Datasheet

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ACNV2601
High Insulation Voltage 10MBd Digital Optocoupler
Data Sheet
Description
Features
The new ACNV2601 is an optically coupled gate that
combines a AlGaAs light emitting diode and an integrated
photo detector housed in a widebody package. The
distance-through-insulation (DTI) between the emitting
diode and photo-detector is at 2mm. The output of the
detector IC is an open collector Schottky clamped transistor. The internal shield provides a guaranteed common
mode transient immunity specification of 20 kV/μs at Vcm
= 1500V
• High Voltage Insulation with minimum 13mm creepage
and clearance
With creepage and clearance of greater than 13mm,
ACNV2601 is designed to provide high isolation voltage
(7500Vrms). It can withstand a continuous high working
voltage of 2262 Vpeak and a surge voltage of 12,000Vpeak,
meeting IEC60747-5-5, UL and CSA standard for reinforced
insulation. ACNV2601 provides the high insulation
voltage protection at a high data rate of 10MBd.
Functional Diagram
NC 1
10 Vcc
Anode 2
9 Ve
Cathode 3
8 Vo
NC 4
NC 5
7 GND
SHIELD
6 NC
Truth Table
(Positive Logic)
LED
On
Off
On
Off
On
Off
• 20 kV/μs Minimum Common Mode Rejection (CMR) at
VCM = 1500 V
• High Speed: 10 MBd Typical
• TTL Compatible
• Open Collector Output
• Guaranteed AC and DC performance over wide
temperature: -40°C to +105°C
• Available in 10-Pin widebody packages
• Safety Approval to be submitted for approval
– Approval at 7500Vrms for 1 minute per UL1577
–CSA
– IEC 60747-5-5, IEC/EN/DIN EN 60747-5-2 with Viorm =2262Vpeak
Applications
• High Voltage insulation
• Instrument input/output isolation
• Line receivers
• Ground loop elimination
• Isolation of high speed logic systems
• Microprocessor System Interfaces
ENABLE OUTPUT
H
H
L
L
NC
NC
L
H
H
H
L
H
A 0.1 μF bypass capacitor must be connected between
pins VCC and GND.
CAUTION: It is advised that normal static precautions be taken in handling and assembly
of this component to prevent damage and/or degradation which may be induced by ESD.
Ordering Information
ACNV2601 is UL recognized with 7500 Vrms for 1 minute per UL1577.
Option
Part number
RoHS
Compliant
ACNV2601
-000E
-300E
Package
Surface
Mount
Gull
Wing
500 mil
DIP-10
X
X
X
X
-500E
UL 7500 Vrms/ IEC 60747-5-5,
1 Minute
IEC/EN/DIN EN
rating
60747-5-2 Quantity
Tape
& Reel
X
X
X
35 per tube
X
X
35 per tube
X
X
500 per reel
To order, choose a part number from the part number column and combine with the desired option from the option
column to form an order entry.
Example 1:
ACNV2601-500E to order product of 500mil DIP-10 Widebody with Gull Wing Surface Mount package in Tape and
Reel packaging with both UL 7500Vrms/1min and IEC 60747-5-5, IEC/EN/DIN EN 60747-5-2 Safety Approval in RoHS
compliant.
Option datasheets are available. Contact your Avago sales representative or authorized distributor for information.
Schematic
IF
ICC
10
2+
IO
8
VF
–
3
SHIELD
IE
VE
9
7
VCC
VO
GND
Use of a 0.1µF bypass capacitor connected between pins of 7 and 10 is recommended (see note 5).
2
10-Pin Widebody (500mils) DIP Package
[13.71 ± 0.15]
0.540 ± 0.006
[11.01 ± 0.15]
0.433 ± 0.006
[11.01 ± 0.15]
0.433 ± 0.006
[3.10] 0.122
[3.90] 0.154
[0.51]
0.020 MIN
[1.998]
0.08
[1.30]
0.05
TYP
[5.25]
0.21
[13.01 ± 0.15]
0.512 ± 0.006
[5.25]
0.207
[13.06]
0.514
[1.78 ± 0.15]
0.070 ± 0.006
[0.48 ± 0.08]
0.019 ± 0.003
[2.54]
0.10
TYP
[0.25 +0.08
-0.05 ]
0.010 +0.003
-0.002
5° T Y
P
Dimensions in Inches [Millimeters]
10-Pin Widebody (500mils) DIP Package with Gull Wing Surface Mount Option 300
LAND PATTERN RECOMMENDATION
[11.01 ± 0.15]
0.433 ± 0.006
[16.35 ± 0.15]
0.644 ± 0.006
[2.29 ± 0.15]
0.090 ± 0.006
[14.90 ± 0.15]
0.587 ± 0.006
[1.30]
0.051
TYP
[13.01 ± 0.15]
0.512 ± 0.006
[5.25] MAX
0.207
[1.78 ± 0.15]
0.070 ± 0.006
[0.75 ± 0.15]
0.030 ± 0.006
[1.00 ± 0.15]
0.039 ± 0.006
Dimension in Inches [Millimeter]
3
[2.29 ± 0.15]
0.090 ± 0.006
[1.30 ± 0.15]
0.051 ± 0.006
[13.71 ± 0.15]
0.540 ± 0.006
[0.254 +0.076
-0.051 ]
0.010 +0.003
-0.002
OM
5° N
Solder Reflow Profile
Recommended reflow condition as per JEDEC Standard, J-STD-020 (latest revision). Non-Halide Flux should be used.
Insulation and Safety Related Specifications
Parameter
Symbol
ACNV2601
Units
Conditions
Minimum External Air Gap
(External Clearance)
L(101)
13
mm
Measured from input terminals to output terminals,
shortest distance through air.
Minimum External
Tracking (External Creepage)
L(102)
13
mm
Measured from input terminals to output terminals,
shortest distance path along body.
Minimum Internal Plastic Gap
(Internal Clearance)
2.0
mm
Through insulation distance conductor to conductor,
usually the straight line distance thickness between
the emitter and detector.
Minimum Internal Tracking
(Internal Creepage)
4.6
mm
Measured from input terminals to output terminals,
along internal cavity.
200
V
DIN IEC 112/VDE 0303 Part 1
Tracking Resistance
(Comparative Tracking Index)
CTI
Isolation Group
IIIa
Material Group (DIN VDE 0110, 1/89, Table 1)
IEC 60747-5-5, IEC/EN/DIN EN 60747-5-2 Insulation Characteristics*
Description
Symbol
Characteristic
Installation classification per DIN VDE 0110/1.89, Table 1
for rated mains voltage ≤ 600 Vrms
for rated mains voltage ≤ 1000 Vrms
I – IV
I – III
Climatic Classification
55/105/21
Pollution Degree (DIN VDE 0110/1.89)
Unit
2
Maximum Working Insulation Voltage
VIORM
2262
Vpeak
Input to Output Test Voltage, Method b*
VIORM x 1.875 = VPR, 100% Production Test with tm = 1 sec, Partial discharge < 5 pC
VPR
4241
Vpeak
Input to Output Test Voltage, Method a*
VIORM x 1.6 = VPR, Type and Sample Test, tm = 10 sec, Partial discharge < 5 pC
VPR
3619
Vpeak
Highest Allowable Overvoltage (Transient Overvoltage tini = 60 sec)
VIOTM
12000
Vpeak
Safety-limiting values – maximum values allowed in the event of a failure.
Case Temperature
Input Current**
Output Power**
TS
IS, INPUT
PS, OUTPUT
150
400
1
°C
mA
W
Insulation Resistance at TS, VIO = 500 V
RS
>109
Ω
* Refer to the optocoupler section of the Isolation and Control Components Designer’s Catalog, under Product Safety Regulations section, (IEC
60747-5-5, IEC/EN/DIN EN 60747-5-2) for a detailed description of Method a and Method b partial discharge test profiles.
** Refer to the following figure for dependence of PS and IS on ambient temperature.
4
Absolute Maximum Ratings
Parameter
Symbol
Min.
Max.
Units
Storage Temperature
TS
-55
125
°C
Operating Temperature
TA
-40
105
°C
Average Input Current
IF(AVG)
20
mA
Reverse Input Voltage
VR
3
V
Input Power Dissipation
PI
40
mW
Supply Voltage (1 Minute Maximum)
VCC
7
V
Enable Input Voltage (Not to Exceed VCC by more than 500mV)
VE
VCC+0.5
V
Enable Input Current
IE
5
mA
Output Collector Current
IO
50
mA
Output Collector Voltage
VO
7
V
Output Collector Power Dissipation
PO
85
mW
Lead Solder Temperature
TLS
245°C for 10 sec,
up to seat plane
Recommended Operating Conditions
Parameter
Symbol
Min.
Max.
Units
Input Current, Low Level
Input Current, High Level
IFL*
0
250
µA
IFH**
9
16
mA
Power Supply Voltage
VCC
4.5
5.5
V
Low Level Enable Voltage
VEL
0
0.8
V
High Level Enable Voltage
VEH
2.0
VCC
V
Operating Temperature
TA
- 40
105
°C
Fan Out (at RL = 1k Ω)
N
5
TTL Loads
Output Pull-up Resistor
RL
4k
Ω
330
Note
1
* The off condition can also be guaranteed by ensuring that VFL ≤0.8volts.
** The initial switching threshold is 8mA or less. It is recommended that 9mA to 16mA be used for best performance and to permit at least a 20% LED
degradation guardband.
5
Electrical Specifications (DC)
Over recommended operating conditions unless otherwise specified. All typicals at VCC = 5 V, TA = 25°C.
Parameter
Symbol
High Level Output Current
Min.
Typ.
Max.
Units
Test Conditions
IOH
5.5
100
µA
VCC = 5.5 V, VE = 2.0V
VO = 5.5 V, IFL = 250 µA
Input Threshold Current
ITH
3.5
8
mA
VCC = 5.5 V, VE = 2.0V,
VO = 0.6 V, IOL > 13 mA
1, 2
12
Low Level Output Voltage
VOL
0.35
0.6
V
VCC = 5.5 V, VE = 2.0V,
IF = 8 mA, IOL(Sinking) = 13 mA
1, 2,
3, 4
12
High Level Supply Current
ICCH
7.0
12
mA
VE = 0.5V
6.5
Low Level Supply Current
ICCL
9.0
VE = VCC
13
mA
8.5
High Level Enable Current
IEH
Low Level Enable Current
IEL
High Level Enable Voltage
VEH
Low Level Enable Voltage
VEL
Input Forward Voltage
VF
Input Reverse Breakdown
Voltage
BVR
Input Capacitance
CIN
Input Diode Temperature
Coefficient
ΔVF/ΔTA
VCC = 5.5 V, VE = 2.0V
-0.9
mA
VCC = 5.5 V, VE = 0.5V
mA
VCC = 5.5 V, VE = 2.0V
0.8
mA
VCC = 5.5 V, VE = 0.5V
1.85
V
TA = 25°C
V
IR = 100 µA, TA = 25°C
60
pF
f = 1 MHz, VF = 0 V
-1.9
mV/°C
IF = 10 mA
IF = 10 mA
2.05
5
12
VCC = 5.5 V,
IF = 10 mA
mA
1.64
Note
VCC = 5.5 V,
IF = 0 mA
-0.7
1.2
6
VE = VCC
2.0
1.25
VE = 0.5V
Fig.
12
5
Switching Specifications (AC)
Over recommended temperature (TA = -40°C to 105°C), VCC = 5 V, IF = 10mA unless otherwise specified. All typicals are
at TA = 25°C, VCC = 5V.
Parameter
Symbol
Min.
Typ.
Max.
Units
Test Conditions
Propagation Delay Time to
High Output Level
tPLH
30
50
80
ns
TA = 25°C
Propagation Delay Time to
Low Output Level
tPHL
ns
TA = 25°C
Pulse Width Distortion
|tPHL - tPLH|
40
ns
RL = 350 Ω,
CL = 15 pF
Propagation Delay Skew
tpsk
50
ns
Output Rise Time (10%-90%)
Tr
120
35
55
80
Fig.
RL = 350Ω,
CL = 15 pF
Note
6, 7, 8 3, 12
4,12
120
5
25
ns
6, 7,
8, 9
6, 12
5, 6,
12
10
12
10
12
Output Fall Time (10%-90%)
Tf
10
ns
Propagation Delay Time of
Enable from VEH to VEL
tELH
30
ns
RL = 350 Ω, CL = 15 pF,
VEL = 0V, VEH = 3V
11, 12 7
Propagation Delay Time of
Enable from VEL to VEH
tEHL
20
ns
RL = 350 Ω, CL = 15 pF,
VEL = 0V, VEH = 3V
11, 12 8
Output High Level Common
Mode Transient Immunity
|CMH|
20
25
kV/µs
VCC = 5 V, IF = 0 mA,
VO(MIN) = 2 V, RL = 350 Ω,
TA = 25°C, VCM = 1500 V
13
Output Low Level Common
Mode Transient Immunity
|CML|
20
25
kV/µs
VCC = 5 V, IF = 10 mA,
VO(MAX) = 0.8 V, RL = 350 Ω,
TA = 25°C, VCM = 1500 V
Parameter
Symbol
Min.
Typ.
Units
Test Conditions
Input-Output Insulation
VISO
7500
Vrms
RH < 50% for 1 min.
TA = 25°C
13, 14
Input-Output Resistance
RI-O
1012
Ω
VI-O = 500 V
13
Input-Output Capacitance
CI-O
pF
f = 1 MHz, TA = 25°C
13
9, 11,
12
10, 11,
12
All typicals at TA = 25°C.
0.5
Max.
0.6
Fig.
Note
Notes:
1. Peaking circuits may produce transient input currents up to 50mA, 50ns maximum pulse width, provided average current does not exceed 20mA.
2. By passing of power supply line is required, with a 0.1µF ceramic disc capacitor adjacent to each optocoupler as illustrated in Figure 15. Total lead
length between both ends of the capacitor and the isolator pins should ot exceed 20mm.
3. The tPLH propagation delay is measured from the 5 mA point on the falling edge of the input pulse to the 1.5 V point on the rising edge of the
output pulse.
4. The tPHL propagation delay is measured from the 5 mA point on the rising edge of the input pulse to the 1.5 V point on the falling edge of the
output pulse.
5. tPSK is equal to the worst case difference in tPHL and/or tPLH that will be seen between units at any given temperature and specified test
conditions.
6. See application section titled “Propagation Delay, Pulse-Width Distortion and Propagation Delay Skew” for more information.
7. The tELH enable propagation delay is measured from the 1.5 V point on the falling edge of the enable input pulse to the 1.5 V point on the rising
edge of the output pulse.
8. The tEHL enable propagation delay is measured from the 1.5 V point on the rising edge of the enable input pulse to the 1.5 V point on the falling
edge of the output pulse.
9. CMH is the maximum tolerable rate of rise of the common mode voltage to assure that the output will remain in a high logic state (i.e., VO > 2.0 V).
10.CML is the maximum tolerable rate of fall of the common mode voltage to assure that the output will remain in a low logic state (i.e., VO < 0.8 V).
11.For sinusoidal voltages, (|dVCM | / dt)max = πfCMVCM(p-p).
12.No external pull up is required for a high logic state on the enable input. If the VE pin is not used, tying VE to VCC will result in improved CMR
performance.
13.Device considered a two-terminal device: pins 1, 2, 3, 4 and 5 shorted together, and pins 6, 7, 8, 9 and 10 shorted together.
14.In accordance with UL1577, each optocoupler is proof tested by applying an insulation test voltage ≥ 9000 Vrms for one second (leakage detection
current limit, II-O ≤ 5 μA). This test is performed before the 100% production test for partial discharge (Method b) shown in the IEC 60747-5-5, IEC/
EN/DIN EN 60747-5-2 Insulation Characteristics Table, if applicable.
7
6
6
VO - OUTPUT VOLTAGE - V
5
ITH - INPUT THRESHOLD CURRENT - mA
VCC = 5V
TA = 25°C
4
RL = 350 Ω
3
RL = 1k Ω
2
RL = 4k Ω
1
0
0
1
2
3
4
IF - FORWARD INPUT VOLTAGE - mA
0.6
0.5
I0 = 16 mA
IOL - LOW LEVEL OUTPUT CURRENT - mA
VOL - Low Level Output Voltage - V
VCC = 5.5 V
VE = 2.0 V
IF = 8.0 mA
0.7
I0 = 13 mA
0.4
0.3
0.2
I0 = 9.6 mA
0.1
-60
-40
I0 = 6.4 mA
-20
0
20
40
TA - TEMPERATURE - °C
60
80
100
120
1
VCC = 5.0 V
VE = 0.6 V
-60
-40
-20
0
20
40
60
TA - TEMPERATURE - °C
80
100
120
100.000
10.000
1.000
0.100
0.010
0.001
TA = 25°C
1.2
1.3
1.4
1.5
1.6
VF - FORWARD VOLTAGE - V
Figure 5. Typical input diode forward characteristic.
VCC = 5.5 V
VE = 2.0 V
VOL = 0.6 V
60
IF = 14-16 mA
50
40
IF = 10 mA
IF = 8 mA
30
20
-60
-40
-20
0
20
40
60
TA - TEMPERATURE - °C
80
Figure 4. Typical low level output current vs. temperature.
1000.000
IF - FORWARD CURRENT - mA
2
70
Figure 3. Typical low level output voltage vs. temperature.
8
RL = 350 Ω, 1k Ω, 4k Ω
3
Figure 2. Typical input threshold current vs. temperature.
0.8
0
4
0
5
Figure 1. Typical output voltage vs. forward input voltage current.
5
1.7
1.8
100
120
+5 V
IF
PULSE GEN.
ZO = 50Ω
tf = tr = 5 ns
INPUT
MONITORING
NODE
RM
1
10
2
9
3
8
4
7
SHIELD
5
0.1µF
BYPASS
*CL IS APPROXIMATELY 15 pF WHICH INCLUDES
PROBE AND STRAY WIRING CAPACITANCE.
RL
OUTPUT VO
MONITORING
NODE
*CL
IF = 10 mA
IF = 5 mA
INPUT
IF
tPHL
tPLH
OUTPUT
VO
6
1.5 V
Figure 6. Test circuit for tPHL and tPLH
90
VCC = 5.0 V
TA = 25°C
90
tPLH, RL = 4kΩ
80
tp - PROPAGATION DELAY - ns
tp - PROPAGATION DELAY - ns
100
70
tPLH, RL = 1kΩ
60
tPHL, RL = 350Ω
50
40
tPLH, RL = 350Ω
30
20
-60
-40
-20
tPHL, RL = 1kΩ
4kΩ
0
20
40
60
TA - TEMPERATURE - °C
80
100
40
35
30
25
20
15
10
5
0
-5
-10
50
tPHL, RL = 1kΩ
40
8
9
tPHL, RL = 4kΩ
10
11
12
13
IF - PULSE INPUT CURRENT - mA
14
15
300
RL = 4kΩ
250
VCC = 5.0 V
IF = 10.0 mA
RL = 350Ω
-60
-40
-20
RL = 1kΩ
0
20
40
60
TA - TEMPERATURE - °C
Figure 9. Typical pulse width distortion vs. temperature.
9
tPLH, RL = 350Ω
tPLH, RL = 1kΩ
tPHL, RL = 350Ω
60
Figure 8. Typical propagation delay vs. pulse input current.
tr, tf - RISE,FALL TIME - ns
PWD - PULSE WIDTH DISTORTION - ns
Figure 7. Typical propagation delay vs. temperature.
VCC = 5.0 V
TA = 25°C
70
30
120
tPLH, RL = 4kΩ
80
80
100
120
RL = 4kΩ
200
tRISE
tFALL
VCC = 5.0 V
IF = 10.0 mA
150
100
RL = 1kΩ
50
0
RL = 350Ω
-60
-40
-20
RL = 350Ω, 1kΩ, 4kΩ
0
20
40
60
TA - TEMPERATURE - °C
Figure 10. Typical rise and fall time vs. temperature.
80
100
120
PULSE GEN.
ZO = 50Ω
tf = tr = 5 ns
INPUT VE
MONITORING NODE
+5 V
10 mA
IF
1
10
2
9
3
8
4
SHIELD
5
7
0.1µF
BYPASS
*CL
RL
3.0 V
1.5 V
INPUT
VE
OUTPUT VO
MONITORING
NODE
tEHL
tELH
OUTPUT
VO
6
*CL IS APPROXIMATELY 15 pF WHICH INCLUDES
PROBE AND STRAY WIRING CAPACITANCE.
Figure 11. Test circuit for tEHL and tELH.
tE - ENABLE PROPAGATION DELAY - ns
100
VCC = 5.0 V
VEH = 3.0 V
VEL = 3.0 V
tELH, RL = 4kΩ
IF = 10.0 mA
80
60
tELH, RL = 1kΩ
40
tELH, RL = 350Ω
20
tELH, RL = 350Ω, 1kΩ, 4kΩ
0
-60
-40
-20
0
20
40
60
TA - TEMPERATURE - °C
80
Figure 12. Typical enable propagation delay vs. temperature.
10
100
120
1.5 V
SINGLE CHANNEL
IF
B
A
VFF
1
10
2
9
3
8
4
SHIELD
5
+5 V
0.1 µF
BYPASS
7
RL
OUTPUT VO
MONITORING
NODE
VCM
6
VO
VCM
+
–
PULSE
GENERATOR
ZO = 50 Ω
VO
VCM (PEAK)
0V
= 0 mA
5 V SWITCH AT A: IF
0.5 V
VO (MIN.)
SWITCH AT B: IF = 10 mA
VO (MAX.)
OUTPUT POWER - PS, INPUT CURRENT - IS
Figure 13. Test circuit for common mode transient immunity and typical waveforms.
1100
1000
900
800
700
600
500
400
300
200
100
0
PS (mW)
IS (mA)
0
25
50
75
100
125
Ts - CASE TEMPERATURE - °C
150
175
Figure 14. Thermal derating curve, dependence of safety limiting value with
case temperature per IEC 60747-5-5, IEC/EN/DIN EN 60747-5-2.
GND BUS (BACK)
VCC BUS (FRONT)
NC
0.1
µF
NC
NC
ENABLE
OUTPUT
NC
10 mm MAX.
(SEE NOTE 5)
SINGLE CHANNEL
DEVICE ILLUSTRATED.
Figure 15. Recommended printed circuit board layout.
For product information and a complete list of distributors, please go to our web site:
www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2011 Avago Technologies. All rights reserved.
AV02-2456EN - August 31, 2011
CMH
CML
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