A Faus-Golfe,
A.
F
G lf J.V.
J V Civera,
Ci
C Blanch
C.
Bl h and
d J.J.
J J García-Garrigós
G í G i ó
whit the help of the CTF3 Collaboration
CTF3 meeting Jan-09
1
Contents
BPS prototypes
p
yp
BPS series production
Non-vacuum
Non
vacuum parts production
production.
Vacuum parts production.
PCBs manufacturing/validation and BPS
BPS’ parts
assembly.
BPS S
Supports.
t
Low frequency set-up & Characterization Tests.
High frequency set-up & Longitudinal Impedance Test
Summary & Production Schedule (Back-up solution)
CTF3 meeting Jan-09
2
TBL + BPM specifications
2 BPS prototypes
t t
has
h been
b
d
designed,
i
d
constructed and characterized.
TBL beam time structure
CTF3 meeting Jan-09
3
BPS: Characterization Table (PCB Ver.1)
BPS1 Sensitivity and Linearity Parameters
Vertical Sensitivity, SV
Horizontal Sensitivity, SH
Vertical Electric Offset, EOSV
Horizontal Electric Offset, EOSH
Vertical overall precision (accuracy), σV
Horizontal overall precision (accuracy), σH
BPS1 Characteristic Output Levels
Sum signal level, Σ
Difference signals max. levels, ||ΔV||max, ||ΔH||max
Centered beam level, Vsec (xV = 0, xH = 0)
BPS1 Frequency Response (Bandwidth) Parameters
Σ low cut-off frequency, fLΣ
Δ low cut-off frequency, fLΔ
Σ low cut-off
cut off frequency calibration,
calibration fLΣ [Cal]
Δ low cut-off frequency calibration, fLΔ [Cal]
High cut-off frequency, fhigh
High cut-off frequency calibration, fhigh [Cal]
BPS1 Pulse-Time Response Parameters
Σ droop time constant, τdroopΣ
Δ droop time constant, τdroopΔ
Σ droop time constant calibration
calibration, τdroopΣ [Cal]
Δ droop time constant calibration, τdroopΔ [Cal]
CTF3 meeting Jan-09
Rise time constant calibration, τrise
Rise time constant calibration, τrise [Cal]
41.09 mm-1
41.43 mm-1
0.03 mm
0.15 mm
78 μm
170 μm
16.5 V
8.25 V
4.125 V
1.76 KHz
282 KHz
1 76 KHz
1.76
180 KHz
> 100 MHz
> 100 MHz
90 μs
564 ns
90 μs
884 μs
< 1.6 ns
< 1.6 ns
4
BPS: Characterization Table (PCB Ver. 2)
BPS1 Sensitivity and Linearity Parameters
Vertical
V
i l Sensitivity,
S i i i SV
Horizontal Sensitivity, SH
Vertical Electric Offset, EOSV
Horizontal Electric Offset,, EOSH
Vertical overall precision (accuracy), σV
Horizontal overall precision (accuracy), σH
44.57
44
57 mm-11
50.0 mm-1
-0.14 mm
0.27 mm
61 μm
431 μm
BPS1 Characteristic Output Levels
Sum signal level, Σ
Difference signals max. levels, ||ΔV||max, ||ΔH||max
Centered beam level, Vsec (xV = 0, xH = 0)
BPS1 Frequency Response (Bandwidth) Parameters
Σ low cut-off frequency, fLΣ
Δ low cut-off frequency, fLΔ
Σ low cut-off frequency calibration, fLΣ [Cal]
Δ low cut-off frequency calibration, fLΔ [Cal]
High cut-off frequency, fhigh
High cut-off frequency calibration, fhigh [Cal]
BPS1 Pulse
Pulse-Time
Time Response Parameters
Σ droop time constant, τdroopΣ
Δ droop time constant, τdroopΔ
Σ droop time constant calibration, τdroopΣ [Cal]
Δ droop time constant calibration, τdroopΔ [Cal]
Rise time constant calibration, τrise
CTF3 meeting Jan-09
Rise time constant calibration, τrise [Cal]
10.5 V
5.25 V
2.625 V
1 KHz
175 KHz
0.709 KHz
79 KHz
> 100 MHz
> 100 MHz
159 μs
909 ns
224 μs
2 μs
< 1.6 ns
< 1.6 ns
5
BPS prototypes
• A set of two BPS prototypes (BPS1 and BPS2) with the associated
electronics were designed and constructed.
•The performed tests in BPS1 yield:
o Good linearity results and reasonably low electrical offsets from
the mechanical center.
center
o Good overall-precision/accuracy in the vertical plane
considering the low test current; and, a misalignement in the
h i
horizontal
t l plane
l
was detected
d t t d by
b accuracy offset
ff t and
d sensitivity
iti it
shift.
o Low frequency cut-off for Σ/electrodes signals, fLΣ, and high cutoff frequency, fhigh, under specifications.
o Low frequency cut-off for Δ signals, fLΔ, determined to perform
the compensation
p
of droop
p time constant, τdroopΔ, with the external
amplifier.
• BPS1 installed in TBL and BPS2 at IFIC
CTF3 meeting Jan-09
6
BPS prototypes
• Issues for improvement
p
in the BPS2 p
prototype:
yp
o correct the possible misalignments of the horizontal plane
electrodes suggested in the linearity error analysis
o check if overall
overall-precision
precision below 50μm (under TBL specs), with
enough wire current Æ New wire testbench at IFIC will allow
higher currents, accurate (anti-vibration and micro-movement
system) and automatized measurements.
measurements
o study the different low cut-off frequencies in the calibration,
fLΔ[Cal], and wire excitation cases, fLΔ
• Test Beam of the BPS1 in the TBLÆResolution at maximum
current.
CTF3 meeting Jan-09
7
BPS series
Q
Quantity:
tit 15 units
it (BPS1 +15
15 + 1 spare ffor ttesting)
ti )
BSP section view
- Paperwork and tendering process → week 37 (Sep 08)
- Main supply contracts signed → week 51 (Dec 08)
CTF3 meeting Jan-09
8
Non-Vacuum Parts Production
- Copper body, electrode and bridge
• Cu OFE p
procurement → week 5
(2009)
• Manufacturing and metrology →
week 12
• Flash gold platting → week 13
- Cu-Be
Cu Be screws
• Manufacturing and metrology →
week 12
• Flash
Fl h gold
ld platting
l tti → week
k 13
- Ferrites → week 5
- Steel split flange → week 12
- RF contacts → week 5
CTF3 meeting Jan-09
9
Vacuum Parts Production
- Ceramic with metallic collars brazed & vacuum tests → week 12
- Ti sputtering at CERN → week 14
- Welding
W ldi to
t bellow
b ll
and
d fl
flanges (EBW and
d TIG) and
d vacuum ttests
t → week
k 16
CTF3 meeting Jan-09
10
PCBs manufacturing/validation and BPS’ parts assembly
- BPS PCBs → week 9
• Manufacturing 40 PCBs and
components insertion
(Resistors and Transformers)
- PCB gold
ld plate
l t mounting
ti and
d
validation → week 10
• SMA connectors soldering with PCB
mounted on golden plate.
• PCB validation Test
- BPS Assembly process → week 18
• Integration and alignment of the nonvacuum and vacuum parts
parts, jointly with
PCBs mounted on golden plates.
CTF3 meeting Jan-09
11
BPS supports
- Materials procurement → week 5
- Manufacturing → week 10
- Fix
Fi alignment
li
t spheres
h
and
d make
k
the metrology at CERN
CTF3 meeting Jan-09
12
Low frequency set-up and Characterization Tests
- BPS testbench manufacturing and assembly → week 10
- BPS series (15 units) characterization tests → week 20
Bandwidth of interest: 1KHz – 200 MHz
VNA (10Hz – 300MHz) + PC Running LabVIEW
GPIB
Wire
V+, V-,
H+, H-
VNA
Cal +/-
ΔV
ΔH
Σ
XY + Rotatory stages Controller
Stages
g
Control Signals
XY + Rotatory
Motorized micro-movers
13
Pneumatic Isolation Workstation
Pulse Signal Generator
High frequency set-up & Longitudinal Impedance Test
- BPS HF testbench manufacturing and assembly → week 14
- Longitudinal impedance determination test.
Performed to BPS2 prototype → week 20
VNA (100MHz – 20GHz) + PC Running LabVIEW
Bandwidth of interest: 100MHz – 12 GHz
High Frequency testbench
VNA
Output signal
Input signal / Frequency sweep
CTF3 meeting Jan-09
14
Summary and Production Schedule
- Production of 15 BPS’s already started
started.
- LF & HF Test Set-ups.
- Supports.
Week # (2009)
1
2
3
4
5
6
7
8
9 10 11 12 13 14 15 16 17 18 19 20
Non-vacuum parts
Ceramics with collars
Ti sputtering (proposal)
Electronic PCB's
PCB s
BPS welding & integration
BPS supports
Metrology of supports at CERN
(proposal)
Low frequency setup
High frequency setup
BPS tests
(BPS2 + 2 units) could be delivered at week 12 using spares parts
from prototypes production
15