,
PCIe, SATA, SPI,
McBSP, McASP
Up to 320 KB RAM
Up to 128 KB ROM
PWM, ADC,
CAN, SPI, I2C
Cache,
RAM, ROM
USB2.0, OTG,
CAN, PCIe,
EMAC, LPDDR1
Cache
RAM, ROM
Analog I/O, ADC
LCD, USB
Flash
64 KB to 256 KB
USB, ENET
MAC+PHY, CAN,
ADC, PWM, SPI
SRIO, EMAC
DMA, PCIe
USB, ADC
McBSP, SPI, I2C
Measurement,
sensing, general
purpose
Motor control,
digital power,
lighting, ren. energy
Motion control,
HMI, industrial
automation
Industrial computing,
POS & portable
data terminals
Video, audio, voice,
security,conferencing
Telecom test & meas,
media gateways,
base stations
Audio, voice,
medical,
biometrics
$0.25 to $9.00
$1.50 to $20.00
$1.00 to $8.00
$5.00 to $20.00
$5.00 to $200.00
$40 to $200.00
$3.00 to $10.00
Software & Dev. Tools
MPUs – Microprocessors
Sitara™ processors are ideal for
Applications such as
• HVAC and building controls
• Network appliances
• Industrial automation
• Point-of-service machines
• Test and measurement
• Medical instrumentation
• Educational consoles
• Industrial low power PCs
• … many others
Design requirements
• System cost constraints needing
high system integration
• Network connectivity (Ethernet,
Wi-Fi®)
• Multiple connectivity and interface
options (CAN, USB, SDIO, LCD I/F,
I2C, SATA, PWM)
• Advanced graphical user
interfaces (graphics acceleration)
• Operating system compatibility
(Linux, Windows® Embedded CE,
and Others)
• Scalability (broad portfolio of
product options with code
compatible roadmap)
• Application software portability
(code compatible roadmap)
Sitara™ ARM® microprocessors
Available Now
ARM9™
ARM Cortex™-A8
Low Power ARM9 with
flexible peripherals
AM3894 New!
New!
AM3892
AM3715
AM3703
AM3517
AM3505
OMAP3515
OMAP3503
High-performance Cortex-A8
with system integration
• Power efficient (down to 37mW
standby, 402mW active)
• User configurable interfaces through
the programmable real-time unit
(PRU)
• Integrated peripherals, 10/100
Ethernet, USB, SATA, CAN, UART
and many others
• Up to 1.5GHz (3000 DMIPS)
• Power efficient (down to 12mW
standby, 700mW active)
• Integrated graphics for rich user
interface functions
• Integrated interfaces of PCIe, USB,
10/100/1000 Ethernet, SD card, WiFi®, CAN, and many others
AM1808
AM1806
AM1707
AM1705
In Development
ARM Cortex-A8
“AM18x Next” (4Q10)
“AM38x Next” (2011)
“AM33x Next” (2011)
ARM9 & Cortex-A8 with more
performance and value options
• Beyond 1.5GHz performance
• 1080p display support
• Enhanced graphics for superior user
interface functions
• Peripheral integration of Profibus and
many others
Support for Linux, Windows® Embedded CE, Android, & RTOS
Sitara™ ARM® MPU roadmap
Production
Development
Sampling
AM389x
•
•
•
•
•
•
•
ARM Cortex-A8
Up to 1.5GHz
2x 1G-Enet
3D Graphics
PCIe, SATA
DDR2/3
Advanced Display
AM37x
•
•
•
•
OMAP35x
•
•
•
•
ARM Cortex™ -A8
Up to 720 MHz
3D Graphics
LPDDR1
AM387x
ARM Cortex-A8
Up to 1GHz
3D Graphics
LPDDR1
• Cortex-A8
• Increased integration
performance line - performance and features optimized
value line - device and system cost optimized
AM35x
AM17x
AM18x
•
•
•
•
•
•
•
•
•
•
•
•
ARM9™
Up to 456MHz
10/100 Enet
PRU
SATA
SDRAM
ARM9
Up to 456MHz
10/100 Enet
PRU
SATA
SDRAM/LPDDR1
/DDR2
•
•
•
•
•
•
ARM Cortex-A8
Up to 600MHz
3D Graphics
10/100 Enet
CAN
DDR2
AM335x
• ARM Cortex-A8
• Cost optimization
• Increased features
Speeds shown are for commercial temperature. Dates approximate initial samples. Not all peripherals shown.
Limitations apply among package and pin muxing. Devices features subject to change without warning or notification.
| -----------------------------------------TODAY------------------------------------------- | --------------1H11------------- | ---------------2H11-----------|
AM1707/05 ARM9™ based processors
Cores
Sample Applications
• Up to 450MHz ARM926EJ-S™
• Industrial/home automation • Portable data terminals
• Power protection systems
Memory
• Test & measurement
• ARM: 16kB I-Cache; 16kB D-Cache
• On Chip: 128kB SRAM
AM1707/05
• External interfaces: SDRAM x2
Processors
Peripherals
Display Subsystem
• PRU flexibility for added peripherals
ARM9
LCD
PRU
• USB 2.0 OTG w/ PHY
Controller
Subsystem
• 10/100 EMAC
(1707)
• MMC/SD card interface
• Display subsystem with LCD controller
• 1.8V or 3.3V I/O’s
Power
L3/L4 Interconnect
• Total Power: 455mW
Serial Interface
• Standby Power: 62mW
Connectivity
Package
USB OTG w/ PHY
SPI x2
McASPx3
• ZKB:17x17mm BGA,1.00mm pitch, 256-balls (1707)
• PTP:26 x 26mm QFP, 0.5mm, 176-pins (1705)
USB HS w/ PHY
I2C x2
UART x3
• Extended Temperature Grade Options
(1707)
• Commercial (0C to 90C)
Memory Interface
Timers
• Industrial (-40C to 105C)
EMAC
MMC/SD/SDIO
WDT x1
• Automotive - not Q100(-40C to 125C)
• Pin to pin compatible processor: OMAP-L137
UHPI
SDRAM
GP x1
Benefits
• Multiple connectivity and interface options
PWM x3
NAND/NOR/
• Rich, intuitive user interfaces
SDRAM
• High system integration = reduced system cost
eCAP x3
eQEP x2
AM1808/06 ARM9™ based processors
Cores
• Up to 450MHz ARM926EJ-S™
Memory
• ARM: 16kB I-Cache; 16kB D-Cache
• On Chip: 128kB SRAM
• External interfaces: LPDDR1/DDR2 and SDRAM
Peripherals
• PRU flexibility for added peripherals
• USB 2.0 OTG w/ PHY
• 10/100 EMAC, SATA, uPP
• MMC/SD card interface x2
• Display subsystem with LCD controller
• 1.8V or 3.3V I/O’s
Power
• Total Power: 402mW
• Standby Power: 37mW
Package
• ZCE: 13x13mm nFBGA, 0.65mm pitch, 361-balls
• ZWT: 16x16mm BGA, 0.8mm pitch, 361-balls
• Extended Temperature Grade Options
• Commercial (0C to 90C)
• Industrial (-40C to 105C)
• Pin to pin compatible processor: OMAP-L138
Benefits
• Multiple connectivity and interface options
• Rich, intuitive user interfaces
• High system integration = reduced system cost
Sample Applications
• Industrial/home automation
• Test & measurement
• Portable data terminals
AM1808/06
Processors
Display Subsystem
ARM9
PRU
Subsystem
LCD
Controller
Video Port Video Input x2
Interface
Video Output x2
L3/L4 Interconnect
Connectivity
Serial Interface
USB OTG w/ PHY
McBSP x2
McASP
USB HS w/ PHY
(1808)
SPI x2
UART x3
I2C x2
SATA (1808)
Memory Interface
Timers
EMAC (1808)
SDRAM
WDT x1
UHPI
LPDDR1/DDR2
GP x3
uPP
MMC/SD/SDIO x2
PWM x2
eCAP x3
AM3517/05 Cortex™-A8 based processors
Cores
• 600MHz Cortex-A8 with NEON™ coprocessor
• 3D graphics accelerator (3517)
Memory
• ARM: 16kB I-Cache; 16kB D-Cache; 256kB L2
• On Chip: 64kB SRAM
• External Interfaces: DDR2 and NAND/NOR
Peripherals
• CAN controller
• 10/100 EMAC
• USB 2.0 OTG w/ PHY
• MMC/SD card interface x3
• Display subsystem with LCD controller
and dual 10 bit DAC’s
• 1.8V or 3.3V I/O’s
Power
• Total Power: 700mW
• Standby Power: 12mW
Package
• ZCN: 17x17mm BGA, 0.65mm pitch, 491-ball.
Utilizes Via Channel™ array technology with 0.8mm
pitch plus design rules
• ZER: 23x23mm PBGA, 1.0mm pitch, 484-ball
Benefits
• 1200DMIPS for OS’s like Linux, Win CE, RTOS
• 10M polygons per second for robust GUIs
• Multi window overlay for hardware accelerated user
interface
Sample Applications
• Industrial/home automation
• Point of service
• Single board computers
• Digital signage
AM3517/05
Processors
ARM®
CortexA8
Display Subsystem
3D
Graphics
Accelerator
(3517)
LCD
Controller
Video
Enc
Video
Processing
Front End
10 bit DAC
10 bit DAC
16-bit Video
Input
L3/L4 Interconnect
Connectivity
Serial Interface
Memory Interface
USB OTG w/ PHY
McBSP x5
DDR2
USB HS Host x2
MCSPI x4
NAND/NOR
CAN Controller
I2C x3
MMC/SD/SDIO x3
EMAC
HDQ/ 1-wire
Timers
UART x3
GP x12
UART w/ IrDA
WDT x1
AM389x Cortex™-A8 based
processors
ARM
Benefits
•
•
•
Faster program execution and more simultaneous
applications
Communicate simultaneously over multiple high
speed connections
Reduced BOM parts count
Sample Applications
• Networking &
• Multi-display products
Communications (routers, • Industrial control / HMI
gateways, switches,
servers, NAS)
• Single board computers
• Interactive kiosks
Software and development tools
•
•
•
Linux, WinCE and drivers direct from TI
Android and RTOS (QNX, Green Hills, etc) from
partners
Full featured and low cost development board options
Schedule and packaging
•
•
•
•
Samples: Nov‘10; Production: 4Q’11
Dev. Tools: Nov’10
Prelim docs: Oct ’10
Packaging: 25x25, 0.65mm via channel array, 1031
ball
Availability of some features, derivatives, or packages may be delayed from
initial silicon availability
Peripheral limitations may apply among different packages
Some features may require third party support
All speeds shown are for commercial temperature range only
®
Cortex-A8
1.2 GHz/
1.5 GHz*
Graphics
(AM3894 only)
Display processor
PowerVR
SGX
3D Gfx
Resizer
32K/32K L1
Security
AES, 3DES
256K L2
RNG
64K RAM
Display
512K
Shared
RAM
HS OSD
SD OSD
SD Encoder
SD DAC x3
HD Encoder
HD DAC x3
HDMI Xmit
(w/HDCP)
HDMI PHY
HD Video I/O x2
L3/L4 Interconnect
Serial
Interface
UART x3
SPI
2
I C x2
McASP x3
McBSP
PCIe (2.0)
x2 lanes
SPDIF
SATA x2
(3Gbps)
System
EDMA x4
Timers x8
WDT
Smart Card x2
* Initial sampling will be for the XAM3894 1.0GHz
Parallel
SD/SDIO
GPIO
USB 2.0
+ PHY x2
(host and device)
EMAC
10/100/1G x2
(GMII, MII)
Memory Interface
DDR2/3 x2
Async EMIF/NAND
Supported operating systems
Linux
Android
WinCE*
Real-Time Operating System
Community
Commercial
Community/
Commercial
TI Owned
(with 3P)
Green
Hills
WR
VxWorks
AM37x






AM35x



Beta
available
OMAP35x






AM17x


Beta
available


AM18x


Beta
available


ELogic
ThreadX
–
–
Mentor
Nucleus









• Production quality Software Development Kit (SDK) including:
–
QNX /
RIM
= TI Driven- No charge
Windows®
Free Drivers and kernel port to Linux,
Embedded CE and other
industry leading operating systems (Android, QNX, etc…)
Development tools for Linux and Windows® Embedded CE
Proof-of-concept demonstration and example software
• Active open source community accompanied by the world’s largest
ecosystem of 3rd party tools and application specific solutions

= Available

= Planned
D
= Date Committed
* WinCE requires run-time royalties to Microsoft
TI Base SW/Components
ARM9™
software summary
User Interface
Application Level Software
Browser/
Media Players
TI HW/Libraries
3rd party/Customer
“Applications”
Application Frameworks – Java, Qt, GStreamer, Flash, Android, DShow, Direct Draw
Board Support Package
•Linux – Open Source – TI Developed
•Windows Embedded CE – TI Owned,
Developed by Microsoft Gold Partner
•Commercial Linux and Android – Many
Partners
•RTOS – QNX, VxWorks, Nucleus,
Integrity etc.
Video,
Imaging,
Speech,
Audio
Codecs
and
Frameworks
(ARM9)
OS Kernel
ARM9 with on chip USB, Ethernet, SATA
Accelerators – PRU
AM17x and AM18x
TI Base SW/Components
Cortex™-A8 software summary
3rd party/Customer
ARM® Cortex-A8+graphics
User Interface
TI HW/Libraries
Application Level Software
Browser/
Media Players
“Applications”
Application Frameworks – Java, Qt, GStreamer, Flash, Android, DShow, Direct Draw
Board Support Package
•Linux – Open Source – TI Developed
•Android – Open Source – TI Funded
•Windows Embedded CE – TI Owned,
Developed by Microsoft Gold Partner
•Commercial Linux and Android – Many
Partners
•RTOS – QNX, VxWorks, Nucleus,
Integrity etc.
Video,
Imaging,
Speech,
Audio
Codecs
and
Frameworks
on NEON™
OpenGL® ES
and
OpenVG™
Library
On
SGX
2D
Graphics
Library
On
NEON
OS Kernel
ARM Cortex-A8 with on chip USB, High End CAN controller (HECC) and Ethernet MAC
Accelerators – SGX 530 and Neon
OMAP35x, AM35x, AM37x
Embedded processing portfolio
TI Embedded Processors
Microcontrollers (MCUs)
16-bit ultralow power
MCUs
32-bit
real-time
MCUs
MSP430™
C2000™
Delfino™
Piccolo™
ARM®-Based Processors
32-bit ARM®
MCUs
32-bit ARM®
MPUs
Digital Signal Processors (DSPs)
DSP
DSP+ARM®
Multi-core
DSPs
Ultra
Low power
DSPs
C6000™
C5000™
ARM® Cortex™-M3
ARM® Cortex™-A8
& ARM9
C6000™
C6000 + ARM®
DaVinci™
300 MHz to >1Ghz
+ Accelerator
Floating/fixed point
24,000
MMACS
Up to 300 MHz
+ Accelerator
®
Stellaris
Sitara™
Video processors
Up to
25 MHz
40 MHz to
300 MHz
Up to
80 MHz
Value line to
500 MHz
Perf. Line to 1GHz
Flash
1 KB to 256 KB
Flash, RAM
16 KB to 512 KB
Cache
RAM, ROM
USB, ENET,
PCIe, SATA, SPI,
McBSP, McASP
Up to 320 KB RAM
Up to 128 KB ROM
PWM, ADC,
CAN, SPI, I2C
Cache,
RAM, ROM
USB2.0, OTG,
CAN, PCIe,
EMAC, LPDDR1
Cache
RAM, ROM
Analog I/O, ADC
LCD, USB
Flash
64 KB to 256 KB
USB, ENET
MAC+PHY, CAN,
ADC, PWM, SPI
SRIO, EMAC
DMA, PCIe
USB, ADC
McBSP, SPI, I2C
Measurement,
sensing, general
purpose
Motor control,
digital power,
lighting, ren. energy
Motion control,
HMI, industrial
automation
Industrial computing,
POS & portable
data terminals
Video, audio, voice,
security,conferencing
Telecom test & meas,
media gateways,
base stations
Audio, voice,
medical,
biometrics
$0.25 to $9.00
$1.50 to $20.00
$1.00 to $8.00
$5.00 to $20.00
$5.00 to $200.00
$40 to $200.00
$3.00 to $10.00
Software & Dev. Tools
MPUs – Microprocessors
TI DM portfolio
Products available today
Performance
Digital Media Processors
•
•
•
ARM + Video Accelerators
DSP + Video Accelerators
DM36x
DM355
DM357
DM335
DM6431/3/5/7
DM648
DM647
Optimum Consumer
Video
Enhanced Video with
Real-time Signal
Processing
ARM9 processor
and powerful co-processors
Enhanced video processing subsystem (with integrated front-end
and back-end imaging interfaces)
Low-power design
(<850mW total power)
• High-level of application
specific integration to
reduce system cost for
communications and
surveillance applications
DSP + ARM
+ Video Accelerators
DM3730/25
DM6467/T
DM6446
Advanced
Graphics and
Video
• High performance multiformat video up to 1080p
• Ideal for Video, Imaging
and Vision applications
15
featured product
DaVinci™ Digital Media Roadmap
Performance Line
Production
Sampling
Development
DM
Performance
Next (1Q12)
DM6467T
Performance
Optimized
•
1080P60
enc/dec
C64x+ARM9
•
DM37xx
•
•
•
•
720P dec
Cortex-A8
Up to 1GHz
3D graphics
• Up to 3x 1080P60
enc/dec
• 2D/3D graphics
DM LP Next (1Q12)
•
•
DM Value Next
(1Q12)
• 1080P60
• Cortex-A8
• Adv image
co-proc
DM368
DM365
Value Line
DM355
•
•
•
MPEG4 720P
encode
225 MHz
ARM9
Image co-proc
•
•
•
720P enc/dec
300 MHz
ARM9
Image
co-proc.
DM644x
DM64x
• SD/HD video
• C64x
• Multiple
video ports
• Up to 720P
enc/dec
• C64x+ARM9
• OSD capable
•
•
•
1080P30 enc
432Mhz ARM9
Image co-proc
Power
Optimized
DM643x
•
•
C64x
Low cost SD
video
2011
2010
1x 1080P60
enc/dec
2D/3D graphics
2013
Speeds shown are for commercial temperature. Dates approximate initial samples. Not all peripherals shown.
DM368 digital media processor
Up to 1080p30 Full HD Video Encode and Closed-loop Decode
Example applications:
•
•
•
•
•
IP security camera
HD digital signage
HD video communications
systems and cameras
Multi-channel DVR
Portable medical
DM368
processor
Front End
ARM
Subsystem
HMJCP CoProcessors
Image Sensor
Interface
H.264
VC1
MPEG2
Histogram/3A
ARM9
CPU
MPEG4
JPEG
432
MHz
Benefits:
•
•
•
•
Multi-format HD video with H.264
up to 1080p
High system integration (with OSD,
histogram, previewer, resizer, and
other processing blocks as well as
peripheral support)
Multi-channel, multi-stream and
multi-rate
Free, TI-provided codecs
Video Processing Subsystem
Image
Signal
Processing
(ISP)
Resizer
Back End
Enhanced
On-Screen
Display
Video
Enc
10b HD/SD DAC
10b HD DAC
10b HD DAC
DMA Data & Configuration Bus
Peripherals
EDMA
Keyscan/ADC
Connectivity
USB
EMAC
2.0HS
10/100
OTG
System
Timer x4
64b
WDT
PWM
x4
Serial Interfaces
McBSP
x1
I2 C
HPI
SPI
x5
UART
x2
Program/Data Storage
mDDR/
NAND/
MMC/
DDR2
ECC
SDIO
EMIF
EMIF
x2
RTC
Voice
Codec
Back to: DM roadmap | product positioning
17
DM3730/25 SoC
DM3730
Example Applications:
• Low power PC
• Media Player
• Patient monitoring
• Single board computers
• Test and measurement
ARM®
CortexA8
C6000
C64x+
DSP + video
3D
Graphics
Accelerator
(3730)
DM3730/25
Processors
Display Subsystem
LCD
Controller
Video
Enc
Video
Processing
Front End
10 bit DAC
10 bit DAC
12-bit Video
Input
L3/L4 Interconnect
Benefits:
• Flexible video accelerator
and signal processing engine
• Comprehensive SDK
• High system integration
• Compatible w/ popular
OMAP35x
Connectivity
Serial Interface
Memory Interface
USB OTG
McBSP x5
LPDDR1
USB HS Host x3
MCSPI x4
MMC/SD/SDIO
x3
I2C x3
HDQ/ 1-wire
Timers
UART x3
GP x12
UART w/ IrDA
WDT x2
DM3730/25 SoC
Features
 Peripheral
• USB HS Host x3, USB 2.0 OTG
• MMC/SD card interface x3
• Display subsystem with LCD controller
and dual 10 bit DAC’s
• 1.8V I/O’s
 Power
ARM®
Cortex-A8
• Dynamic Voltage and Frequency Scaling (DVFS)
• Standby Power: 0.1mW (600MHz ARM frequency)
• Up to 40% reduction in power
 Package
• CBP: 12x12mm, 0.4mm pitch, Package On
Package (POP)
• CBC: 14x14, 0.5mm POP
• CUS: 16x16mm 0.65mm pitch. Utilizes Via Channel™
Array technology with 0.8mm pitch plus design rules
 Core
•
•
•
•
Up to 800MHz C64x+ programmable DSP
Up to 1GHz Cortex-A8 with NEON™ coprocessor
3D graphics accelerator – up to 20M polygons/s
Up to 30% reduction in power
 Memory
• ARM: 32kB I-Cache; 32kB D-Cache; 256kB L2
• On Chip: 64kB SRAM; 112kB ROM
• External interfaces: LPDDR1 and NAND
C6000
C64x+
DSP
3D
Graphics
Accelerator
(3730)
DM3730/25
Processors
Display Subsystem
LCD
Controller
Video
Enc
10 bit DAC
10 bit DAC
Video
Processing Front 12-bit Video
Input
End
L3/L4 Interconnect
Connectivity
Serial Interface
Memory Interface
USB OTG
McBSP x5
LPDDR1
USB HS Host x3
MCSPI x4
MMC/SD/SDIO x3
I2C x3
HDQ/ 1-wire
Timers
UART x3
GP x12
UART w/ IrDA
WDT x2
Software Architecture – DM Devices
TI Embedded Processor Software Architecture
Framework/Middleware
3P SW/Codec
Boot Loader
Core Operating System
Services
Kernel
Drivers
ARM Processor
TI Codec
Code
Composer
IDE
BIOS
SDK
ARM
Development
Tools
Standard
Operating System App’s
DSP Link
Customer’s
DSP App
Codec Engine
Customer’s App
Drivers
DSP or HW Accelerator
= Industry Standard OS S/W Component – Free
= TI Provided Components - Free
= Customer, 3rd Party Code, or Open Source
SDK – Software Development Kit Available Free from TI
20
Davinci Key Metrics (Encode / HW)
DM6467T
DM6467
DM648
DM6437
DM6446
DM365
DM355
1080p60
H264
1
1
1080p(30fps)
-
-
-
1 1080p(12 fps)
-
720p/1080i60
H264/MPEG4
2
1
1 720p(22fps)
-
1 720p(15fps)
1
1 MPEG4
CIF H.264
20
16
10
4
4
8
-
D1 H.264
8
5
2
1
1
2
-
CIF MPEG4
20
16
14/18
7
8
8
8
D1 MPEG4
8
5
3/4
1
2
2
2
OV Video*
Analytic Ch
4
4
4/6
4
4
-
-
DSP C64x+
1GHz
594/729 MHz
720/900MHz
400/500/600/7
00 MHz
600MHz
-
-
ARM RISC
500MHz ARM9
300/365 MHz
ARM9
-
-
300MHz ARM9
300MHz ARM9
216MHz ARM9
Video Ports
2 16 bit
2 16 bit
5 16bit
2 8bit
2 8bit
3 10bit
1 10bit
CoProcessors
2 HD VICP
2D Graphics
Resizer
2 HD VICP
2D Graphics
Resizer
SD VICP
OSD
SD VICP
OSD
HD MPEG VICP
HD H.264 VICP
OSD
HD MPEG VICP
OSD
EMAC
GMII
GMII
2SGMII
Switch
MII
MII
MII
-
HDD Interface
PATA
PATA
-
-
PATA
-
-
33 MHz
33 MHz
66 MHz
33 MHz
-
-
-
Production
Now
Production
Now
Production
Now
Production
Now
Production
Now
Production
Now
Production
Now
PCI
Availability
21
Integra™ (DSP + ARM)
22
SITARA
INTEGRA
DAVINCI
Advanced GUIs &
Displays, Connectivity,
Video Acceleration
Advanced GUIs & Displays,
Connectivity,
Intensive Signal
Processing
INTEGRA
Advanced GUIs &
Displays, Connectivity
SITARA
ARM
• Point of Sale
• Portable Data Terminals
• Human Machine Interface
DSP
+
ARM
• Networked Audio
• Test and Measurement
• Power & Energy Management
• Industrial Vision & Control
DAVINCI
Video
Accelerators
+
DSP
+
ARM
• Networked Audio & Video
• Media Servers
• Video Security
• Video Conferencing
23
Integra (DSP + ARM®) Processor Roadmap
Production
Sampling
Development
Future
C6A816x
Key Features of Devices:
• Up to 1.5 GHz C674x
DSP
• Up to 1.5 GHz ARM
Cortex-A8
• 3D Graphics Engine
• 2x DDR3/DDR2
• 2x Gigabit EMAC, 2x
SATA, 2x PCIe, 2 USB
2.0
OMAP-L138
OMAP-L137
Key Features of Devices:
• 450 MHz C674x DSP
• 450 MHz ARM9
• 10/100 EMAC, SDRAM
• eHRPWM, eQEP, eCAP
• McASP, USB2.0
• Automotive grade
available
1H10
Key Features of Devices:
• 450 MHz C674x DSP
• 450 MHz ARM9
• uPP, SATA, PRU, LCD
I/F, USB 2.0, 10/100
EMAC, DDR2/mDDR
2H10
Speeds shown are for commercial temperature. Dates approximate initial samples. Not all peripherals shown.
• Fully programmable for customer
interface impl.
• Specialized data handling to offload
DSP
• Extends low power advantage
OMAP-L137 Processor Cores
Features
CPU Cores
 ARM926EJ-S™ (MPU) 300-450 MHz
 C674x DSP Core upto 300-450 MHz
 Programmable Real-Time Subsystem
(PRUSS) 150MHz x 2
DSP
Subsystem
ARM9
Subsystem
ARM
926EJ-S
CPU
C674x
DSP
Core
L1P 18K
L1D 18K
L1P 32K
L1D 32K
L2 256K
 Memory
PRU Subsystem
2x PRU
4K+4K Prog
512+512 Data
GPIOs
• Rich User Interface
• System Control Functions
• High Level OS Support:
- Linux, WinCE, VxWorks
Large
On-chip
Memory
VGA
LCD
LCD
Controller
128KB
RAM
 ARM:
Switched Central Resource (SCR) / EDMA
 16KB – L1 Program Cache
 16KB – L1 Data Cache
Peripherals
 DSP
Connectivity
Control Timers
 32KB – L1 Program Cache
10/
WD
MMC/SD
 32KB – L1 Data Cache 300+MHz:
USB
Timer eQEP eCAP PWM
USB2.0
100
HPI
(1)
1.1
(3)
(2)
(3)
(2)
EMAC Operations
 256KB – L2 SRAM
• Fixed- and Floating-Pt
 Shared On-chip
• 100% code compatibility w/C64x+
External Memory Interfaces
Serial Interfaces
 128KB RAM
and C67x+ platforms
EMIFA
EMIFB
 SDRAM
NAND /
SPI
McASP I2C
UART
SDRAM
(2)
(3)
(2)
(3)
32-bit
SDRAM
16-bit
On-Line Data Sheet and Collateral
25
• Fully programmable for customer
interface implementation
• Specialized data handling to offload
DSP
• Extends low power advantage
OMAP-L138
Processor Cores
• Rich User Interface
• System Control Functions
• High Level OS Support:
- Linux, WinCE
Features
CPU Cores
 ARM926EJ-S™ (MPU) 300-450 MHz
 C674x DSP Core upto 300-450 MHz
 Programmable Real-Time Subsystem
(PRUSS) 150MHz x 2
C674x
DSP
Core
ARM
926EJ-S
CPU
L1P 32K
L1D 32K
L2 256K
 Memory
PRU Subsystem
2x PRU
4K+4K Prog
512+512 Data
GPIOs
DSP
Subsystem
ARM9
Subsystem
LCD
Controller
Large
On-chip
Memory
uPP
(L1x8 Only)
Video I/O
(L1x8 Only)
128KB
RAM
 ARM:
Switched Central Resource (SCR) / EDMA
 16KB – L1 Program Cache
 16KB – L1 Data Cache
 DSP
Peripherals
Connectivity
System
 32KB – L1 Program Cache
300+MHz:
 32KB – L1 Data Cache
WD
USB
PWM
SATA
USB2.0
• Fixed- and Floating-Pt
UHPI Operations
EMAC (L1x8
Timer
Only)
 256KB – L2 SRAM
1.1
(3)
HS
•
100%
code
compatibility
w/C64x+
 Shared On-chip
and C67x+ platforms Serial Interfaces
Program/Data Storage
 128KB RAM
mDDR/
 mDDR, DDR2, SDRAM
Async
2
McBSP
MMC/SD
SPI
(2)
McASP
(L1x8
Only)
IC
(2)
UART
(3)
DDR2/
SDRAM
16-bit
EMIF
16-bit
(2)
On-Line Data Sheet and Collateral
26
New Integra™ DSP+ARM® processors –
Industry’s highest-performing floating DSP combined
with highest-performance ARM® Cortex™-A8
What’s new
C6A8168
Integra™
DSP+ARM
Ideal for applications requiring
C6A8167
Integra™
DSP+ARM
• Up to 1.5 GHz single-core floating- and
fixed-point DSP
• Up to 1.5 GHz ARM Cortex-A8
• Extreme integration for up to 50% BOM
cost reduction
• TI EZ SDK to ease development
• Intensive signal processing with high
precision floating-point operations
• Operating system support, such as
Linux, Windows® Compact Embedded®,
Android
• Advanced displays and 3D graphics
acceleration*
• Network connectivity and high speed
interfaces (PCIe Gen2, dual Gigabit
Ethernet, SATA)
Example applications
Machine/Industrial
Vision
High-end Test and
measurement
* 3D Graphics acceleration included in the C6A8168 Integra processor
Medical/Biological
Imaging
Tracking and
Control (Avionics)
27
C6A816x Integra™ DSP + ARM® Cortex-A8™
processor
Applications include:
Cores
• C674x™ Programmable, Floating/Fixed Point DSP Core
up to 1.5 GHz
• ARM® Cortex™-A8 (MPU) up to 1.5 GHz
• 3D Graphics Engine – up to 27M polygons/s (C6A8168
only)
• Display Subsystem – interface to multiple, simultaneous
HD displays
Memory
• ARM: 32KB L1I-Cache, 32KB L1 D-Cache, 256K L2
• DSP: 32KB L1I-Cache, 32KB L1 D-Cache, 256K L2
• External Interfaces: Two DDR3-1600 Controllers and
NAND
Machine Vision, Industrial Instruments, Tracking and
Control
C6A8168
Fixed/
Floating
point DSP
C674x
DSP
Core
ARM
Cortex™A8
Peripherals
Power
• Total Power – Typical 5-6W
PCIe
2
lanes
Pricing/Availability
• Samples/EVM now available
• Pricing
• TMDXEVM8168: $1895
• C6A816x, starting at $46 1ku
3D Graphics
Engine
LCD
Peripherals
• Gigabit EMAC x2
• USB 2.0 Ctlr/PHY x 2
• PCIe 2.0 – x1; Supports 2 lanes
• SATA 3.0Gbps supports 2 external drives
• HDMI 1.3 Tx
• SD/SDIO
• McASP x3, McBSP
• SPI, GPIO, I2C, UART, EMAC
Package
• 25x25, 0.65mm pitch, 1031 ball plastic BGA
• Via Channels enable low cost design rules -- 4 mil traces
and 10/20 mil escape vias
Display
ARM
microprocessor
On-Screen
Display
Resizer
Video I/O
SD DAC HD DAC
(x3)
(x3)
HDMI PHY
HDMI
HD Video I/O (x2)
Component
Composite
Video
Switched Central Resource (SCR)
McASP
x3
SPDIF
McBSP
I2C
x2
UART
x3
Speakers
Memory
Interfaces
DDR3
x2
SDIO
/SD
Async
EMIF/
NAND
SATA2
x2
HDD
SPI
USB
2.0
x2
GPIO
GMII
EMAC
x2
Internet
TI software reduces development time and
maximizes reuse
•
TI’s EZ Software Development Kit is FREE for
new C6A816x Integra™ processors (also works
for new AM389x Sitara™ MPUs), including:
– Operating systems (Linux®, Microsoft® Windows® CE,
Android™)
– Drivers for peripherals, connectivity and display
– Touch screen graphical application launcher
– Graphics development kit
– Example and graphics starter code
– and more
•
Additional FREE software in TI EZ SDK for
Integra DSP+ARM processors for easy
DSP development
– TI’s C6EZRun: Software to make DSP code
development/porting easier for ARM
programmers
– TI’s C6EZAccel: DSP software libraries
•
Supported by TI’s Code Composer
Studio™ Integrated Development
Environment
– Provides a shared programming interface
across TI processor families to minimize
learning curve
29
Summary
 Integra™ DSP+ARM® processors provide the best of





DSP and the best of ARM
For DSP customers, Integra offers the ability to add a
more rich, responsive user interface and high-level
applications to existing DSP-only designs
For ARM customers, Integra offers the ability to add
intelligence through the integrated DSP enabling a
new set of differentiated features compared to ARMonly products
Value line features the lowest power DSP+ARM
Performance line features the highest performance
single-core floating/fixed-point DSP+ARM
Software and tools are available today!
TI Confidential – NDA Restrictions
30
Backup
• Pin-compatible, software-compatible devices
• Making DSP easy for ARM developers
• Out-of-box demo showcasing C6A816x Integra™ generation features
31
Software/Pin compatible devices with C6A816x
Sitara™
AM389x
Integra™
C6A816x
DaVinci™
DM816x
Target
applications
• Single-board computing
• Network & Comms
Processing
• Industrial automation
• Human Machine Interface
• Interactive POS kiosks
• Machine/Industrial Vision
• High End Test and
Measurement
• Tracking and Control
• Medical/Biological Imaging
ARM®
ARM® Cortex™-A8
Up to 1.5 GHz
ARM® Cortex™-A8
Up to 1.5 GHz
ARM® Cortex™-A8
Up to 1.5 GHz
C674x DSP
Up to 1.5 GHz
C674x DSP
Up to 1.5 GHz
DSP
•
•
•
•
•
HD Video
Coprocessor
3D Graphics
Engine
Key
Peripherals
Video Security
Video Conferencing
Video Infrastructure
Media Server
Digital Signage
Up to1080p60
Enc/Dec X 3
Graphics
AM3894 only
GigEMAC x2
Graphics
C6A8168 only
Graphics
DM8168 only
EDMA x 4
USB2.0 H, D w/PHY x 2
SATA2.0 w/PHY x 2
DDR2/DDR3 up to 1.6 GHz
PCIe 2.0 w/PHY x2 lanes
HDMI Tx
Display Subsystem
SD/SDIO
HD Video Input x 2
Pin Compatible Across Family
OMAP-L1x/C674x Roadmap w/AM1x review
OMAP-L1x
FUTURE
OMAP-L1x  450 MHz ARM
Higher speed  450 MHz C674x
In Production
(C64x+/C67x+) DSP
7mW Standby
Sampling
 300MHz+ ARM926
 300MHz+ C674x
In Development
(C64x+/C67x+) DSP
OMAP-L138
Future
OMAP-L137
 300MHz+ ARM926
 300MHz+ C674x
AM1818
(C64x+/C67x+) DSP
Key Features:
• SDRAM
• 10/100 Ethernet MAC
• USB2.0 HS PHY
• USB1.1 FS PHY
• McASP
• LCD Controller
60mW Standby
 300 MHz ARM926
C6747/5
DSP
C67x
 DSP-Only
 BGA & TQFP
 DSP-Only
 $7.85 @1Ku
Additional Key Features:
• DVFS
• mDDR/DDR2/SDRAM
• SATA
• VPIF
• uPP
• McBSP
C6748/6/2  DSP-Only
Lowest power
DSP
 375MHz+ ARM926
 Audio CoP
AM1808/6
 375/450MHz ARM926
AM1707/5
 375/450MHz ARM926
C674x
FUTURE
C674x
Higher speed
C6000 DSPs
 $6.70 @ 1Ku (C6742)
C6743
DSP
Lowest power Floating-point DSPs in the industry
Time
33
Embedded processing portfolio
TI Embedded Processors
Microcontrollers (MCUs)
16-bit ultralow power
MCUs
32-bit
real-time
MCUs
MSP430™
C2000™
Delfino™
Piccolo™
ARM®-Based Processors
32-bit ARM®
MCUs
32-bit ARM®
MPUs
Digital Signal Processors (DSPs)
DSP
DSP+ARM®
Multi-core
DSPs
Ultra
Low power
DSPs
C6000™
C5000™
ARM® Cortex™-M3
ARM® Cortex™-A8
& ARM9
C6000™
C6000 + ARM®
DaVinci™
300 MHz to >1Ghz
+ Accelerator
Floating/fixed point
24,000
MMACS
Up to 300 MHz
+ Accelerator
®
Stellaris
Sitara™
Video processors
Up to
25 MHz
40 MHz to
300 MHz
Up to
80 MHz
Value line to
500 MHz
Perf. Line to 1GHz
Flash
1 KB to 256 KB
Flash, RAM
16 KB to 512 KB
Cache
RAM, ROM
USB, ENET,
PCIe, SATA, SPI,
McBSP, McASP
Up to 320 KB RAM
Up to 128 KB ROM
PWM, ADC,
CAN, SPI, I2C
Cache,
RAM, ROM
USB2.0, OTG,
CAN, PCIe,
EMAC, LPDDR1
Cache
RAM, ROM
Analog I/O, ADC
LCD, USB
Flash
64 KB to 256 KB
USB, ENET
MAC+PHY, CAN,
ADC, PWM, SPI
SRIO, EMAC
DMA, PCIe
USB, ADC
McBSP, SPI, I2C
Measurement,
sensing, general
purpose
Motor control,
digital power,
lighting, ren. energy
Motion control,
HMI, industrial
automation
Industrial computing,
POS & portable
data terminals
Video, audio, voice,
security,conferencing
Telecom test & meas,
media gateways,
base stations
Audio, voice,
medical,
biometrics
$0.25 to $9.00
$1.50 to $20.00
$1.00 to $8.00
$5.00 to $20.00
$5.00 to $200.00
$40 to $200.00
$3.00 to $10.00
Software & Dev. Tools
MPUs – Microprocessors
Multi Core DSP Portfolio
High Performance DSP Key Attributes
• High Performance Fixed, Floating pt:
• Power-Performance Leadership:
• Extended Temp Support:
• Long Product Lifecycle:
• Single Scalable Platform:
• Multi OS Support:
• Easy Development Environment:
• Application Software Libraries:
• 3rd Party Solutions
Up to 256GMAC, 128 GFLOP per DSP
Lowest Power for Performance in industry
-40 to 105C operation
10+ yrs, Reliability, Stability leadership
Family of DSP from 1-to-8 cores
Linux, BIOS, OSE
Multicore Platform Software, CCStudio
Wireless, Video, Speech, Medical, Imaging
Hardware Cards, IP, Complete Soft. Solutions
Multicore DSP
Fixed-pt multicore DSP available today
C6474: 3 C64x+ up to 1.2GHz (3.6GHz)
C6472: 6 C64x+ up to 700MHz (4.2GHz)
Voice solution DSP available today
TNETV3020: 6 C64x+ up to 700MHz (4.2GHz)
TNETV3010: 6 C55x up to 300MHz (1.8GHz)
Floating & Fixed-pt multicore DSP (future)
Roadmap: 4Q’2010 availability
C66xx: 2 or 4 or 8 C66x at 1GHz (8GHz)
TI Confidential – NDA Restrictions
Next-Gen Multi-Core DSP Solutions from TI
The Best Combination of Performance (GHz) and Power Consumption in the Industry
Available 1Q11
Next-Generation
C66x DSP Core
Cores Available Today
C64x Core
 Industry’s Lowest Power
Fixed-point DSP Core
C64xx
 Industry’s Highest
Performance DSP Core
 Current base for multi-core
Fixed
Point
product line
NEW
MultiCore
DSP
C66x
C67x Core
 Industry’s Lowest Power
Floating-point DSP Core
C67xx
 High precision and wide
dynamic range
 Easy and flexible programming
Floating
Point
Floating-point operation at the
industry’s fastest Fixed-point
speed of 10 GHz cumulative
(320GMACs / 160GFLOPs)
100% Code Compatible with all
C64x (fixed) & C67x (floating)
Devices and pin compatible to
C6478/4/2
Supported by a full set of
development Software, Tools
& Complier
New C66x Core Reduces Design Time
• C66x core supports Floating Point at full clock speed resulting in
20GFlops per core @ 1.25GHz
• Floating Point enables rapid algorithm prototyping and quick SW redesigns – no need for normalization and scaling
• Improves Performance
• Performs up to 4x faster than Fixed Point implementation
• Significantly reduces development and debug cycle time
~1 day
~3 months
Fixed-Point
Algorithm
(ASM, C, C++)
Floating-Point
Algorithm
(C or C++)
Natural development
starts with Floating point
Floating
point
DSP
Fixedpoint
DSP
Reduces Design Cycle Time
There is NO need to translate code from
Floating point to Fixed point
C6000™ Multicore Roadmap
Production
Sampling
Development
Future
C66xx
•
C6670
C6474
•
•
•
•
•
3 C64X+ core
1.2Ghz
AIF, sRIO
3MB of L2
VCP2, TCP2
65nm
C66xx
C6672
• 6 C64x+ cores at
700Mhz
• TSIP, DDR2,
RapidIO, 2xRGMII
• 5MB of L2
• 3.7w
• 1 C64x+ cores at
1.2 Ghz
• 2MB of L2
• RapidIO, EMIF64,
DDR2
• 90nm
Now
C6674
• 2 C66x core 1.25Gh
• 4 C66x core
• PCIe, TSIP, DDR3
1.25Ghz
RapidIO, SGMII
• PCIe, TSIP, DDR3
• 8MB of L2
C6678
RapidIO, SGMII
• Packet, crypto
co- core 1.25Ghz
• 8 C66x
• 8MB of L2
processor
• PCIe, TSIP,• DDR3
Packet, crypto co• 40nm
RapidIO, SGMII
processor
• 8MB of L2 • 40nm
• Packet, crypto coprocessor
• 40nm
C6472
C6455
•
• 4 C66x core
1.25Ghz
• AIF2, PCIe,
RapidIO 2.1
• 6MB of L2
• Packet, Crypto &
Comms accelerator
• 40nm
Multi-core DSP +
ARM @ 1.2Ghz
Focused Comms
accelerators
C6457
C6671
• 1 C64X+ Core at
1.2Ghz
• 2MB of memory
• RapidIO, DDR2
• 2x TCP2, VCP2
• 65nm
• 1 C66x core 1.25Ghz
• PCIe, TSIP, DDR3
RapidIO, SGMII
• 8MB of L2
• Packet, crypto coprocessor
• 40nm
• Multi C66xx core
@ 1.2Ghz each
• Power optimized
C66xx
• 1x C66xx core @
1.2Ghz
• Power optimized
1Q11
Speeds shown are for commercial temperature. Dates approximate initial samples. Not all peripherals shown.
Future
Product Highlights: C6670 and C6678
C6670
C6678
Communication Optimized Core
General Purpose Core

Next Generation C66x Core
- Up to 8 C66x Cores @ 1.0GHz - 1.25GHz
- Available Options: 2, 4, and 8 Core Devices
Memory Architecture
- 4MB Local L2/Core (1MB per Core)
- 2MB Multicore Shared Memory

Memory Architecture
- 4MB Local L2/Core (512KB per Core)
- 4MB Multicore Shared Memory
Peripherals & Accelerators
-RapidIO, OBSAI/CPRI, SGMII, PCIe, UART, SPI
-FFTc, VCP2, TCP3e, TCP3d, Packet & security accelerator

Peripherals & Accelerators
-RapidIO, TSIP, SGMII, PCIe, UART, SPI
-Packet & Security accelerator

Next Generation C66x Core
- 4 C66x Cores @ 1.0GHz - 1.2GHz


Multicore Navigator
Multicore Navigator
Crypto
Crypto
C66x core
Packet
Packet
Accelerator
Accelerator
L2
L2 Cache/
Cache/ RAM,
RAM, 1MB
1MB
FFTC
FFTC
x2
Memory System
System Elements
TCP3e
TCP3e
GigE
Switch
Switch
VCP2
VCP2
Shared Memory
4
4 MB
MB
x4
Debug
Debug
EDMA
SGMII
SGMIIx2
x2
40nm process node
Hyper
Link
Hyper
link
TI Confidential – NDA Restrictions
UART
UART
40nm
40nm process
process node
node
TSIP
TSIPx2
x2
Smart
Smart Reflex
Reflex
sRIO
sRIO x4
x4
Smart
Smart Reflex
Reflex
SGMII
SGMIIx2
x2
UART
UART
PCIe
PCIex2
x2
SPI
SPI
l2C
l2C
CPRI,OBSAI
CPRI,OBSAI
Sys Mon
Peripherals and I/O
Peripherals and I/O
sRIO
sRIO x4
x4
System Elements
Power
Power
Mgmt
GigE
GigE Switch
Switch
PCIe
PCIex2
x2
EDMA
EDMA
Multicore
Multicore Memory
Memory
Controller
SPI
SPI
Debug
Debug
x2
l2C
l2C
Power
Power Mgmt
Mgmt
Memory System
TCP3d
TCP3d
DDR-3
DDR-364b
64b
TeraNet
DDR-3
DDR-364b
64b
Shared
Shared Memory
Memory
2
2 MB
MB
TeraNet
L2 Cache/ RAM, 512 KB
Multicore
Multicore Memory
Memory
Controller
Sys
Sys Mon
Mon
Network
Network
Co-Processor
C66x core
Click Block Diagrams for Full Feature List
Power
Power Efficient
Efficient
C667x Device Comparison
C6670
C6672
C6674
C6678
1GHz, 1.2GHz
1GHz, 1.25GHz
1GHz, 1.25GHz
1GHz, 1.25GHz
Number of Cores
4
2
4
8
Fixed & Floating
Yes
Yes
Yes
Yes
153 GMAC / 76.8
GFLOPs
80GMAC / 40 GFLOPs
160GMAC / 80
GFLOPs
320 GMAC / 160
GFLOPs
32D/32P
32D/32P
32D/32P
32D/32P
1.0 MB
512kB
512kB
512kB
L2 Shared
2 MB
4 MB
4 MB
4 MB
DDR3 MHz
1600 MHz
1600 MHz
1600 MHz
1600 MHz
Yes
Yes
Yes
Yes
4x
4x
4x
4x
AIF 2 (OBSAI/CPRI)
Yes
No
No
No
TSIP
No
Yes
Yes
Yes
Security Co-processor
Yes/Optional
Yes/Optional
Yes/Optional
Yes/Optional
Network Co-processor
Yes
Yes
Yes
Yes
FEC Coprocessor
4x VCP; 2x TCP3d &
1x TCP3e
No
No
No
FFT Co-processor
2x
No
No
No
Yes
Yes
Yes
Yes
-40C to 100C
-40C to 100C
-40 to 100C
-40 to 100C
1Q2011
1Q2011
1Q2011
1Q2011
MHz per Core
Max GMACs / GFLOPs
L1 KB per core
L2 MB Dedicated per Core
SGMII EMAC x2, PCIE Gen
II x2, UART, SPI
Serial RapidIO 2.1
HyperLink
Temp Range
Samples Availability
TMX320C6678/4/2 Block Diagram
New C66x Core
– Up to 8 New C66x Cores @ 1GHz to 1.25GHz
– High Performance Fixed and Floating Point Cores
– 320 GMACs Theoretical across all 8 cores
– 160 GFLOPS Theoretical across all 8 cores

Memory System
Acceleration
– Crypto – IPSec ESP, AH Tunneling, SRTP, GSM/WCDMA/LTE
Air Interface Ciphering
– Packet Accelerator – Multiple IP Addr, 1Gbps @ 1.5M
packets/sec, UDP Checksum, QoS Support
Interfaces
– 4x RapidIO rev 2.1
– 2 10/100/1000 Mbps Ethernet SGMII ports w/ Embedded Switch
– PCIe Gen II single & double lanes
– TSIP x2, I2C, SPI, GPIO, UART
Technology
– Package- 24x24mm, 841 Pin (Full-array)
– CTools 4: Multicore debug and optimization Tech (System trace
& embedded trace buffer)
TeraNet
L2 Cache/ RAM, 512 KB
Multicore Memory
Controller
Shared Memory
4 MB
System Elements
Power
Mgmt
Sys Mon
Debug
EDMA
GigE Switch
Peripherals and I/O
Smart Reflex
SGMII x2

Memory Architecture
– 4MB Local L2/core – 512 KB/Core
– 4MB Multicore Shared Memory (MSM)
– Multicore Shared Memory Controller (MSMC)
– Boot ROM, DDR3-1600MHz (64-bit)
– Address Translation & ECC
UART

C66x core
DDR-3 64b

Network
Co-Processor
PCIe x2
Multi-Core Architecture
– Multicore Navigator
– HyperLink
– TeraNet
SPI

l2C
Low Power: 9W at 1Ghz nominal temp
– Various Power optimization techniques including Smart Reflex
TSIP x2

Multicore Navigator
sRIO x4

40nm process node
Power Efficient
Hyper
Link
Enhanced DSP core
Performance improvement
New C66x ISA
100% upward object code
compatible
4x performance
improvement for multiply
operation
32 16-bit MACs
Improved support for
complex arithmetic and
matrix computation
C674x
C67x+
C67x
2x registers
Native instructions
for IEEE 754,
SP&DP
Advanced VLIW
architecture
Enhanced floatingpoint add
capabilities
FLOATING-POINT VALUE
TI Confidential – NDA Restrictions
100% upward object code
compatible with C64x,
C64x+, C67x and c67x+
Best of fixed-point and
floating-point architecture
for better system
performance and faster
time-to-market.
C64x+
SPLOOP and 16bit instructions for
smaller code size
Flexible level one
memory
architecture
iDMA for rapid
data transfers
between local
memories
C64x
Advanced fixedpoint instructions
Four 16-bit or eight
8-bit MACs
Two-level cache
FIXED-POINT VALUE
42
C64x+ vs C66x comparison
C6474 / 6472
.D
.L
.D
.L
Register File
Register File
.S
.S
.M
16x16
MPY
16x16
MPY
16x16
MPY
16x16
MPY
.M
32b Crosspath
Register File
.S
.M
A
16 fixed multiplies per cycle (per side)
C66x
Float
C6670/2/4/8
.L
C64x+ multiplier unit contains four 16b multipliers (per side)
Adders
B
A
.D
• Increased Performance
• Fixed/Floating Unification
C64x+
Float
16x16
MPY
16x16
MPY
16x16
MPY
16x16
MPY
Register File
16x16
MPY
16x16
MPY
16x16
MPY
16x16
MPY
.S
16x16
MPY
16x16
MPY
16x16
MPY
16x16
MPY
16x16
MPY
16x16
MPY
16x16
MPY
16x16
MPY
.D
.L
.M
B
Float
64b Crosspath
TI Confidential – NDA Restrictions
Float
Adders
4 floating multiplies per cycle (per side)
.D - Data unit
 .M - Multiplier unit
 .L - Logical unit
 .S - Shifter unit
43
BDTIsimMARK2000TM
BDTI Score for Fixed Point Processors
BF5xx (Blackfin)
TS201S (TigerSHARC)
MSC81xx (SC140)
MSC814x (SC3400)
MSC815x/825x (SC3850)
TMS320C55x+
TMS320C62x
OMAP35x
TMS320C64x
TMS320C64X+
TMS320C66xx
0
2000
4000
6000
8000
10000
12000
14000
16000
18000
TI’s TMS320C667x Multicore DSP is the HIGHEST performing
Fixed Point DSP in the market
TI Confidential – NDA Restrictions
44
BDTIsimMARK2000TM
BDTI Score for Floating Point Processors
ADI 2116x (SHARC)
ADI 2126x (SHARC)
ADI 213xx (SHARC)
ADI TS201S (TigerSHARC)
ADI TS202S/203S (TigerSHARC)
Intell Pentium III
Renesas SH77xx (SH-4)
TMS320C67x
TMS320C66xx
0
2000
4000
6000
8000
10000
12000
TI’s TMS320C667x Multicore DSP is more then 2x the performance of the
nearest Floating Point DSP competitor in the market
TI Confidential – NDA Restrictions
45