`
Lu Yu (Jack)
A.W. Smith Building
Case Western Reserve University
Cleveland, OH 44106
Phone: 216.262.2900
Email: lxy156@case.edu; yulujack@gmail.com
Education
Case Western Reserve University
Ph.D. in Chemical Engineering (GPA: 3.8/4.0)
M.S. in Chemical Engineering (GPA: 3.7/4.0)
Cleveland, Ohio
Expected 2016
Graduated: May 2014
Xiamen University
B.S. in Chemical Engineering (GPA:3.7/4.0)
B.S. in Economics (GPA:3.5/4.0)
Xiamen, China
Graduated: Jul 2011
Graduated: Jul 2011
Research and Industry Experience
Thesis Research, Case Western Reserve University
Cleveland, OH
Electrochemical Materials Fabrication Laboratory
Aug 2012 - Present
 Developed an electroless electrolyte for sub-5 nm copper film deposition on ruthenium
 Developed an electrochemical technique for measuring copper surface coverage on ruthenium
 Developed an electroless electrolyte for deposition of copper-manganese alloy for self-forming barrier
technology in semiconductor interconnect metallization
 Knowledge of semiconductor wafer processing, electrochemistry and copper diffusion barriers
Research Assistant, Xiamen University
Xiamen, China
Polymerization Engineering Laboratory
Aug 2011 - July 2012
 Synthesized stable gold nanoparticles in aqueous solution using a novel polymer template
 Published a paper on effect of solvents and polymer concentration on gold nanoparticle size
Undergraduate Graduation Project, Xiamen University
Xiamen, China
Electrochemistry and Surface Engineering Laboratory
Aug 2010 - July 2012
 Developed a fluoride-free process for electroless nickel-boron deposition on magnesium
 Studied effect of additives and annealing on properties of electroless nickel-boron films
 Assisted PhD students and published two papers on electroless nickel deposition
Fujian Petrochemical Group
Sanming, China
Sanming Chemical Industrial Co., Ltd
July 2010
 Visiting practice to further understand the chemical synthesis process in industry (ammonia synthesis)
Fujian Textile and Chemical Fiber Group Co., Ltd
 Visiting practice and learned production process of PVC via acetylene route
Yong’an, China
Oct 2009
Journal Publications
 K. Venkatraman, R. Gusley, L. Yu, Y. Dordi and R. Akolkar, “Electrochemical Atomic Layer Deposition of
Copper: A Novel Lead-free Process Mediated by Underpotentially Deposited Zinc”, Journal of the
Electrochemical Society, under review.
 L. Yu, Z. Vashaei, F. Ernst and R. Akolkar, “Electroless Deposition of Cu-Mn for Applications in Semiconductor
Interconnect Metallization”, Journal of the Electrochemical Society, submitting.
 L. Yu and R. Akolkar, “Communication - Underpotential Deposition of Lead for Investigating the Early Stages
of Electroless Copper Deposition on Ruthenium”, Journal of the Electrochemical Society, 163(2016)
D247-D249.
 A. Miller, L. Yu, J. Blickensderfer and R. Akolkar, “Electroless Copper Metallization of Glass Substrates
Mediated by Solution-Phase Deposition of Adhesion-Promoting Layers”, Journal of the Electrochemical Society,
162 (2015) D630-D634.
 L. Yu, L. Guo, R. Preisser and R. Akolkar, “Autocatalysis during Electroless Copper Deposition using Glyoxylic
Acid as Reducing Agent”, Journal of the Electrochemical Society, 160 (2013) D3004-3008.
 L. Yu, J. J. Qiu, H. Cheng and Z. H. Luo, “Facile Preparation of Gold Nanoparticles Using the Self-Assembled
ABC Non-Amphiphilic Fluorosilicone Triblock Copolymer Template”, Material Chemistry and Physics, 2-3
(2013) 780.
 Z. C. Wang, L. Yu, F. Jia and G. L. Song, “Effect of Additives and Heat Treatment on the Formation and
Performance of Electroless Nickel-Boron on AZ91D Magnesium Alloys”, Journal of the Electrochemical
Society, 159 (2012) D406-D412.
 Z. C. Wang, F. Jia, L. Yu, Z. B. Qi and G. L. Song, “Direct Electroless Nickel-Boron Plating on AZ91D
Magnesium Alloy”, Surface & Coatings Technology, 206 (2012) 3676-3685.
Abstracts, Presentations and Book Chapters
 L. Yu and R. Akolkar, “Development and Characterization of Electroless Copper Deposition Processes for
Next-Generation Semiconductor Interconnect Applications”, 2015 Fall AIChE Meeting, Salt Lake City, US.
(abstract+Presentation).
 Z. Vashaei, F. Ernst, L. Yu and R. Akolkar, “Characterization of Electroless Deposited Cu and Cu-Alloy Films
Using High-Resolution Electron Microscopy”, Research Showcase at CWRU, April 2015 (abstract).
 L. Yu and R. Akolkar, “Electroless Deposition of Cu-Mn Alloy”, 226th Electrochemical Society Meeting,
Cancun, Mexico (abstract+Presentation).
 L. Yu, L. Guo, R. Preisser and R. Akolkar, “Mechanistic Study of Autocatalysis during Electroless Copper
Deposition”, 224th Electrochemical Society Meeting, San Francisco, US (abstract+Presentation).
 Z. C. Wang, F. Jia, L. Yu and Z. B. Qi, “Deposition Mechanism of Electroless Ni-B Plating on Magnesium Alloy
with Zinc Immersion Pretreatment”, 221st Electrochemical Society Meeting, Seattle, US (abstract).
 Z. C. Wang, L. Yu, Z. B. Qi and G. L. Song, “ Electroless nickel-boron Plating to Improve the Corrosion
Resistance of Magnesium (Mg) Alloy”, Corrosion Prevention of Magnesium Alloys, Edited by C. L. Song,
Woodhead Publishing Lit., Chapter 13, 370-392, 2013.
Awards and Honors
 Invited reviewer for journal of RSC Advances. Since 2016.
 226th Electrochemical Society Student Travel Grant. 2014.
 Excellent Student Scholarship of Xiamen University. 2011.
 Merit Student of Chemical Engineering Department in Xiamen University. 2010.
 Top 10 Student Scholarship of Chemical Engineering Department in Xiamen University. 2010.
 Best 10 Annual Volunteers of Chemical Engineering Department in Xiamen University. 2010.
 21st Century Cup National English Speaking Contest-3rd Prize in Provincial Final. 2009.
Technical Skills
 Research Skills: Electroanalytical techniques in copper electrodeposition/electroless systems; Scanning Electron
Microscope; Inductively Coupled Plasma; Ultraviolet–visible Spectroscopy
 Computer Skills: Microsoft Office; Mathematica; Photoshop; COMSOL; Matlab