Review Questions
What are the characteristics of throughhole and surface mount components?
Name some of the common types of
through-hole and surface mount
components.
Describe the basic processes for solder
paste application, component placement
and reflow soldering.
Why is x-ray equipment required to
visually inspect BGA solder joints?
Explain the three steps involved in the
wave soldering operation.
DVD-153C
Review Questions (cont’d)
What is a double-sided mixed technology
assembly?
Discuss the purpose of adhesive
application.
What types of circuit board assemblies do
not require cleaning?
What types of circuit board assemblies
require conformal coating?
Explain the difference between in-circuit
and functional testing.
DVD-153C
Review Questions (cont’d)
What types of materials are used for wire
insulation?
Why do many wire harness assemblies
have wire insulation of different colors?
What are the two most common methods
for terminating wires in a harness?
What is the purpose of tinning wires?
Explain the function of tying wires.
What occurs during final system
assembly, or box build?
DVD-153C