Dr. George Metze
Senior Electrical Engineer
and Program Director
Laboratory of Physical Sciences
College Park, Maryland, 20740
National Science Foundation
Directorate for Engineering
Directorate for Geosciences
Office of Polar Programs
Dear NSF Smart Sensor Networks Program:
I am writing to strongly express my support for the proposed work by Dr. Neil Goldsman
and his colleagues on millimeter scale integrated smart sensor networks. We at the
Laboratory of Physical Sciences (LPS) have worked with Dr. Goldsman’s group for
several years, and have been consistently impressed with the high level of creativity,
rigor and intellectual ability of the group. We have collaborated in detail with Goldsman
and his colleagues on our 3D Integration program. In this program we are developing the
process, the software, and the circuits for 3-dimensional integrated circuit development.
We feel that small smart sensor networks are an ideal application for 3D IC integration,
since it facilitates for the incorporation of various systems on the same chip. We will
continue to work with Dr. Goldsman’s group in our 3D integration process. Our
laboratory will support his effort in designing and fabricating 3D IC’s for the
development of small smart sensors. We will continue to make arrangements for Dr.
Goldsman’s group members to have access to our considerable processing and test
equipment at the LPS.
Thank you.
Sincerely,
George Metze