Ferrite Products Inductors
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Ferrite Products Inductors KEMET - Taiyo Yuden Strategic Alliance • Key Dates January, 1997 • Initial business August, 2004 • Agree to formalize relationship September, 2005 • Strategic Alliance signed December 2006 • Inductor Launch • Alliance Purpose Better serve the industry Reduce costs Optimize capacity Increase market share Expand market penetration • Alliance Focus Best practices of each company in the fields of: Manufacturing Technology Marketing Customer Support BUSINESS CONFIDENTIAL • Each company has the right to market and sell the other’s products, thus mutually expanding their product portfolio for both current and future customers. • Each company will continue to offer independent and competitive pricing to the industry. The KEMET Advantage • Leading Edge Technology Higher inductance in smaller sizes Advanced material technology • High Quality Advanced processing Highest consistency • World leading KEMET service model Sales team with Distribution focus ETBF philosophy & tools Fast response Global Logistics Asia (no Japan) $1,222MM 48% Global Market Discreet Inductors $2,549MM Europe $504MM 20% Americas $287MM 11% Japan $491MM (19%) Global Market Share by Manufacturer $2,549MM market Other 18% Per Paumanok research TDK 20% FerroxCube (Yageo) 3% Panasonic 5% Murata 6% Sumida (Vogt) 16% EPCOS 8% Taiyo Yuden 11% TOKO 13% Products in the Market Thin Film Multi-Layer Chip Inductor Ferrite Beads Power Inductors Wirewound vertical chip Wirewound horizontal chip E Ferrite Core Through Hole Pot Ferrite Core Growth Markets • High Growth (Digital Markets) Wireless handsets Computer microprocessor Game consoles Flat panel HDTV • Steady Markets Automotive Telecom Infrastructure Power supplies Specialty markets Appliances Industrial Equipment Intel Dual Core Processor +25 inductors per unit MINITUARIZATION CONVERGENCE ELECTRO-MAGNETIC COMPATIBILITY (EMC) Growth Market Year Inductors Per Handset Percent Increase 1995 5 2000 18 250% 2006 48 167% 2011F 79 65% Driver = camera / MP3 player combo’s Transmitters OEM / POSRadio Customer Possibilities High Fr Power amps Beacons Ind cameras Control equip Comm / Power equip Voice Activated Systems NA/EU Typical End Markets Controls measurement Mobile Headsets Accessories Scanning pens metering Phone systems Infrastructure IT Infrastructure Network Security metering SMD Inductor Selection Inductors and Beads Filtering EMI Suppression Switching Regulator (Power Inductor) Conductive Noise (Chip Inductor) Matching Oscillation Radiate Noise (Chip Beads) Radio Frequency (Chip Inductor) Power Line Signal Line Power Line Signal Line CB, BR-series LB-series LBM-series FBMH-series BK-series HK-series Wire Wound Chip Type Wire Wound Wire Wound Wire Wound Multi-Layer Multi-Layer NR-series LBMF-series FBMJ-series BK**4*-series AQ, HKQ-series Wire Wound Monolithic Type Wire Wound Straight Wire Multi-Layer Multi-Layer (High-Q type) CKP-series CK-series LK-series BKP-series Multi-Layer Chip Type Multi-Layer Multi-Layer Multi-Layer BUSINESS CONFIDENTIAL Wire Wound Multi-Layer Strategic Direction Product Multi-layer & wirewound chip inductors & ferrite beads Power inductors, RF chip inductors for oscillation matching Primarily small to medium case sizes (0201 – 1210) Some market leading designs (HK, beads), strong technology / quality Price & Market 10:1 typical ratio (cap:ind) True design-in product, “tweaked in”, hard to lose Very few crosses Growing market due to EMI requirements + miniaturization Stable market pricing Promotion Sample system in place, kits in process Catalog & website update coming Automotive AEC-Q200 in 2008 New part number scheme coming KEY – DRIVE DESIGN-IN ACTIVITIES ! Inductors – Part Number Scheme* ML Inductors L Ind 0 4 0 2 C 1 N 0 S A B C Case Size (EIA) C/A Inductance T Series T/R (New codes) Tol Ferrite Beads Z 0 4 0 2 C 6 0 1 S A B C Bead Case Size (EIA) C/A Impedance T Series T/R (New codes) Material *Not finalized
