Mil/Aero Analog Surface Mount Products
General Description
Features
National Semiconductor’s Mil/Aero Analog Group offers a
large range of military qualified linear devices in surface
mount configurations. Hardware is available in two small,
hermetically sealed outlines: the Leadless Chip Carrier
(LCC) and the Ceramic Flatpak. Both rugged packages
meet the rigorous screening requirements of MIL-STD-883
and MIL-M-38510.
These packages are ideal in applications where space limitations require extremely small, light weight devices. In addition, their low profiles take up less total volume than traditional insertion devices, while lowering board cost because
plated through holes are eliminated. Up to 80% savings in
volume is possible.
The LCC has additional performance and cost benefits.
Since it does not have leads, component preparation prior
to assembly is not required and the system performance will
not reflect compensation for parasitic capacitances and inductances of leaded devices. Multilayer boards can be
used.
Y
Y
Y
Y
Op Amps, Buffers, Comparators, Voltage References,
Filters and Linear Regulators are available in surface
mount configurations
Same guaranteed performance as traditional leaded
packages
Substantial space, weight, and system cost savings
Available to either SMD or Slash Sheet, depending on
model
Applications
Y
Y
Y
Y
Y
Y
Avionics
Missiles, Torpedos
Sonobuoys
Phased Array Radars
Portable Communications
Airborne Electronic Counter Measures
TL/H/11305 – 1
20-Lead E Chip Carrier
TL/H/11305 – 39
10-Lead W Ceramic Flatpak Package
TL/H/11305 – 38
TL/H/11305 – 2
14-Lead W Flatpak Package
16-Lead F Ceramic Flatpak Package
TL/H/11305 – 41
TL/H/11305 – 40
44-Pin Leadless Chip Carrier
C1995 National Semiconductor Corporation
TL/H/11305
44-Pin Ceramic Flatpak
RRD-B30M115/Printed in U. S. A.
Mil/Aero Analog Surface Mount Products
March 1994
Outlines and Dimensions
Leadless Chip Carrier (LCC)
NS PACKAGE E (E20A)
MIL-M-38510 Package Code 2
MIL-STD-883 Package Code L
Ceramic Flatpak: 10-Pin
NS Package W (W10A)
MIL-STD-883 Package Code F
2
Outlines and Dimensions (Continued)
Ceramic Flatpak: 14-Pin
NS Package W (W14B)
MIL-M-38510 Package Code D
MIL-STD-883 Package Code F
Ceramic Flatpak: 16-Pin
NS Package F (F16B)
MIL-M-38510 Package Code F
MIL-STD-883 Package Code F
3
Outlines and Dimensions (Continued)
Leadless Chip Carrier (LCC): 44-Pin
NS Package (EL44A)
4
Ceramic Flatpak: 44-Pin
NS Package (WA44A)
5
Mil/Aero Surface Mount Package Types
Base P/N
Description
LH0002
LH2111
LM101/A
LM108/A
LM111
LM117
LM118
LM119
LM124/A
LM139/A
LM148
LM185B
LM1882
LM6118
LM613AM
LM6161
LM6162
LM6164
LM6165
LM709/A
LM710AM
LM711AM
LM723
LM741
LM747
LMF100A
LP2951
LM12458M
Current Amplifier
Dual Voltage Comparator
Uncompensated Op Amp
Precision Op Amp
Voltage Comparator
Adjustable Positive Regulator
High Speed Op Amp
High Speed Dual Comparator
Low Power Quad Op Amp
Low Power Quad Comparator
Quad Op Amp
Precision Voltage Reference
Video Generator
VIP, Dual Precision Op Amp
Super-BlockTM Amp/Comparator/Ref
VIP, High Speed Op Amp
VIP, High Speed Op Amp
VIP, High Speed Op Amp
VIP, High Speed Op Amp
General Purpose Op Amp
Differential Comparator
Dual Differential Comparator
Voltage Regulator
Compensated Op Amp
Dual Compensated Op Amp
Switched-Capacitor Filter
Micro-power Voltage Regulator
12-bit Self-Calibrated Data Acq. Sys.
LCC
Leadless
Chip Carrier
W
Flatpak
20-Lead
20-Lead
20-Lead
20-Lead
20-Lead
20-Lead
20-Lead
20-Lead
20-Lead
20-Lead
20-Lead
20-Lead
20-Lead
20-Lead
20-Lead
16-Pin
10-Pin
10-Pin
10-Pin
10-Pin
10-Pin
14-Pin
14-Pin
14-Pin
10-Pin
10-Pin
10-Pin
10-Pin
10-Pin
10-Pin
10-Pin
20-Lead
10-Pin
14-Pin
20-Lead
20-Lead
44-Lead*
*Package Types
D: Glass/Metal DIP
H: Small Multi-Lead Metal Can; TO-99, TO-100
J: Ceramic DIP
K: Large Multi-Lead Metal Can; TO-3
EL: Ceramic Quad J-bend
Super-BlockTM is a trademark of National Semiconductor Corporation.
6
44-Pin
Other
Mil/Aero
Packages*
H8
D16
H8, J8, J14
H8, J8, J14
H8, J8, J14
H3, K2
H8, J8, J14
H10, J14
J14
J14
J14
H2
J20
J8
J16
J8
J8
J8
J8
H8
H8, J14
H10, J14
H10, J14
H8, J8, J14
H10, J14
J20
H8, J8
Thermal Data
contribute to the devices dissipation capabilities. To aid in
design the following thermal information is provided:
Power dissipation of surface mount packages is dependent
on many design factors. Board material and thickness, pad
area and proximity to other heat generating components all
LCC
Leadless
Chip Carrier
ijC
(§ C/W)
ija
(§ C/W)
20-Lead
60
80
W
Flatpak
ijC
(§ C/W)
LH2111
14-Lead
TBD
185
LM101/A
10-Lead
26
233
10-Lead
21
225
10-Lead
24
231
Base P/N
LH0002
LM108/A
iaC
(§ C/W)
LM111
20-Lead
21
90
LM117
20-Lead
5
88
10-Lead
TBD
TBD
LM119
20-Lead
5
89
10-Lead
TBD
TBD
LH124/A
20-Lead
24
91
14-Lead
21
185
LM139/A
20-Lead
28
100
14-Lead
23
183
LM148
20-Lead
21
90
14-Lead
TBD
TBD
LM185B
20-Lead
25
100
LM1882
20-Lead
TBD
TBD
LM6118
20-Lead
12
80
LM613AM
20-Lead
15
83
LM6161
20-Lead
20
90
10-Lead
21
228
LM6162
20-Lead
20
90
10-Lead
21
228
LM6164
20-Lead
20
90
10-Lead
21
228
LM6165
20-Lead
20
90
235
LM118
10-Lead
21
LM709
10-Lead
TBD
243
LM709A
10-Lead
31
234
LM710AM
10-Lead
37
248
10-Lead
TBD
TBD
LM711AM
LM723
20-Lead
27
96
LM741
10-Lead
31
244
LM747
14-Lead
TBD
TBD
44-Pin
5.8
50
LMF100A
20-Lead
12
71
LP2951
20-Lead
24
95
LM12458
44-Lead*
3.5
70
7
Pad Geometries of the Leadless Chip Carrier
Unit: mm (inch)
TL/H/11305 – 3
Dimension A
Inches
mm
LCCÐ20 leads
0.430
10.9
8
Leadless Chip Carriers (LCC) Pinout Diagrams
LH0002E/883
LM111E/883
20-Lead LCC
Top View
20-Lead LCC
Top View
TL/H/11305 – 4
TL/H/11305 – 7
LM117E/883
LM119E/883, SMD 86014012A
20-Lead LCC
Top View
20-Lead LCC
Top View
TL/H/11305 – 9
TL/H/11305 – 8
9
Leadless Chip Carriers (LCC) Pinout Diagrams (Continued)
LM124E/883
LM124AE/883
LM139E/883
LM139AE/883
20-Lead LCC
Top View
20-Lead LCC
Top View
TL/H/11305–10
TL/H/11305 – 11
LM148E/883
LM185E-1.2/883
LM185E-2.5/883
LM185BE/883*
20-Lead LCC
Top View
20-Lead LCC
Top View
TL/H/11305–12
TL/H/11305 – 13
LM1882E/883
LM6118E/883, SMD 5962-9156501M2A
20-Lead LCC
Top View
20-Lead LCC
Top View
TL/H/11305 – 15
TL/H/11305–14
10
Leadless Chip Carriers (LCC) Pinout Diagrams (Continued)
LM6161E/883, SMD 5962-89621012X
LM6162E/883, SMD 5962-92165012X
LM6164E/883, SMD 5962-89624012X
LM6165E/883, SMD 5962-89625012X
LM613AME/883
20-Lead LCC
Top View
20-Lead LCC
Top View
TL/H/11305 – 16
TL/H/11305 – 17
LM723E/883
LMF100AE/883
20-Lead LCC
Top View
20-Lead LCC
Top View
TL/H/11305 – 19
TL/H/11305 – 20
LP2951E/883
20-Lead LCC
Top View
TL/H/11305 – 21
11
Flatpak Pinout Diagrams
LH2111F/883
LM101AW/883, JM38510/10103BHA, (JL101BHA)
LM101W/883
10-Lead Flatpak
Top View
16-Lead Flatpak
Top View
TL/H/11305 – 23
TL/H/11305 – 22
LM108W/883,
LM108AW/883, JM38510/10104BHA (JL108BHA)
LM111W/883, JM38510/10304BHA (JL111BHA)
10-Lead Flatpak
Top View
10-Lead Flatpak
Top View
TL/H/11305 – 24
TL/H/11305 – 25
JM38510/10107BHA (JL118BHA)
(LM118AW)
LM119W/883, 8601401HX
10-Lead Flatpak
Top View
10-Lead Flatpak
Top View
TL/H/11305 – 26
TL/H/11305 – 32
LM124W/883, JM38510/11005BDA (JL124BDA)
LM124AW/883, JM38510/11006BDA
LM139W/883, JM38510/11201BDA (JL139BDA)
14-Lead Flatpak
Top View
14-Lead Flatpak
Top View
TL/H/11305 – 27
TL/H/11305 – 28
12
Flatpak Pinout Diagrams (Continued)
JM38510/11001BDA (JL148BDA)
14-Lead Flatpak
Top View
LM6161W/883, SMD 5962-8962101HX
LM6162W/883, SMD 5962-9216501HX
LM6164W/883, SMD 5962-8962401HX
LM6165W/883, SMD 5962-8962501HX
10-Lead Flatpak
Top View
TL/H/11305 – 29
TL/H/11305 – 31
LM709W/883
LM709AW/883
LM710AMW/883, JM38510/10301BHA (JL710BHA)
10-Lead Flatpak
Top View
10-Lead Flatpak
Top View
TL/H/11305 – 34
TL/H/11305 – 33
LM711AMW/883
LM741W/883, JM38510/10101BHA (JL741BHA)
10-Lead Flatpak
Top View
10-Lead Flatpak
Top View
TL/H/11305 – 35
TL/H/11305 – 36
JM38510/10102BDA (JL747BDA)
14-Lead Flatpak
Top View
TL/H/11305 – 37
13
Mil/Aero Analog Surface Mount Products
Lit. Ý 110500
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